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Languages : en
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Author:
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Languages : en
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Author: Russell A. Lawton
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 162
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Author: Russell A. Lawton
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 190
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Book Description
A selection of scientific papers on the reliability of microelectromechanical systems (MEMS) for critical and space applications.
Author: Allyson L. Hartzell
Publisher: Springer Science & Business Media
ISBN: 144196018X
Category : Technology & Engineering
Languages : en
Pages : 300
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Book Description
The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
Author: Osamu Tabata
Publisher: John Wiley & Sons
ISBN: 3527335013
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Author:
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Category :
Languages : en
Pages : 169
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Book Description
The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.
Author: Osamu Tabata
Publisher: John Wiley & Sons
ISBN: 352762256X
Category : Technology & Engineering
Languages : en
Pages : 325
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Book Description
This edition of 'Reliability of MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, one of the most important hurdles to commercialization for microelectromechanical systems is covered in detail: the reliability of MEMS materials and devices. Due to their microscale size combined with novel functionalities, a whole new category of challenges arises, and proper determination of a given device's reliability is instrumental in determining its range of usability and application fields. Any kind of gadget's performance, lifetime and safety will depend on the continued and predictable functioning of both the electronic as well as the micromechanical parts. MEMS reliability therefore can be as serious as human life-and-death matters - quite literally in the case of roll-over sensors for cars, for example.
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Category :
Languages : en
Pages :
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Book Description
Mission critical applications of MEMS devices require knowledge of the distribution in their material properties and long-term reliability of the small-scale structures. This project reports on a new testing program at Sandia to quantify the strength distribution using samples that reflect the dimensions of critical MEMS components. The strength of polysilicon fabricated with Sandia's SUMMiT 4-layer process was successfully measured using samples with gage sections 2.5[micro]m thick by 1.7[micro]m wide and lengths of 15 and 25[micro]m. These tensile specimens have a freely moving pivot on one end that anchors the sample to the silicon die and prevents off axis loading during testing. Each sample is loaded in uniaxial tension by pulling laterally with a flat tipped diamond in a computer-controlled Nanoindenter. The stress-strain curve is calculated using the specimen cross section and gage length dimensions verified by measuring against a standard in the SEM. The first 48 samples had a means strength of 2.24[+-] 0.35 GPa. Fracture strength measurements grouped into three strength levels, which matched three failure modes observed in post mortem examinations. The seven samples in the highest strength group failed in the gage section (strength of 2.77[+-] 0.04 GPa), the moderate strength group failed at the gage section fillet and the lowest strength group failed at a dimple in the hub. With this technique, multiple tests can be programmed at one time and performed without operator assistance at a rate of 20-30 per day allowing the collection of significant populations of data. Since the new test geometry has been proven, the project is moving to test the distributions seen from real geometric features typical to MEMS such as the effect of gage length, fracture toughness, bonding between layers, etch holes, dimples and shear of gear teeth.
Author: Osamu Tabata
Publisher: John Wiley & Sons
ISBN: 9783527314942
Category : Technology & Engineering
Languages : en
Pages : 328
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Book Description
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Author: National Aeronautics and Space Administration (NASA)
Publisher: Createspace Independent Publishing Platform
ISBN: 9781721977048
Category :
Languages : en
Pages : 312
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Book Description
This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment. Stark, Brian (Editor) Jet Propulsion Laboratory NAS7-1407...
