Author: John C. Bravman
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 392
Book Description
Materials Reliability in Microelectronics VIII
Materials Reliability in Microelectronics VI
Author:
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 583
Book Description
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 583
Book Description
Materials Reliability in Microelectronics VIII: Volume 516
Author: John C. Bravman
Publisher: Materials Research Society
ISBN: 9781558994225
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
Reliability concerns have forced interconnect systems to scale more slowly than devices. As a result, reliability engineers and scientists are now responsible for much of the performance and lifetime gains anticipated in the microelectronics industry. To achieve these gains, the interconnect must be viewed as a complex system with many types of reliability issues. A critical understanding of electromigration, stress-induced voiding, mechanical integrity, thermal performance, chemical effects, and oxide reliability are necessary. And of course, new models and materials will likely be necessary to improve the interconnect system for future needs. This book brings together researchers from academia and industry to discuss fundamental mechanisms and phenomena in the reliability field. Topics include: novel measurement techniques; microstructural effects; reliability modelling; stress effects; advanced inter-connect reliability; adhesion and fracture; and packaging reliability issues.
Publisher: Materials Research Society
ISBN: 9781558994225
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
Reliability concerns have forced interconnect systems to scale more slowly than devices. As a result, reliability engineers and scientists are now responsible for much of the performance and lifetime gains anticipated in the microelectronics industry. To achieve these gains, the interconnect must be viewed as a complex system with many types of reliability issues. A critical understanding of electromigration, stress-induced voiding, mechanical integrity, thermal performance, chemical effects, and oxide reliability are necessary. And of course, new models and materials will likely be necessary to improve the interconnect system for future needs. This book brings together researchers from academia and industry to discuss fundamental mechanisms and phenomena in the reliability field. Topics include: novel measurement techniques; microstructural effects; reliability modelling; stress effects; advanced inter-connect reliability; adhesion and fracture; and packaging reliability issues.
Materials Reliability in Microelectronics
Author: Cynthia A. Volkert
Publisher:
ISBN:
Category :
Languages : en
Pages : 311
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 311
Book Description
Materials Reliability in Microelectronics IV
Author: Materials Research Society. Spring Meeting
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 666
Book Description
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 666
Book Description
Materials Reliability in Microelectronics IX
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Materials Reliability in Microelectronics
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 392
Book Description
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 392
Book Description
Materials Reliability in Microelectronics
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 488
Book Description
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 488
Book Description
Materials Reliability in Microelectronics IV
Author: Materials Research Society
Publisher: Materials Research Society
ISBN: 9783380000006
Category : Technology & Engineering
Languages : en
Pages :
Book Description
Publisher: Materials Research Society
ISBN: 9783380000006
Category : Technology & Engineering
Languages : en
Pages :
Book Description
Materials Reliability Issues in Microelectronics
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 392
Book Description
Proceedings of the "MRS Symposium on Materials Reliability Issues in Microelectronics"--Dedication, p. xiii.
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 392
Book Description
Proceedings of the "MRS Symposium on Materials Reliability Issues in Microelectronics"--Dedication, p. xiii.