Author: Emanuele Rimini
Publisher: Springer Science & Business Media
ISBN: 1461522595
Category : Technology & Engineering
Languages : en
Pages : 400
Book Description
Ion implantation offers one of the best examples of a topic that starting from the basic research level has reached the high technology level within the framework of microelectronics. As the major or the unique procedure to selectively dope semiconductor materials for device fabrication, ion implantation takes advantage of the tremendous development of microelectronics and it evolves in a multidisciplinary frame. Physicists, chemists, materials sci entists, processing, device production, device design and ion beam engineers are all involved in this subject. The present monography deals with several aspects of ion implantation. The first chapter covers basic information on the physics of devices together with a brief description of the main trends in the field. The second chapter is devoted to ion im planters, including also high energy apparatus and a description of wafer charging and contaminants. Yield is a quite relevant is sue in the industrial surrounding and must be also discussed in the academic ambient. The slowing down of ions is treated in the third chapter both analytically and by numerical simulation meth ods. Channeling implants are described in some details in view of their relevance at the zero degree implants and of the available industrial parallel beam systems. Damage and its annealing are the key processes in ion implantation. Chapter four and five are dedicated to this extremely important subject.
Ion Implantation: Basics to Device Fabrication
Author: Emanuele Rimini
Publisher: Springer Science & Business Media
ISBN: 1461522595
Category : Technology & Engineering
Languages : en
Pages : 400
Book Description
Ion implantation offers one of the best examples of a topic that starting from the basic research level has reached the high technology level within the framework of microelectronics. As the major or the unique procedure to selectively dope semiconductor materials for device fabrication, ion implantation takes advantage of the tremendous development of microelectronics and it evolves in a multidisciplinary frame. Physicists, chemists, materials sci entists, processing, device production, device design and ion beam engineers are all involved in this subject. The present monography deals with several aspects of ion implantation. The first chapter covers basic information on the physics of devices together with a brief description of the main trends in the field. The second chapter is devoted to ion im planters, including also high energy apparatus and a description of wafer charging and contaminants. Yield is a quite relevant is sue in the industrial surrounding and must be also discussed in the academic ambient. The slowing down of ions is treated in the third chapter both analytically and by numerical simulation meth ods. Channeling implants are described in some details in view of their relevance at the zero degree implants and of the available industrial parallel beam systems. Damage and its annealing are the key processes in ion implantation. Chapter four and five are dedicated to this extremely important subject.
Publisher: Springer Science & Business Media
ISBN: 1461522595
Category : Technology & Engineering
Languages : en
Pages : 400
Book Description
Ion implantation offers one of the best examples of a topic that starting from the basic research level has reached the high technology level within the framework of microelectronics. As the major or the unique procedure to selectively dope semiconductor materials for device fabrication, ion implantation takes advantage of the tremendous development of microelectronics and it evolves in a multidisciplinary frame. Physicists, chemists, materials sci entists, processing, device production, device design and ion beam engineers are all involved in this subject. The present monography deals with several aspects of ion implantation. The first chapter covers basic information on the physics of devices together with a brief description of the main trends in the field. The second chapter is devoted to ion im planters, including also high energy apparatus and a description of wafer charging and contaminants. Yield is a quite relevant is sue in the industrial surrounding and must be also discussed in the academic ambient. The slowing down of ions is treated in the third chapter both analytically and by numerical simulation meth ods. Channeling implants are described in some details in view of their relevance at the zero degree implants and of the available industrial parallel beam systems. Damage and its annealing are the key processes in ion implantation. Chapter four and five are dedicated to this extremely important subject.
Ion Implantation and Synthesis of Materials
Author: Michael Nastasi
Publisher: Springer Science & Business Media
ISBN: 3540452982
Category : Science
Languages : en
Pages : 271
Book Description
Ion implantation is one of the key processing steps in silicon integrated circuit technology. Some integrated circuits require up to 17 implantation steps and circuits are seldom processed with less than 10 implantation steps. Controlled doping at controlled depths is an essential feature of implantation. Ion beam processing can also be used to improve corrosion resistance, to harden surfaces, to reduce wear and, in general, to improve materials properties. This book presents the physics and materials science of ion implantation and ion beam modification of materials. It covers ion-solid interactions used to predict ion ranges, ion straggling and lattice disorder. Also treated are shallow-junction formation and slicing silicon with hydrogen ion beams. Topics important for materials modification, such as ion-beam mixing, stresses, and sputtering, are also described.
