Author: Paul R. Besser
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 450
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.
Author: Leonid Borisovich Getsov
Publisher: Springer Nature
ISBN: 9811605343
Category : Science
Languages : en
Pages : 495
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Book Description
This book discusses several mechanical and material problems that are typical for gas turbine components. It discusses accelerated tests and other methods for increasing the reliability of gas turbine engines. Special attention is given to non-traditional methods for calculating the strength characteristics and longevity of the main components. This first volume focuses on the selection of materials, deformation and destruction mechanisms in connection with stationary and non-stationary loading, and types of material damage such as the thermal fatigue. Particular attention is paid to the issues of the properties of single crystal alloys, the relationship between structure and properties, the influence of technological factors and long-term operation. The characteristics of creep resistance, crack resistance, and resistance to cyclic deformation of different alloys are given.
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 0128123125
Category : Technology & Engineering
Languages : en
Pages : 472
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Book Description
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Author: Paul R. Besser
Publisher: Cambridge University Press
ISBN: 9781107408982
Category : Technology & Engineering
Languages : en
Pages : 430
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Book Description
This book, first published in 2005, brings together leading modelers and experimentalists to discuss the plethora of process and reliability issues associated with depositing, characterizing and integrating novel and existing barriers, metals and ultralow-k dielectrics into reliable high-performance interconnects that can be robustly packaged. Section I focuses on low-k dielectric integration. Manuscripts highlight the importance of interface integrity and adhesion, the issue of process-induced dielectric damage and the need for pore sealing methods for low-k films. Channel cracking is addressed by several contributions. Cu metallization and barrier challenges are discussed in a section on metallization. Mechanical stress is highlighted in a reliability section. Contributions here provide a fundamental understanding of the issues of stress and stress relaxation in Cu films and lines encapsulated in low-k dielectrics. Presentations on electromigration, leakage and time-dependent dielectric breakdown, as well as thermal and mechanical fatigue, are also featured.
Author: Ting Y. Tsui
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 280
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Jeremy A. Theil
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 192
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Dielectric devices
Languages : en
Pages : 408
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Book Description
Author: Yasubumi Furuya
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 408
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Book Description
Smart/intelligent systems is a primary technology for present and future applications in areas ranging from everyday life to aerospace missions, from civil to military environments, from robots to information technology. Smart materials are the critical foundation for high-performance smart devices, and smart devices are fundamental components for smart systems. The three cannot be separated. This book bridges the fields of smart materials, sensing and actuating devices, and intelligent systems, and provides an opportunity for researchers from all three arenas to channel information into a coherent, interdisciplinary community. Topics include: piezoelectric actuators; novel devices and systems; shape memory alloys and magnetostrictive devices; nanometer-scale processing and properties; piezoelectric materials; sensor materials and devices; and electroactive polymer actuators.
