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Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562
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Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562
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Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author: Madhusudan Iyengar
Publisher: World Scientific
ISBN: 9811279381
Category : Technology & Engineering
Languages : en
Pages : 479
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Book Description
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9401110905
Category : Technology & Engineering
Languages : en
Pages : 953
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Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author: Kang Li
Publisher: Springer Science & Business Media
ISBN: 3642156142
Category : Computers
Languages : en
Pages : 736
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Book Description
The 2010 International Conference on Life System Modeling and Simulation (LSMS 2010) and the 2010 International Conference on Intelligent Computing for Sustainable Energy and Environment (ICSEE 2010) were formed to bring together researchers and practitioners in the fields of life system modeling/simulation and intelligent computing applied to worldwide sustainable energy and environmental applications. A life system is a broad concept, covering both micro and macro components ra- ing from cells, tissues and organs across to organisms and ecological niches. To c- prehend and predict the complex behavior of even a simple life system can be - tremely difficult using conventional approaches. To meet this challenge, a variety of new theories and methodologies have emerged in recent years on life system modeling and simulation. Along with improved understanding of the behavior of biological systems, novel intelligent computing paradigms and techniques have emerged to h- dle complicated real-world problems and applications. In particular, intelligent c- puting approaches have been valuable in the design and development of systems and facilities for achieving sustainable energy and a sustainable environment, the two most challenging issues currently facing humanity. The two LSMS 2010 and ICSEE 2010 conferences served as an important platform for synergizing these two research streams.
Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 246
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Book Description
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
ISBN: 1789848385
Category : Science
Languages : en
Pages : 154
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Book Description
Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.
Author: Madhusudan Iyengar
Publisher: World Scientific
ISBN: 9814579807
Category : Technology & Engineering
Languages : en
Pages : 471
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Book Description
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Author: Krishnan Murugesan
Publisher: CRC Press
ISBN: 1000610632
Category : Science
Languages : en
Pages : 279
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Book Description
This textbook comprehensively covers the fundamentals behind mathematical modeling of engineering problems to obtain the required solution. It comprehensively discusses modeling concepts through conservation principles with a proper blending of mathematical expressions. The text discusses the basics of governing equations in algebraic and differential forms and examines the importance of mathematics as a tool in modeling. It covers important topics including modeling of heat transfer problems, modeling of flow problems, modeling advection-diffusion problems and Navier-Stokes equations in depth. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. The textbook is primarily written for senior undergraduate and graduate students in the field of mechanical engineering for courses on modeling and simulation. The textbook will be accompanied by teaching resource including a solution manual for the instructors.
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
ISBN: 9535124056
Category : Computers
Languages : en
Pages : 184
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Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Author: United States. Dept. of Commerce. Office of Technical Services
Publisher:
ISBN:
Category :
Languages : en
Pages : 850
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Book Description
