Author: Louay A. Eldada
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 272

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Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 382

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Author: Ray T. Chen
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 378

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Author: Davis H. Hartman
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 196

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Author:
Publisher:
ISBN:
Category : Optical communications
Languages : en
Pages : 382

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Author: Alan R. Mickelson
Publisher: Wiley-Interscience
ISBN: 9780471111887
Category : Technology & Engineering
Languages : en
Pages : 0

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Book Description
The missing link in a dynamically growing field--a state-of-the-artreference on optoelectronic packaging The rapidly expanding field of packaging for optoelectronic deviceschallenges electrical engineers with a host of complex and dauntingproblems. The increasing intricacy of assemblage compounds thethorny interconnection issues associated with electronicpackaging-how to assemble an array with many elements efficientlywhile maintaining thermal tolerance and simultaneously overcomingthe ensuing modulation problems that generate electrical noise.Adding to these problems has been the absence, until now, of asingle authoritative reference on the subject. Optoelectronic Packaging is the first and only comprehensivesourcebook on optoelectronic assembly techniques. Foroptoelectronic packaging experts and professionals in adjuncttechnologies, it provides an overview of today's state-of-the-arttechnologies, packages now on the drawing board, and the futuredirection of packaging types. For the novice, it lays down thefundamentals of optics and packaging. This incomparable textfeatures contributions from hands-on practitioners and,supplemented with extensive illustrations, it * Covers detector, semiconductor laser, and optical amplifierpackaging * Discusses waveguide technologies, free-space interconnects, andhybrid technologies * Examines communication system interconnection structure andfiber-optic networks in telecommunications * Explores array device packaging and flip-chip assembly for smartpixel arrays * Includes case studies of packaged subassemblies

Author: Horst Zimmermann
Publisher: Springer Science & Business Media
ISBN: 3662040182
Category : Science
Languages : en
Pages : 338

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Book Description
The book covers the entire topic from the basics of optoelectronics, device physics of photodetectors and light emitters, simulation of photodetectors, and technological aspects of optoelectronic integration in microelectronics to circuit aspects and practical applications. It summarizes the state of the art in integrated silicon optoelectronics and reviews recent publications on this topic. Results of basic research on silicon light emitters are included as well, while published results are compared with each other and with the work of the author.

Author:
Publisher:
ISBN:
Category : Electronic circuit design
Languages : en
Pages : 0

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Author: M. Jamal Deen
Publisher: The Electrochemical Society
ISBN: 9781566773706
Category : Technology & Engineering
Languages : en
Pages : 452

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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1220

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