Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 PDF Download
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Author: Qinghuang Lin
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 366
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Qinghuang Lin
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 366
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: S. Ashok
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 400
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, focuses on the application of defects and impurities in current and emerging semiconductor technologies.
Author: Daryush Ila
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 264
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Christophe Barbé
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
The field of organic/inorganic hybrids has evolved significantly, providing materials with increasing architectural complexities and functionalities. Scientists involved in this field are gradually moving from building materials using a classical molecular approach (e.g. polymerization) to assembling materials on the nanoscale, using a variety of innovative strategies which can vary from the assembly of DNA motifs, to the formation of mesoporous materials by spinodal decomposition, or the use of nanoparticles or oxoclusters as nanobuilding blocks for building complex structures such as nacre-like transition metal oxides. This precise control over the materials architecture also adds functionality to the hybrid materials, whether it is for designing special membranes for phase separation and chromatography or thin films for photonic or magnetic applications. This book presents contributions from researchers worldwide and discusses organosiloxane-based materials; mesoporous materials and films; layered materials; surface and interface modification and characterization; controlled release and biological applications; nanoparticles synthesis and assembly; nanocomposites and new concepts.
Author: Timothy Gessert
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 544
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Book Description
Thin-film compound semiconductor photovoltaic solar cells have demonstrated efficiencies of nearly 20% and are leading candidates to provide lower-cost energy due to potential advantages in manufacturing and materials costs. To fulfill the promise, a number of technical issues are being addressed, including a lack of fundamental understanding of these unique materials, devices and processes for large-area deposition. This book focuses on advances in the materials science, chemistry, processing and device issues of thin-film compound semiconductor materials that are used, or have potential use, in photovoltaic solar cells and related applications. Topics include: growth and performance of compound thin-film solar cells; novel materials and processes; defects and impurities; industrial perspectives; contacts and interfaces; grain boundaries and inhomogeneities; and structural, optical and electronic characterization.
Author: Mohindar Seehra
Publisher: BoD – Books on Demand
ISBN: 1789232929
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
The use of copper, silver, gold and platinum in jewelry as a measure of wealth is well known. This book contains 19 chapters written by international authors on other uses and applications of noble and precious metals (copper, silver, gold, platinum, palladium, iridium, osmium, rhodium, ruthenium, and rhenium). The topics covered include surface-enhanced Raman scattering, quantum dots, synthesis and properties of nanostructures, and its applications in the diverse fields such as high-tech engineering, nanotechnology, catalysis, and biomedical applications. The basis for these applications is their high-free electron concentrations combined with high-temperature stability and corrosion resistance and methods developed for synthesizing nanostructures. Recent developments in all these areas with up-to-date references are emphasized.
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 0470065419
Category : Technology & Engineering
Languages : en
Pages : 508
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Book Description
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 146
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Book Description
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979
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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
