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Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
Get Book Here
Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Rajiv Kohli
Publisher: Elsevier
ISBN: 0815516851
Category : Science
Languages : en
Pages : 1209
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Book Description
Surface contamination is of cardinal importance in a host of technologies and industries, ranging from microelectronics to optics to automotive to biomedical. Thus, the need to understand the causes of surface contamination and their removal is very patent. Generally speaking, there are two broad categories of surface contaminants: film-type and particulates. In the world of shrinking dimensions, such as the ever-decreasing size of microelectronic devices, there is an intensified need to understand the behavior of nanoscale particles and to devise ways to remove them to an acceptable level. Particles which were functionally innocuous a few years ago are ôkiller defectsö today, with serious implications for yield and reliability of the components. This book addresses the sources, detection, characterization and removal of both kinds of contaminants, as well as ways to prevent surfaces from being contaminated. A number of techniques to monitor the level of cleanliness are also discussed. Special emphasis is placed on the behaviour of nanoscale particles. The book is amply referenced and profusely illustrated.• Excellent reference for a host of technologies and industries ranging from microelectronics to optics to automotive to biomedical.• A single source document addressing everything from the sources of contamination to their removal and prevention.• Amply referenced and profusely illustrated.
Author: T. Hattori
Publisher: The Electrochemical Society
ISBN: 1607688190
Category :
Languages : en
Pages : 268
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Book Description
Author: K. L. Mittal
Publisher: John Wiley & Sons
ISBN: 1118831543
Category : Technology & Engineering
Languages : en
Pages : 482
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Book Description
The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments. Among the topics to be covered include: 1. Fundamentals of surface forces in particle adhesion and removal. 2. Mechanisms of particle adhesion and removal. 3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) to understand particle-particle and particle-substrate interactions. 4. Mechanics of adhesion of micro- and nanoscale particles. 5. Various factors affecting particle adhesion to a variety of substrates. 6. Surface modification techniques to modulate particle adhesion. 7. Various cleaning methods (both wet & dry) for particle removal. 8. Relevance of particle adhesion in a host of technologies ranging from simple to ultra-sophisticated.
Author: Rajiv Kohli
Publisher: William Andrew
ISBN: 0323312705
Category : Technology & Engineering
Languages : en
Pages : 898
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Book Description
Developments in Surface Contamination and Cleaning, Vol. 1: Fundamentals and Applied Aspects, Second Edition, provides an excellent source of information on alternative cleaning techniques and methods for characterization of surface contamination and validation. Each volume in this series contains a particular topical focus, covering the key techniques and recent developments in the area. This volume forms the heart of the series, covering the fundamentals and application aspects, characterization of surface contaminants, and methods for removal of surface contamination. In addition, new cleaning techniques effective at smaller scales are considered and employed for removal where conventional cleaning techniques fail, along with new cleaning techniques for molecular contaminants. The Volume is edited by the leading experts in small particle surface contamination and cleaning, providing an invaluable reference for researchers and engineers in R&D, manufacturing, quality control, and procurement specification in a multitude of industries such as aerospace, automotive, biomedical, defense, energy, manufacturing, microelectronics, optics and xerography. - Provides best-practice guidance for scientists and engineers engaged in surface cleaning or those who handle the consequences of surface contamination - Addresses the continuing trends of shrinking device size and contamination vulnerability in a range of industries as spearheaded by the semiconductor industry - Presents state-of-the-art survey information on precision cleaning and characterization methods as written by a team of world-class experts in the field
Author: Andrei S. Dukhin
Publisher: Elsevier
ISBN: 0444536221
Category : Technology & Engineering
Languages : en
Pages : 518
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Book Description
Two key words define the scope of this book: 'ultrasound' and 'colloids'. Historically, there has been little real communication between practitioners in these two fields. Although there is a large body of literature devoted to ultrasound phenomenon in colloids, there is little recognition that such phenomena may be of real importance for both the development and applications of colloid science. On the other side, colloid scientists have not embraced acoustics as an important tool for characterizing colloids. The lack of any serious dialogue between these scientific fields is the biggest motivation behind this book. - Covers in detail this multidisciplinary field combining acoustics, electroacoustics, colloid science, analytical chemistry and rheology - Provides a bibliography with more than 1,000 references - Presents theories and their experimental verification, as well as analysis of the methods and hardware pertaining to applications such as pharmaceuticals, ceramics, and polymers
Author: Yuzhuo Li
Publisher: John Wiley & Sons
ISBN: 0471719196
Category : Technology & Engineering
Languages : en
Pages : 764
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Book Description
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Author: Joseph M. Steigerwald
Publisher: John Wiley & Sons
ISBN: 3527617752
Category : Science
Languages : en
Pages : 337
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Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author: Ingegard Johansson
Publisher: Elsevier
ISBN: 0080555535
Category : Science
Languages : en
Pages : 994
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Book Description
The focus of Handbook for Cleaning/Decontamination of Surfaces lies on cleaning and decontamination of surfaces and solid matter, hard as well as soft. Bringing together in a 2-volume reference source: - current knowledge of the physico-chemical fundamentals underlying the cleaning process; - the different needs for cleaning and how these needs are met by various types of cleaning processes and cleaning agents, including novel approaches; - how to test that cleaning has taken place and to what extent; - the effects of cleaning on the environment; - future trends in cleaning and decontamination, for example the idea of changing surfaces, to hinder the absorbance of dirt and thus make cleaning easier.A brief introduction is given to the legal demands concerning the environment and a historical background, in terms of development of detergents, from soaps to the modern sophisticated formulations. Bactericides, their use and the environmental demands on them are covered. Thorough discussions of mechanisms for cleaning are given in several chapters, both general basic concepts and special cases like particle cleaning and cleaning using microemulsion concepts.* General understanding of how cleaning works, function of ingredients and formulations * Overview of environmental issues and demands from the society in the area * Gives basic formulas for cleaning preparations in most areas
