Low-dielectric Constant Materials PDF Download
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Author:
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ISBN:
Category : Electric insulators and insulation
Languages : en
Pages : 408
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Book Description
Author:
Publisher:
ISBN:
Category : Electric insulators and insulation
Languages : en
Pages : 408
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Book Description
Author: Toh-Ming Lu
Publisher:
ISBN:
Category : Electric insulators and insulation
Languages : en
Pages : 312
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Book Description
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 9780824787837
Category : Technology & Engineering
Languages : en
Pages : 1186
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Book Description
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Author: Theodore M. Besmann
Publisher: The Electrochemical Society
ISBN: 9781566771559
Category : Science
Languages : en
Pages : 922
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Book Description
Author: Christopher Lyle Borst
Publisher: Springer Science & Business Media
ISBN: 1461511658
Category : Technology & Engineering
Languages : en
Pages : 235
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Book Description
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
Author: W. J. Van Ooij
Publisher: VSP
ISBN: 9789067642910
Category : Science
Languages : en
Pages : 970
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Book Description
This Festschrift documents the Proceedings of the First International Congress on Adhesion Science and Technology, held in honor of Dr. Kash Mittal on the occasion of his 50 birthday, in Amsterdam, The Netherlands, October 16-20, 1995. It contains the full accounts of the plenary and invited lectures, which are divided into the following seven parts: Part 1: Fundamental aspects of adhesion and general topics; Part 2: Contact angle, wettability and surface energetics; Part 3: Surface modification: Relevance to adhesion; Part 4: Adhesives and adhesive joints; Part 5: Adhesion aspects of polymeric coatings, and polymer-polymer interphase; Part 6: Metal-polymer and metal-ceramic adhesion; and Part 7: General papers. The topics covered include many different aspects of adhesion science and technology, and both fundamental and applied issues are addressed. The final section of this volume gives a listing of titles, authors and affiliations of the other 185 papers which were included in the technical program of the conference.
Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1594
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Author: Vijay Narayanan
Publisher: World Scientific
ISBN: 9814740497
Category : Technology & Engineering
Languages : en
Pages : 550
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Book Description
This volume provides a broad overview of the fundamental materials science of thin films that use silicon as an active substrate or passive template, with an emphasis on opportunities and challenges for practical applications in electronics and photonics. It covers three materials classes on silicon: Semiconductors such as undoped and doped Si and SiGe, SiC, GaN, and III-V arsenides and phosphides; dielectrics including silicon nitride and high-k, low-k, and electro-optically active oxides; and metals, in particular silicide alloys. The impact of film growth and integration on physical, electrical, and optical properties, and ultimately device performance, is highlighted.
Author: Hatsuo Ishida
Publisher: Elsevier
ISBN: 0128041854
Category : Technology & Engineering
Languages : en
Pages : 1128
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Book Description
Advanced and Emerging Polybenzoxazine Science and Technology introduces advanced topics of benzoxazine resins and polybenzoxazines as presented through the collaboration of leading experts in the benzoxazine community, representing the authoritative introduction to the subjects. Broad topics covered include the recent development and improved understanding of the subjects, including low temperature cure, aerogels and carbon aerogels, smart chemistry in fire retarding materials and coatings, metal containing benzoxazines, rational design of advanced properties, and materials from natural renew. In the past twenty years, the number of papers on polybenzoxazine has continuously increased at an exponential rate. During the past three years, the number of papers published is more than the previous 17 years combined. The material is now part of only a few successfully commercialized polymers in the past 35 years. Therefore, interest in this material in both academia and industry is very strong. - Includes the latest advancements in benzoxazine chemistry - Describes advanced materials, such as aerogels, carbons, smart coatings, nanofibers, and shape memory materials - Includes additional characterization data and techniques, such as FT-IR, Raman, NMR, DSC, and TGA analyses
Author: Ozdal Boyraz
Publisher: MDPI
ISBN: 3039369083
Category : Technology & Engineering
Languages : en
Pages : 184
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Book Description
The open access journal Micromachines invites manuscript submissions for the Special Issue “Silicon Photonics Bloom”. The past two decades have witnessed a tremendous growth of silicon photonics. Lab-scale research on simple passive component designs is now being expanded by on-chip hybrid systems architectures. With the recent injection of government and private funding, we are living the 1980s of the electronic industry, when the first merchant foundries were established. Soon, we will see more and more merchant foundries proposing well-established electronic design tools, product development kits, and mature component libraries. The open access journal Micromachines invites the submission of manuscripts in the developing area of silicon photonics. The goal of this Special Issue is to highlight the recent developments in this cutting-edge technology.]
