Proceedings of the Tenth International Conference on Chemical Vapor Deposition, 1987 PDF Download
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Author: Electrochemical Society. High Temperature Materials Division
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 1296
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Book Description
Author: Electrochemical Society. High Temperature Materials Division
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 1296
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Book Description
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 1437744885
Category : Technology & Engineering
Languages : en
Pages : 459
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Book Description
Handbook of Chemical Vapor Deposition: Principles, Technology and Applications provides information pertinent to the fundamental aspects of chemical vapor deposition. This book discusses the applications of chemical vapor deposition, which is a relatively flexible technology that can accommodate many variations. Organized into 12 chapters, this book begins with an overview of the theoretical examination of the chemical vapor deposition process. This text then describes the major chemical reactions and reviews the chemical vapor deposition systems and equipment used in research and production. Other chapters consider the materials deposited by chemical vapor deposition. This book discusses as well the potential applications of chemical vapor deposition in semiconductors and electronics. The final chapter deals with ion implantation as a major process in the fabrication of semiconductors. This book is a valuable resource for scientists, engineers, and students. Production and marketing managers and suppliers of equipment, materials, and services will also find this book useful.
Author: McD. Robinson
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 828
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Book Description
Author: Mac E. Van Valkenburg
Publisher: Newnes
ISBN: 9780750672917
Category : Technology & Engineering
Languages : en
Pages : 1696
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Book Description
This standard handbook for engineers covers the fundamentals, theory and applications of radio, electronics, computers, and communications equipment. It provides information on essential, need-to-know topics without heavy emphasis on complicated mathematics. It is a "must-have" for every engineer who requires electrical, electronics, and communications data. Featured in this updated version is coverage on intellectual property and patents, probability and design, antennas, power electronics, rectifiers, power supplies, and properties of materials. Useful information on units, constants and conversion factors, active filter design, antennas, integrated circuits, surface acoustic wave design, and digital signal processing is also included. This work also offers new knowledge in the fields of satellite technology, space communication, microwave science, telecommunication, global positioning systems, frequency data, and radar.
Author:
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 440
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Book Description
Author: Massachusetts Institute of Technology
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 448
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Book Description
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 1437778747
Category : Technology & Engineering
Languages : en
Pages : 411
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Book Description
The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films. - A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications - Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries - The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics - Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM - Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned 'Moore's Law' relating to the technology development cycle in the semiconductor industry
Author:
Publisher: Elsevier
ISBN: 0080541003
Category : Science
Languages : en
Pages : 514
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Book Description
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded.
Author:
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 1294
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Book Description
Author:
Publisher:
ISBN:
Category : Physics
Languages : en
Pages : 1420
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Book Description
