Materials, Integration and Packaging Issues for High-Frequency Devices: PDF Download
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Author: P. Muralt
Publisher: Cambridge University Press
ISBN: 9781107409361
Category : Technology & Engineering
Languages : en
Pages : 250
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Book Description
This book, first published in 2004, focuses on the materials technologies that are key to the advancement of high-frequency devices. The competition for better-performing mobile phones is the main driving factor in this field. In mobile phones, passive components constitute 70-90% of the number of components, volume, and costs. The spirit of the volume is to bring together scientists in the processing, characterization, packaging, device design and applications of passive devices, to gain insight into the various paths along which technology of passive components is progressing. Topics include: improvements in low-temperature co-fired ceramics; microstructure - property relationships in perovskites for new materials compositions, with lower firing temperatures, for microwave dielectrics with high-quality factors; tunable ferroelectrics allowing low-cost solutions for frequency tuning and phase shifters; new integration platforms and packaging concepts; embedded capacitors; integration of RF switches based on MEMS technology; bulk acoustic wave resonators and above-chip integration.
Author: P. Muralt
Publisher: Cambridge University Press
ISBN: 9781107409361
Category : Technology & Engineering
Languages : en
Pages : 250
Get Book Here
Book Description
This book, first published in 2004, focuses on the materials technologies that are key to the advancement of high-frequency devices. The competition for better-performing mobile phones is the main driving factor in this field. In mobile phones, passive components constitute 70-90% of the number of components, volume, and costs. The spirit of the volume is to bring together scientists in the processing, characterization, packaging, device design and applications of passive devices, to gain insight into the various paths along which technology of passive components is progressing. Topics include: improvements in low-temperature co-fired ceramics; microstructure - property relationships in perovskites for new materials compositions, with lower firing temperatures, for microwave dielectrics with high-quality factors; tunable ferroelectrics allowing low-cost solutions for frequency tuning and phase shifters; new integration platforms and packaging concepts; embedded capacitors; integration of RF switches based on MEMS technology; bulk acoustic wave resonators and above-chip integration.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 256
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Book Description
Author: Yong S. Cho
Publisher:
ISBN: 9781558997813
Category : Electronic packaging
Languages : en
Pages : 270
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Book Description
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 328
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, brings together researchers interested in strained SiGe, strain-relaxed buffers, strained Si on bulk Si and on SOI, SiGe on SOI, Ge substrates, and Ge on insulator.
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 304
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: R. J. Carter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Author: Materials Research Society. Fall Meeting
Publisher:
ISBN: 9781558997233
Category : Technology & Engineering
Languages : en
Pages : 552
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Book Description
Author: G. S. Nolas
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 498
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Book Description
The measure of a thermoelectric material is given by the material's figure of merit. For over three decades the best thermoelectric materials had a ZT = 1. Recently, however, there are reports of new methods of materials synthesis that result in improvements beyond this performance. In addition, rapid characterization, as well as faster theoretical modeling of thermoelectric materials, has resulted in a more rapid evaluation of new materials. This book offers a look at these results and provides a benchmark for the current state in the field of thermoelectric materials research and development. The focus is on new and innovative directions that will lead to the next generation thermoelectric materials for small-scale refrigeration and power generation applications. The book emphasizes the multidisciplinary nature of the research needed to advance the science and technology of the field. Both theoretical and experimental studies are featured. Topics include: low-dimensional systems and nanocomposites; devices; oxides; skutterudites; complex bulk materials and measurements; novel approaches; and thermoelectric materials and technology.
Author: Hock Min Ng
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 872
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
