Materials Handbook for Hybrid Microelectronics PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Materials Handbook for Hybrid Microelectronics PDF full book. Access full book title Materials Handbook for Hybrid Microelectronics by Joseph Alison King. Download full books in PDF and EPUB format.
Author: Joseph Alison King
Publisher: Artech House Publishers
ISBN:
Category : Science
Languages : en
Pages : 682
Get Book Here
Book Description
The result of a joint effort between representatives of private industry and academia, the publication is divided into sections on elements, alloys, insulators and compound semi-conductors. An index and bibliography are lacking. Numerous simple graphs and charts are provided, in fact most of the boo
Author: Joseph Alison King
Publisher: Artech House Publishers
ISBN:
Category : Science
Languages : en
Pages : 682
Get Book Here
Book Description
The result of a joint effort between representatives of private industry and academia, the publication is divided into sections on elements, alloys, insulators and compound semi-conductors. An index and bibliography are lacking. Numerous simple graphs and charts are provided, in fact most of the boo
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Get Book Here
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Jerry E. Sergent
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 778
Get Book Here
Book Description
Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.
Author: Abraham Landzberg
Publisher: Springer Science & Business Media
ISBN: 1461520290
Category : Technology & Engineering
Languages : en
Pages : 663
Get Book Here
Book Description
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Author: Joseph A. King
Publisher:
ISBN: 9780608005744
Category :
Languages : en
Pages : 628
Get Book Here
Book Description
Author: Tapan Gupta
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
Get Book Here
Book Description
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Author: James J. Licari
Publisher: Elsevier
ISBN: 081551798X
Category : Technology & Engineering
Languages : en
Pages : 603
Get Book Here
Book Description
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Author: Richard Crowson
Publisher: CRC Press
ISBN: 9780585158631
Category : Technology & Engineering
Languages : en
Pages : 1142
Get Book Here
Book Description
Provides single-source coverage on the full range of activities that meet the manufacturing engineering process, including management, product and process design, tooling, equipment selection, faciltiy planning and layout, plant contruction, materials handling and storage, method analysis, time standards, and production control. The text examines every topic involved with product and factory development, parts fabrication, and assembly processes.
Author: Gregory S. Nusinovich
Publisher: John Wiley & Sons
ISBN: 0471683728
Category : Technology & Engineering
Languages : en
Pages : 885
Get Book Here
Book Description
A comprehensive study of microwave vacuum electronic devices and their current and future applications While both vacuum and solid-state electronics continue to evolve and provide unique solutions, emerging commercial and military applications that call for higher power and higher frequencies to accommodate massive volumes of transmitted data are the natural domain of vacuum electronics technology. Modern Microwave and Millimeter-Wave Power Electronics provides systems designers, engineers, and researchers-especially those with primarily solid-state training-with a thoroughly up-to-date survey of the rich field of microwave vacuum electronic device (MVED) technology. This book familiarizes the R&D and academic communities with the capabilities and limitations of MVED and highlights the exciting scientific breakthroughs of the past decade that are dramatically increasing the compactness, efficiency, cost-effectiveness, and reliability of this entire class of devices. This comprehensive text explores a wide range of topics: Traveling-wave tubes, which form the backbone of satellite and airborne communications, as well as of military electronic countermeasures systems Microfabricated MVEDs and advanced electron beam sources Klystrons, gyro-amplifiers, and crossed-field devices "Virtual prototyping" of MVEDs via advanced 3-D computational models High-Power Microwave (HPM) sources Next-generation microwave structures and circuits How to achieve linear amplification Advanced materials technologies for MVEDs A Web site appendix providing a step-by-step walk-through of a typical MVED design process Concluding with an in-depth examination of emerging applications and future possibilities for MVEDs, Modern Microwave and Millimeter-Wave Power Electronics ensures that systems designers and engineers understand and utilize the significant potential of this mature, yet continually developing technology. SPECIAL NOTE: All of the editors' royalties realized from the sale of this book will fund the future research and publication activities of graduate students in the vacuum electronics field.
Author: J. Bressers
Publisher: Springer Science & Business Media
ISBN: 9401586365
Category : Technology & Engineering
Languages : en
Pages : 497
Get Book Here
Book Description
The International Symposium "Fatigue under Thermal and Mechanical Loading", held at Petten (The Netherlands) on May 22-24, 1995, was jointly organized by the Institute for Advanced Materials of The Joint Research Centre, E. C. , and by the Societe Fran~se de Metallurgie et de Materiaux. The fast heating and cooling cycles experienced by many high temperature components cause thermally induced stresses, which often operate in combination with mechanical loads. The resulting thermal / mechanical fatigue cycle leads to material degradation mechanisms and failure modes typical of service cycles. The growing awareness that the synergism between the combined thermal and mechanical loads can not be reproduced by means of isothermal tests, has resulted in an increasing interest in thermal and thermo-mechanical fatigue testing. This trend has been reinforced by the constant pull by industry for more performant, yet safer high temperature systems, pushing the materials to the limit of their properties. Dedicated ASTM meetings in particular have set the scene for this area of research. The proceedings of the symposium organized by D. A. Spera and D. F. Mowbray in 1975 provided a reference book on thermal fatigue which reflects the knowledge and experimental capabilities of the mid-seventies.
