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Author: X.J. Fan
Publisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573
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Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author: X.J. Fan
Publisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573
Get Book Here
Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author: Xuejun Fan
Publisher: Springer
ISBN: 9781441957207
Category : Technology & Engineering
Languages : en
Pages : 558
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Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author: Frank Suli
Publisher: Woodhead Publishing
ISBN: 008102391X
Category : Technology & Engineering
Languages : en
Pages : 490
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Book Description
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Author:
Publisher: ASM International
ISBN: 0871708043
Category : Technology & Engineering
Languages : en
Pages : 813
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Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author: Wallace R. Blischke
Publisher: John Wiley & Sons
ISBN: 0471458732
Category : Mathematics
Languages : en
Pages : 691
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Book Description
Introducing a groundbreaking companion book to a bestselling reliability text Reliability is one of the most important characteristics defining the quality of a product or system, both for the manufacturer and the purchaser. One achieves high reliability through careful monitoring of design, materials and other input, production, quality assurance efforts, ongoing maintenance, and a variety of related decisions and activities. All of these factors must be considered in determining the costs of production, purchase, and ownership of a product. Case Studies in Reliability and Maintenance serves as a valuable addition to the current literature on the subject of reliability by bridging the gap between theory and application. Conceived during the preparation of the editors' earlier work, Reliability: Modeling, Prediction, and Optimization (Wiley, 2000), this new volume features twenty-six actual case studies written by top experts in their fields, each illustrating exactly how reliability models are applied. A valuable companion book to Reliability: Modeling, Prediction, and Optimization, or any other textbook on the subject, the book features: * Case studies from fields such as aerospace, automotive, mining, electronics, power plants, dikes, computer software, weapons, photocopiers, industrial furnaces, granite building cladding, chemistry, and aircraft engines * A logical organization according to the life cycle of a product or system * A unified format of discussion enhanced by tools, techniques, and models for drawing one's own conclusions * Pertinent exercises for reinforcement of ideas Of equal value to both students of reliability theory as well as professionals in industry, Case Studies in Reliability and Maintenance should be required reading for anyone seeking to understand how reliability and maintenance issues can be addressed and resolved in the real world.
Author: Bankim Chandra Ray
Publisher: Woodhead Publishing
ISBN: 012818955X
Category : Technology & Engineering
Languages : en
Pages : 252
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Book Description
Micro and Nanophased Polymeric Composites: Durability Assessment in Engineering Applications provides a comprehensive review of in-service environmental damage and degradation studies of FRP composites in a broad range of different applications. End-users such as academic and industrial researchers and materials scientists and engineers working in the design, analysis, and manufacture of composite material systems will be able to identify the possible superior advantages and limitations of FRP composites in various applications. Particular emphasis is given on the identification of various failure micro-mechanisms leading to unprecedented failure in different harsh and hostile environments.Divided into two distinct parts, the first section focuses on fundamentals, with key chapters on the main constituents of FRP composites, mechanical properties, characterization techniques, and processing and fabrication techniques. Part two focuses on polymer composites under different in-service applications, including the marine and space environment, chemical and corrosive environments, high and low temperature environments, and other critical environments. - Covers various micro-mechanisms of failure under different environmental conditions, including moisture diffusion kinetics and the effects of aging parameters on microstructures - Discusses the impact of different nanoscale reinforcements on the environmental durability of conventional FRP composites - Presents a comprehensive approach with widespread applications such as low earth orbit space environments and different corrosive environments
Author: Zengtao Chen
Publisher: Springer Nature
ISBN: 3030252019
Category : Science
Languages : en
Pages : 313
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Book Description
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.
Author: Bankim Chandra Ray
Publisher: CRC Press
ISBN: 0429013949
Category : Technology & Engineering
Languages : en
Pages : 168
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Book Description
This book emphasizes the scientific origin of deformation and damage of FRP composites under various environmental effects and analyses present understanding on degradation mechanisms, role of interfaces and addition of nanofillers Discusses micro-characterization of composites and interfaces, also includes micro-mechanisms and microscopic evidences to establish the structure-property correlation Elucidates advantages and limitations of FRP composites in supercritical applications
Author: Thomas Moore
Publisher: Elsevier
ISBN: 1483292347
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Author: Christoph Brabec
Publisher: John Wiley & Sons
ISBN: 3527656936
Category : Technology & Engineering
Languages : en
Pages : 766
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Book Description
The versatility of organic photovoltaics is already well known and this completely revised, updated, and enlarged edition of a classic provides an up-to-date overview of this hot topic. The proven structure of the successful first edition, divided into the three key aspects of successful device design: materials, device physics, and manufacturing technologies, has been retained. Important aspects such as printing technologies, substrates, and electrode systems are covered. The result is a balanced, comprehensive text on the fundamentals as well as the latest results in the area that will set R&D trends for years to come. With its combination of both academic and commercial technological views, this is an optimal source of information for scientists, engineers, and graduate students already actively working in this field, and looking for comprehensive summaries on specific topics.
