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Author: Tan Tran Duc
Publisher: GRIN Verlag
ISBN: 3640249593
Category : Technology & Engineering
Languages : en
Pages : 83
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Book Description
Diploma Thesis from the year 2005 in the subject Electrotechnology, grade: Master 9.8/10, , language: English, abstract: Microelectromechanical systems (MEMS) are collection of microsensors and actuators that have the ability to sense its environment and react to changes in that environment with the use of a microcircuit control. They also include the conventional microelectronics packaging, integrating antenna structures for command signals into microelectromechanical structures for desired sensing and actuating functions. The system may also need micropower supply, microrelay, and microsignal processing units. Microcomponents make the system faster, more reliable, cheaper, and capable of incorporating more complex functions. In the beginning of 1990s, MEMS appeared with the aid of the development of integrated circuit fabrication processes, in which sensors, actuators, and control functions are co-fabricated in silicon [1]. Since then, remarkable research progresses have been achieved in MEMS under the strong promotions from both government and industries. In addition to the commercialization of some less integrated MEMS devices, such as microaccelerometers, inkjet printer head, micromirrors for projection, etc., the concepts and feasibility of more complex MEMS devices have been proposed and demonstrated for the applications in such varied fields as microfluidics, aerospace, biomedical, chemical analysis, wireless communications, data storage, display, optics, etc. Some branches of MEMS, appearing as microoptoelectromechanical systems (MOEMS), micro total analysis systems, etc., have attracted a great research since their potential applications’ market.
Author: Tan Tran Duc
Publisher: GRIN Verlag
ISBN: 3640249593
Category : Technology & Engineering
Languages : en
Pages : 83
Get Book Here
Book Description
Diploma Thesis from the year 2005 in the subject Electrotechnology, grade: Master 9.8/10, , language: English, abstract: Microelectromechanical systems (MEMS) are collection of microsensors and actuators that have the ability to sense its environment and react to changes in that environment with the use of a microcircuit control. They also include the conventional microelectronics packaging, integrating antenna structures for command signals into microelectromechanical structures for desired sensing and actuating functions. The system may also need micropower supply, microrelay, and microsignal processing units. Microcomponents make the system faster, more reliable, cheaper, and capable of incorporating more complex functions. In the beginning of 1990s, MEMS appeared with the aid of the development of integrated circuit fabrication processes, in which sensors, actuators, and control functions are co-fabricated in silicon [1]. Since then, remarkable research progresses have been achieved in MEMS under the strong promotions from both government and industries. In addition to the commercialization of some less integrated MEMS devices, such as microaccelerometers, inkjet printer head, micromirrors for projection, etc., the concepts and feasibility of more complex MEMS devices have been proposed and demonstrated for the applications in such varied fields as microfluidics, aerospace, biomedical, chemical analysis, wireless communications, data storage, display, optics, etc. Some branches of MEMS, appearing as microoptoelectromechanical systems (MOEMS), micro total analysis systems, etc., have attracted a great research since their potential applications’ market.
Author: Henry Baltes
Publisher: John Wiley & Sons
ISBN: 3527616934
Category : Technology & Engineering
Languages : en
Pages : 612
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Book Description
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.
Author: Padmalaya Nayak
Publisher: Springer
ISBN: 9789811629181
Category : Technology & Engineering
Languages : en
Pages : 508
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Book Description
This book includes high-quality research papers presented at the 1st International Conference on Wireless Sensor Networks, Ubiquitous Computing and Applications (ICWSNUCA, 2021), which is held at Gokaraju Rangaraju Institute of Engineering and Technology, Hyderabad, India, during 26–27 February, 2021. This volume focuses on the applications, use-cases, architectures, deployments, and recent advances of wireless sensor networks as well as ubiquious computing. Different research topics are illustrated in this book, like wireless sensor networks for the Internet of Things; IoT applications for eHealth; smart cities; architectures for WSNs and IoT, WSNs hardware and new devices; low-power wireless technologies; wireless ad hoc sensor networks; routing and data transfer in WSNs; multicast communication in WSNs; security management in WSNs and in IoT systems; and power consumption optimization in WSNs.
