Multi-Chip Module Test Strategies PDF Download
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Author: Yervant Zorian
Publisher: Springer Science & Business Media
ISBN: 1461561078
Category : Technology & Engineering
Languages : en
Pages : 161
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Book Description
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Author: Yervant Zorian
Publisher: Springer Science & Business Media
ISBN: 1461561078
Category : Technology & Engineering
Languages : en
Pages : 161
Get Book Here
Book Description
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Author: Daryl Ann Doane
Publisher: Springer Science & Business Media
ISBN: 1461531004
Category : Computers
Languages : en
Pages : 895
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Book Description
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Author: John H. Lau
Publisher: Springer Science & Business Media
ISBN: 9780442014414
Category : Computers
Languages : en
Pages : 584
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Book Description
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 592
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Book Description
Author: M. Bushnell
Publisher: Springer Science & Business Media
ISBN: 0306470403
Category : Technology & Engineering
Languages : en
Pages : 690
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Book Description
The modern electronic testing has a forty year history. Test professionals hold some fairly large conferences and numerous workshops, have a journal, and there are over one hundred books on testing. Still, a full course on testing is offered only at a few universities, mostly by professors who have a research interest in this area. Apparently, most professors would not have taken a course on electronic testing when they were students. Other than the computer engineering curriculum being too crowded, the major reason cited for the absence of a course on electronic testing is the lack of a suitable textbook. For VLSI the foundation was provided by semiconductor device techn- ogy, circuit design, and electronic testing. In a computer engineering curriculum, therefore, it is necessary that foundations should be taught before applications. The field of VLSI has expanded to systems-on-a-chip, which include digital, memory, and mixed-signalsubsystems. To our knowledge this is the first textbook to cover all three types of electronic circuits. We have written this textbook for an undergraduate “foundations” course on electronic testing. Obviously, it is too voluminous for a one-semester course and a teacher will have to select from the topics. We did not restrict such freedom because the selection may depend upon the individual expertise and interests. Besides, there is merit in having a larger book that will retain its usefulness for the owner even after the completion of the course. With equal tenacity, we address the needs of three other groups of readers.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 440
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Book Description
Author: Ricardo A. Reis
Publisher: Springer
ISBN: 0387353119
Category : Computers
Languages : en
Pages : 569
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Book Description
This book contains the papers that have been presented at the ninth Very Large Scale Integrated Systems conference VLSI'97 that is organized biannually by IFIP Working Group 10.5. It took place at Hotel Serra Azul, in Gramado Brazil from 26-30 August 1997. Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble and Tokyo. The papers in this book report on all aspects of importance to the design of the current and future integrated systems. The current trend towards the realization of versatile Systems-on-a-Chip require attention of embedded hardware/software systems, dedicated ASIC hardware, sensors and actuators, mixed analog/digital design, video and image processing, low power battery operation and wireless communication. The papers as presented in Jhis book have been organized in two tracks, where one is dealing with VLSI System Design and Applications and the other presents VLSI Design Methods and CAD. The following topics are addressed: VLSI System Design and Applications Track • VLSI for Video and Image Processing. • Microsystem and Mixed-mode design. • Communication And Memory System Design • Cow-voltage & Low-power Analog Circuits. • High Speed Circuit Techniques • Application Specific DSP Architectures. VLSI Design Methods and CAD Track • Specification and Simulation at System Level. • Synthesis and Technology Mapping. • CAD Techniques for Low-Power Design. • Physical Design Issues in Sub-micron Technologies. • Architectural Design and Synthesis. • Testing in Complex Mixed Analog and Digital Systems.
Author: Naveed A. Sherwani
Publisher: Wiley-Interscience
ISBN:
Category : Computers
Languages : en
Pages : 352
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Book Description
Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.
Author: IEEE
Publisher:
ISBN:
Category :
Languages : en
Pages : 210
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Book Description
Author: Phil Marcoux
Publisher: Springer Science & Business Media
ISBN: 1461535328
Category : Technology & Engineering
Languages : en
Pages : 351
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Book Description
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