Publisher: Springer Science & Business Media
ISBN: 3540452982
Category : Science
Languages : en
Pages : 271
Book Description
Ion implantation is one of the key processing steps in silicon integrated circuit technology. Some integrated circuits require up to 17 implantation steps and circuits are seldom processed with less than 10 implantation steps. Controlled doping at controlled depths is an essential feature of implantation. Ion beam processing can also be used to improve corrosion resistance, to harden surfaces, to reduce wear and, in general, to improve materials properties. This book presents the physics and materials science of ion implantation and ion beam modification of materials. It covers ion-solid interactions used to predict ion ranges, ion straggling and lattice disorder. Also treated are shallow-junction formation and slicing silicon with hydrogen ion beams. Topics important for materials modification, such as ion-beam mixing, stresses, and sputtering, are also described.
Ion Implantation in Microelectronics
Author: A. H. Agajanian
Publisher: Springer
ISBN:
Category : Reference
Languages : en
Pages : 282
Book Description
During the past ten years the use of ion implantation for doping semiconductors has become an active area of research and new device development. This doping technique has recently reached a level of maturity such that it is an integral step in the manu facturing of discrete semiconductor devices and integrated circuits. Ion implantation has significant advantages over diffusion such as: precision, purity, versatility, and automation; all of which are important for VLSI purposes. Ion implantation has also found new applications in magnetic bubble domain materials, superconductors, and materials synthesis. This book is a comprehensive bibliography of 2467 references of the world's literature on ion implantation as applied to micro electronics. This compilation will easily enable researchers to compare their work with that of others. For easy access to the needed references, the contents are divided into fifty-two subject headings. The main categories are: bibliographies, books and symposia, review articles, theory, materials, device applications, and equipment. An author index and a subject index are also given to provide easy access to the references. The literature from January 1976 to December 1980 is covered. The literature prior to 1976 is the subject, in part, of a previous book by the author (1). The main sources searched were: Physics Abstracts (PA) , Electrical and Electronics Abstracts (EEA) , Chemical Abstracts (CA) , Nuclear Science Abstracts (NSA) , and Engineering Index. The volumes and numbers of the abstracts are given to pro vide access to the abstracts.
Publisher: Springer
ISBN:
Category : Reference
Languages : en
Pages : 282
Book Description
During the past ten years the use of ion implantation for doping semiconductors has become an active area of research and new device development. This doping technique has recently reached a level of maturity such that it is an integral step in the manu facturing of discrete semiconductor devices and integrated circuits. Ion implantation has significant advantages over diffusion such as: precision, purity, versatility, and automation; all of which are important for VLSI purposes. Ion implantation has also found new applications in magnetic bubble domain materials, superconductors, and materials synthesis. This book is a comprehensive bibliography of 2467 references of the world's literature on ion implantation as applied to micro electronics. This compilation will easily enable researchers to compare their work with that of others. For easy access to the needed references, the contents are divided into fifty-two subject headings. The main categories are: bibliographies, books and symposia, review articles, theory, materials, device applications, and equipment. An author index and a subject index are also given to provide easy access to the references. The literature from January 1976 to December 1980 is covered. The literature prior to 1976 is the subject, in part, of a previous book by the author (1). The main sources searched were: Physics Abstracts (PA) , Electrical and Electronics Abstracts (EEA) , Chemical Abstracts (CA) , Nuclear Science Abstracts (NSA) , and Engineering Index. The volumes and numbers of the abstracts are given to pro vide access to the abstracts.
Optical Effects of Ion Implantation
Author: P. D. Townsend
Publisher: Cambridge University Press
ISBN: 9780521394307
Category : Science
Languages : en
Pages : 296
Book Description
This book is the first to give a detailed description of the factors and processes that govern the optical properties of ion implanted materials, as well as an overview of the variety of devices that can be produced in this way. Beginning with an overview of the basic physics and practical methods involved in ion implantation, the topics of optical absorption and luminescence are then discussed. A chapter on waveguide analysis then provides the background for a description of particular optical devices, such as waveguide lasers, mirrors, and novel nonlinear materials. The book concludes with a survey of the exciting range of potential applications.
Publisher: Cambridge University Press
ISBN: 9780521394307
Category : Science
Languages : en
Pages : 296
Book Description
This book is the first to give a detailed description of the factors and processes that govern the optical properties of ion implanted materials, as well as an overview of the variety of devices that can be produced in this way. Beginning with an overview of the basic physics and practical methods involved in ion implantation, the topics of optical absorption and luminescence are then discussed. A chapter on waveguide analysis then provides the background for a description of particular optical devices, such as waveguide lasers, mirrors, and novel nonlinear materials. The book concludes with a survey of the exciting range of potential applications.
