Author: Andrea Alberto Mammoli
Publisher: WIT Press
ISBN: 1845641892
Category : Technology & Engineering
Languages : en
Pages : 465
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Book Description
Until recently, engineering materials could be characterised successfully using relatively simple testing procedures. As materials technology advances, interest is growing in materials possessing complex meso-, micro- and nano-structures, which to a large extent determine their physical properties and behaviour. The purposes of materials modelling are many - optimisation, investigation of failure, simulation of production processes, to name a few. Modelling and characterisation are closely intertwined, increasingly so as the complexity of the material increases. Characterisation, in essence, is the connection between the abstract material model and the real-world behaviour of the material in question. Characterisation of complex materials therefore may require a combination of experimental techniques and computation. This book contains papers from the Fourth International Conference on Computational Methods and Experiments in Materials Characterisation which brought researchers who use computational methods, those who perform experiments, and of course those who do both, in all areas of materials characterisation, to discuss their recent results and ideas, in order to foster the multidisciplinary approach that has become necessary for the study of complex phenomena.
Author: Yang Leng
Publisher: John Wiley & Sons
ISBN: 0470822996
Category : Technology & Engineering
Languages : en
Pages : 384
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Book Description
This book covers state-of-the-art techniques commonly used in modern materials characterization. Two important aspects of characterization, materials structures and chemical analysis, are included. Widely used techniques, such as metallography (light microscopy), X-ray diffraction, transmission and scanning electron microscopy, are described. In addition, the book introduces advanced techniques, including scanning probe microscopy. The second half of the book accordingly presents techniques such as X-ray energy dispersive spectroscopy (commonly equipped in the scanning electron microscope), fluorescence X-ray spectroscopy, and popular surface analysis techniques (XPS and SIMS). Finally, vibrational spectroscopy (FTIR and Raman) and thermal analysis are also covered.
Author: J.F. Bussière
Publisher: Springer Science & Business Media
ISBN: 1489906703
Category : Technology & Engineering
Languages : en
Pages : 506
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Book Description
There is a great deal of interest in extending nondestructive technologies beyond the location and identification of cracks and voids. Specifically there is growing interest in the application of nondestructive evaluation (NOEl to the measurement of physical and mechanical properties of materials. The measurement of materials properties is often referred to as materials characterization; thus nondestructive techniques applied to characterization become nondestructive characterization (NDCl. There are a number of meetings, proceedings and journals focused upon nondestructive technologies and the detection and identification of cracks and voids. However, the series of symposia, of which these proceedings represent the fourth, are the only meetings uniquely focused upon nondestructive characterization. Moreover, these symposia are especially concerned with stimulating communication between the materials, mechanical and manufacturing engineer and the NDE technology oriented engineer and scientist. These symposia recognize that it is the welding of these areas of expertise that is necessary for practical development and application of NDC technology to measurements of components for in service life time and sensor technology for intelligent processing of materials. These proceedings are from the fourth international symposia and are edited by c.o. Ruud, J. F. Bussiere and R.E. Green, Jr. . The dates, places, etc of the symposia held to date area as follows: Symposia on Nondestructive Methods for TITLE: Material Property Determination DATES: April 6-8, 1983 PLACE: Hershey, PA, USA CHAIRPERSONS: C.O. Ruud and R.E. Green, Jr.
Author: D.O. Northwood
Publisher: WIT Press
ISBN: 1784663077
Category : Technology & Engineering
Languages : en
Pages : 179
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Book Description
Containing selected papers on Materials Characterisation this volume presents the latest research in the field. Material and contact characterisation is a rapidly advancing field that requires the application of a combination of numerical and experimental methods. Contributions come from both industry and research communities using computational methods and performing experiments. Demand for high quality production from both industry and consumers has led to rapid developments in materials science and engineering. Current research is focussed on modification technologies that can increase the surface durability of materials. The characteristics of the system reveal which surface engineering methods should be chosen and as a consequence it is essential to study the combination of surface treatment and contact mechanics. The accurate characterisation of the physical and chemical properties of materials requires the application of both experimental techniques and computer simulation methods in order to gain a correct analysis. A very wide range of materials, starting with metals through polymers and semiconductors to composites, necessitates a whole spectrum of characteristic experimental techniques and research methods. The papers in this book examine various combinations of techniques across various topics.
