Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 218
Book Description
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 218
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 218
Book Description
In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 266
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 266
Book Description
Microelectronics Manufacturing and Reliability
Author: Barbara Vasquez
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 276
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 276
Book Description
Reliability Prediction for Microelectronics
Author: Joseph B. Bernstein
Publisher: John Wiley & Sons
ISBN: 1394210930
Category : Technology & Engineering
Languages : en
Pages : 404
Book Description
RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.
Publisher: John Wiley & Sons
ISBN: 1394210930
Category : Technology & Engineering
Languages : en
Pages : 404
Book Description
RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.
Reliability and Quality in Microelectronic Manufacturing
Author: A. Christou
Publisher: RIAC
ISBN: 1933904151
Category : Microelectronics
Languages : en
Pages : 410
Book Description
Publisher: RIAC
ISBN: 1933904151
Category : Microelectronics
Languages : en
Pages : 410
Book Description
Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Author: Tejinder Gandhi
Publisher: ASM International
ISBN: 1627082468
Category : Technology & Engineering
Languages : en
Pages : 719
Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Publisher: ASM International
ISBN: 1627082468
Category : Technology & Engineering
Languages : en
Pages : 719
Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Microelectronics Failure Analysis
Author: EDFAS Desk Reference Committee
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
Book Description
Includes bibliographical references and index.
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
Book Description
Includes bibliographical references and index.
Microelectronics Failure Analysis
Author:
Publisher: ASM International
ISBN: 0871708043
Category : Technology & Engineering
Languages : en
Pages : 813
Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Publisher: ASM International
ISBN: 0871708043
Category : Technology & Engineering
Languages : en
Pages : 813
Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Analytical and Diagnostic Techniques for Semiconductor Materials, Devices and Processes
Author: Bernd O. Kolbesen (Chemiker.)
Publisher: The Electrochemical Society
ISBN: 9781566772396
Category : Technology & Engineering
Languages : en
Pages : 568
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772396
Category : Technology & Engineering
Languages : en
Pages : 568
Book Description
Handbook of Silicon Semiconductor Metrology
Author: Alain C. Diebold
Publisher: CRC Press
ISBN: 0203904540
Category : Technology & Engineering
Languages : en
Pages : 703
Book Description
Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay
Publisher: CRC Press
ISBN: 0203904540
Category : Technology & Engineering
Languages : en
Pages : 703
Book Description
Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay