Environmental Issues with Materials and Processes for the Electronics and Semiconductor Industries PDF Download
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Author: Laura Mendicino
Publisher: The Electrochemical Society
ISBN: 9781566773126
Category : Science
Languages : en
Pages : 228
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Book Description
Author: Bonnie Antoun
Publisher: Springer Science & Business Media
ISBN: 3319008528
Category : Technology & Engineering
Languages : en
Pages : 184
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Book Description
Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2: Proceedings of the 2013 SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the second volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental Mechanics, including papers in the following general technical research areas: Metallic, Polymeric and Composite Materials Effects of Extreme Environments including Radiation Resistance, Damage, and Aging Challenges in Time-dependent Behavior Modeling of Low, Moderate and High Strain Rates Effects of Frequency and Hysteretic Heating Effects of Inhomogeneities on the Time-Dependent Behavior Composite, Hybrid and Multifunctional Materials Challenges in Time-dependent Behavior Modeling Viscoelastoplasticity and Damage Effects of Interfaces and Interphases on the Time-Dependent Behavior Environmental and Reactive Property Change Effects on Thermomechanical and Multifunctional Behaviors Modeling and Characterization of Fabrication Processes of Conventional and Multifunctional Materials Time-dependent and Small-scale Effects in Micro/Nano-scale Testing Time-dependent Processes in Biomaterials
Author: Laura Mendicino
Publisher: The Electrochemical Society
ISBN: 9781566773126
Category : Science
Languages : en
Pages : 228
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Book Description
Author:
Publisher: Elsevier
ISBN: 0081003587
Category : Science
Languages : en
Pages : 636
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Book Description
As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. - Assembles up-to-date information from the world's premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation - Includes information on processing and metrology techniques - Brings together multiple approaches to litho pattern recording from academia and industry in one place
Author:
Publisher: World Scientific
ISBN: 9811209642
Category : Technology & Engineering
Languages : en
Pages : 1079
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Book Description
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Author: Bonnie Antoun
Publisher: Springer
ISBN: 9783319376233
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2: Proceedings of the 2013 SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the second volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental Mechanics, including papers in the following general technical research areas: Metallic, Polymeric and Composite Materials Effects of Extreme Environments including Radiation Resistance, Damage, and Aging Challenges in Time-dependent Behavior Modeling of Low, Moderate and High Strain Rates Effects of Frequency and Hysteretic Heating Effects of Inhomogeneities on the Time-Dependent Behavior Composite, Hybrid and Multifunctional Materials Challenges in Time-dependent Behavior Modeling Viscoelastoplasticity and Damage Effects of Interfaces and Interphases on the Time-Dependent Behavior Environmental and Reactive Property Change Effects on Thermomechanical and Multifunctional Behaviors Modeling and Characterization of Fabrication Processes of Conventional and Multifunctional Materials Time-dependent and Small-scale Effects in Micro/Nano-scale Testing Time-dependent Processes in Biomaterials
Author: Michael F. Ashby
Publisher: Butterworth-Heinemann
ISBN: 0080878393
Category : Technology & Engineering
Languages : en
Pages : 543
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Book Description
A one-stop desk reference, for engineers involved in the use of engineered materials across engineering and electronics, this book will not gather dust on the shelf. It brings together the essential professional reference content from leading international contributors in the field. Material ranges from basic to advanced topics, including materials and process selection and explanations of properties of metals, ceramics, plastics and composites. - A hard-working desk reference, providing all the essential material needed by engineers on a day-to-day basis - Fundamentals, key techniques, engineering best practice and rules-of-thumb together in one quick-reference sourcebook - Definitive content by the leading authors in the field, including Michael Ashby, Robert Messler, Rajiv Asthana and R.J. Crawford
Author: C. R. Abernathy
Publisher: The Electrochemical Society
ISBN: 9781566771870
Category : Science
Languages : en
Pages : 310
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Book Description
Author: Oleg Bazaluk
Publisher: Trans Tech Publications Ltd
ISBN: 3035738831
Category : Science
Languages : en
Pages : 257
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Book Description
Special topic volume with invited peer-reviewed papers only
Author: Charles Lu
Publisher: SAE International
ISBN: 0768001900
Category : Technology & Engineering
Languages : en
Pages : 190
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Book Description
Since the successful production of carbon fibers in early 1960s, composite materials have emerged as the materials of choice for general aviation aircraft, military aircraft, space launch vehicles, and unmanned air vehicles. This has revolutionized the aerospace industry due to their excellent mechanical and physical properties, as well as weight-reducing ability. The next- generation material development model should operate in an integrated computational environment, where new material development, manufacturability, and product design practice are seamlessly interconnected. Materials and Process Modeling of Aerospace Composites reports recent developments on materials and processes of aerospace composites by using computational modeling, covering the following aspects: • The historical uses of composites in aerospace industry, documenting in detail the early usage of composite materials on Premier I by Raytheon to recent full-scale applications of composites on large commercial aircraft by Boeing and Airbus. • An overview on the classifications of composites used in aerospace industry, ranging from conventional glass- fiber reinforced composites to advanced graphene nanocomposites. • The recent work on computational material engineering on aerospace composite materials, including fundamental computational frame work and case studies on the modeling of materials and processes
Author: Anand Balu Nellippallil
Publisher: Springer Nature
ISBN: 3030453243
Category : Technology & Engineering
Languages : en
Pages : 368
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Book Description
This book explores systems-based, co-design, introducing a “Decision-Based, Co-Design” (DBCD) approach for the co-design of materials, products, and processes. In recent years there have been significant advances in modeling and simulation of material behavior, from the smallest atomic scale to the macro scale. However, the uncertainties associated with these approaches and models across different scales need to be addressed to enable decision-making resulting in designs that are robust, that is, relatively insensitive to uncertainties. An approach that facilitates co-design is needed across material, product design and manufacturing processes. This book describes a cloud-based platform to support decisions in the design of engineered systems (CB-PDSIDES), which feature an architecture that promotes co-design through the servitization of decision-making, knowledge capture and use templates that allow previous solutions to be reused. Placing the platform in the cloud aids mass collaboration and open innovation. A valuable reference resource reference on all areas related to the design of materials, products and processes, the book appeals to material scientists, design engineers and all those involved in the emerging interdisciplinary field of integrated computational materials engineering (ICME).