Author: Eui-Hyeok Yang
Publisher: Elsevier
ISBN: 0128184760
Category : Technology & Engineering
Languages : en
Pages : 502
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Book Description
Synthesis, Modelling and Characterization of 2D Materials and Their Heterostructures provides a detailed discussion on the multiscale computational approach surrounding atomic, molecular and atomic-informed continuum models. In addition to a detailed theoretical description, this book provides example problems, sample code/script, and a discussion on how theoretical analysis provides insight into optimal experimental design. Furthermore, the book addresses the growth mechanism of these 2D materials, the formation of defects, and different lattice mismatch and interlayer interactions. Sections cover direct band gap, Raman scattering, extraordinary strong light matter interaction, layer dependent photoluminescence, and other physical properties. - Explains multiscale computational techniques, from atomic to continuum scale, covering different time and length scales - Provides fundamental theoretical insights, example problems, sample code and exercise problems - Outlines major characterization and synthesis methods for different types of 2D materials
Author: Leif A. Carlsson
Publisher: CRC Press
ISBN: 142003202X
Category : Technology & Engineering
Languages : en
Pages : 259
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Book Description
Over much of the last three decades, the evolution of techniques for characterizing composite materials has struggled to keep up with the advances of composite materials themselves and their broadening areas of application. In recent years, however, much work has been done to consolidate test methods and better understand those being used. Finally,
Author: C. A. Brebbia
Publisher: WIT Press
ISBN: 1845647203
Category : Technology & Engineering
Languages : en
Pages : 365
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Book Description
This book contains papers to be presented at the Sixth International Conference on the topic. Materials modelling and characterisation have become ever more closely intertwined. Characterisation, in essence, connects the abstract material model with the real-world behaviour of the material in question. Characterisation of complex materials often requires a combination of experimental and computational techniques. The conference is convened biennially to facilitate the sharing of recent work between researchers who use computational methods, those who perform experiments, and those who do both, in all areas of materials characterisation.The papers cover such topics as: Computational models and experiments; Mechanical characterisation and testing; Micro and macro materials characterisation; Corrosion problems; Innovative experimental technologies; Recycled materials; Thermal analysis; Advances in composites; Cementitious materials; Structural health monitoring; Energy materials.
Author: Harold Berger
Publisher:
ISBN:
Category : Ultrasonic testing
Languages : en
Pages : 680
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Book Description
Author: Dieter K. Schroder
Publisher: John Wiley & Sons
ISBN: 0471739065
Category : Technology & Engineering
Languages : en
Pages : 800
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Book Description
This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Author: C.A. Brebbia
Publisher: WIT Press
ISBN: 1845649486
Category : Technology & Engineering
Languages : en
Pages : 413
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Book Description
Containing papers presented at the Seventh International Conference on Materials Characterisation, this book presents the latest advances in a rapidly developing field that requires the application of a combination of numerical and experimental methods. The work has been contributed by researchers who use computational methods, those who perform experiments, and those who combine both. Materials characterisation is important to ensuring that new products meet the needs of industry and consumers. The accurate characterisation of the physical and chemical properties of the materials requires the application of both experimental techniques and computer simulation methods. The wide range of materials now available, from metals to polymers and semiconductors to composites, necessitates a variety of experimental techniques and numerical methods. The papers in the book examine various combinations of techniques. The papers cover such topics as: Mechanical Characterisation and Testing; Micro and Macro Materials Characterisation; Cementitious Materials; Advances in Composites; Semiconductor Materials Characterisation; Computational Models and Experiments; Corrosion Problems.
