Materials Reliability in Microelectronics VI: Volume 428 PDF Download
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Author: William F. Filter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.
Author: William F. Filter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.
Author: Pamela B. Vandiver
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 464
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Book Description
This book presents cutting-edge multidisciplinary work on the characterization of ancient materials; the technologies of selection, production and usage by which materials are transformed into objects and artifacts; the science underlying their deterioration, preservation and conservation; and sociocultural interpretation derived from an empirical methodology of observation, measurement and experimentation. Of particular interest are contributions which explore the interface and overlap among traditional materials science, the history of technology and the archaeological and conservation sciences, or that investigate new methods and applications of materials science in art and archaeology. Topics include: analytical chemistry and spectroscopy; ancient and historical metallurgy; natural and artificial glass; characterization, sources and production of ceramics; organic materials technologies; architectural conservation and materials characterization; conservation of archaeological and historical materials; and other studies of ceramics and metals.
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 392
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Book Description
Author: John C. Bravman
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 392
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Book Description
Author: Raul F. Lobo
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Michael L. Reed
Publisher:
ISBN:
Category : Mathematics
Languages : en
Pages : 264
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Book Description
A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR
Author: André Lagendijk
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.
Author: William W. Gerberich
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Author: Steven K. Groothuis
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 696
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Book Description
Based on an international gathering of scientists and engineers from 17 countries, this book, the fifth in a continuing series, assesses microwave processing of materials as an emerging technology. Significant advances in understanding and control of microwave energy and its use in the processing and testing of materials are outlined. Future research and development needs are also explored. Topics include: scale-up and commercialization; microwave nondestructive testing; microwave processing; microwave system design; dielectric properties measurements and analysis; modelling of microwave heating; microwave interactions and mechanisms; microwave processing using variable frequency sources; alternate microwave sources; remediation of hazardous waste; temperature modelling and measurements; microwave processing of polymers; and plasma processing.