Author: Mahmoud Rasras
Publisher: MDPI
ISBN: 3038974145
Category : Technology & Engineering
Languages : en
Pages : 252
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Book Description
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Author: R. K. Sharma
Publisher: Springer
ISBN: 3319976044
Category : Technology & Engineering
Languages : en
Pages : 1260
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Book Description
This book disseminates the current knowledge of semiconductor physics and its applications across the scientific community. It is based on a biennial workshop that provides the participating research groups with a stimulating platform for interaction and collaboration with colleagues from the same scientific community. The book discusses the latest developments in the field of III-nitrides; materials & devices, compound semiconductors, VLSI technology, optoelectronics, sensors, photovoltaics, crystal growth, epitaxy and characterization, graphene and other 2D materials and organic semiconductors.
Author: Stamatis Vassiliadis
Publisher: Springer
ISBN: 3540364110
Category : Computers
Languages : en
Pages : 505
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Book Description
This book constitutes the refereed proceedings of the 6th International Workshop on Systems, Architectures, Modeling, and Simulation, SAMOS 2006, held in Samos, Greece on July 2006. The 47 revised full papers presented together with 2 keynote talks were thoroughly reviewed and selected from 130 submissions. The papers are organized in topical sections on system design and modeling, wireless sensor networks, processor design, dependable computing, architectures and implementations, and embedded sensor systems.
Author: Krzysztof Galkowski
Publisher: Trans Tech Publications Ltd
ISBN: 3038262757
Category : Technology & Engineering
Languages : en
Pages : 2511
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Book Description
Selected, peer reviewed papers from the 2013 2nd International Conference on Mechatronics and Control Engineering (ICMCE 2013), August 28-29, 2013, Guangzhou, China
Author: Shen Liu
Publisher: John Wiley & Sons
ISBN: 0470827807
Category : Technology & Engineering
Languages : en
Pages : 586
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Book Description
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Author: Raju Surampudi Bapi
Publisher: Springer
ISBN: 9811315809
Category : Technology & Engineering
Languages : en
Pages : 704
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Book Description
This book presents original research works by researchers, engineers and practitioners in the field of artificial intelligence and cognitive computing. The book is divided into two parts, the first of which focuses on artificial intelligence (AI), knowledge representation, planning, learning, scheduling, perception-reactive AI systems, evolutionary computing and other topics related to intelligent systems and computational intelligence. In turn, the second part focuses on cognitive computing, cognitive science and cognitive informatics. It also discusses applications of cognitive computing in medical informatics, structural health monitoring, computational intelligence, intelligent control systems, bio-informatics, smart manufacturing, smart grids, image/video processing, video analytics, medical image and signal processing, and knowledge engineering, as well as related applications.
Author: Ville Kaajakari
Publisher:
ISBN: 9780982299104
Category : Technology & Engineering
Languages : en
Pages : 478
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Book Description
Practical MEMS focuses on analyzing the operational principles of microsystems. The salient features of the book include: Tutorial approach. The book emphasizes the design and analysis through over 100 calculated examples covering all aspects of MEMS design. Emphasis on design. This book focuses on the microdevice operation. First, the physical operation principles are covered. Second, the design equations are derived and exemplified. Practical MEMS is a perfect companion to MEMS fabrication textbooks. Quantitative performance analysis. The critical performance parameters for the given application are identified and analyzed. For example, the noise and power performance of piezoresistive and capacitive accelerometers is analyzed in detail. Mechanical, resistive (thermal and 1/f-noise), and circuit noise analysis is covered. Application specifications. Different MEMS applications are compared to commercial design requirements. For example, the optical MEMS is analyzed in the context of bar code scanner, projection displays, and optical cross connect specifications. MEMS economics and market analysis. A full chapter is devoted to yield and cost analysis of microfabricated devices. In addition, the market economics for emerging applications such as RF MEMS is discussed.