Ion Implantation - Research and Application
Author:
Publisher:
ISBN: 9789535132387
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9789535132387
Category :
Languages : en
Pages :
Book Description
Introduction to Microelectronic Fabrication
Author: Richard C. Jaeger
Publisher: Pearson
ISBN: 9780201444940
Category : Integrated circuit
Languages : en
Pages : 0
Book Description
For courses in Theory and Fabrication of Integrated Circuits. The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.
Publisher: Pearson
ISBN: 9780201444940
Category : Integrated circuit
Languages : en
Pages : 0
Book Description
For courses in Theory and Fabrication of Integrated Circuits. The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.
Ion Implantation and Beam Processing
Author: J. S. Williams
Publisher: Academic Press
ISBN: 1483220648
Category : Technology & Engineering
Languages : en
Pages : 432
Book Description
Ion Implantation and Beam Processing covers the scientific and technological advances in the fields of ion implantation and beam processing. The book discusses the amorphization and crystallization of semiconductors; the application of the Boltzmann transport equation to ion implantation in semiconductors and multilayer targets; and the high energy density collision cascades and spike effects. The text also describes the implantation of insulators (ices and lithographic materials); the ion-bombardment-induced compositions changes in alloys and compounds; and the fundamentals and applications of ion beam and laser mixing. The high-dose implantation and the trends of ion implantation in silicon technology are also considered. The book further tackles the implantation in gaAs technology and the contacts and interconnections on semiconductors. Engineers and people involved in microelectronics will find the book invaluable.
Publisher: Academic Press
ISBN: 1483220648
Category : Technology & Engineering
Languages : en
Pages : 432
Book Description
Ion Implantation and Beam Processing covers the scientific and technological advances in the fields of ion implantation and beam processing. The book discusses the amorphization and crystallization of semiconductors; the application of the Boltzmann transport equation to ion implantation in semiconductors and multilayer targets; and the high energy density collision cascades and spike effects. The text also describes the implantation of insulators (ices and lithographic materials); the ion-bombardment-induced compositions changes in alloys and compounds; and the fundamentals and applications of ion beam and laser mixing. The high-dose implantation and the trends of ion implantation in silicon technology are also considered. The book further tackles the implantation in gaAs technology and the contacts and interconnections on semiconductors. Engineers and people involved in microelectronics will find the book invaluable.
Ion Beam Treatment of Polymers
Author: Alexey Kondyurin
Publisher: Elsevier
ISBN: 0080556744
Category : Technology & Engineering
Languages : en
Pages : 327
Book Description
Polymer materials are used in different fields of industries, from microelectronice to medicine. Ion beam implantation is method of surface modification when surface properties must be significantly changed and bulk properties of material must be saved. Ion Beam Treatment of Polymers contains results of polymer investigations and techniques development in the field of polymer modification by high energy ion beams. This book is intended for specialists in polymer science who have interest to use an ion beam treatment for improvement of polymer properties, for specialists in physics who search a new application of ion beam and plasma equipment and also for students who look for future fields of high technology.Chapter 1-3 are devoted to overview of the basic processes at high energy ion penetration into solid target. The historical aspects and main physical aspects are covered. A basic equipment principles and main producers of equipment for ion beam treatment are considered.Chapter 4 contains chemical transformations in polymers during and after high energy ion penetration. The modern methods and results of experimental and theoretical investigation are described.Chapters 5-10 are devoted to properties of polymers after ion beam treatment, regimes of treatment, available applications, in particular: increase of adhesion of polymers and a mechanism of an adhesion increase, wetting angle of polymer by water and its stability, adhesion of cells on polymer surface, drug release regulation from polymer coating and others.Chapter 11 contains our last results on polymerisation processes in liquid oligomer composition under high vacuum, plasma and ion beam conditions as simulation of free space environment.* By scientists working in polymer chemistry, physics of ion beam implantation and in development and production of ion beam equipment * Covering industrial and scientific applications of ion beam implanted polymers* Also for students with an interest in future fields of high technology
Publisher: Elsevier
ISBN: 0080556744
Category : Technology & Engineering
Languages : en
Pages : 327
Book Description
Polymer materials are used in different fields of industries, from microelectronice to medicine. Ion beam implantation is method of surface modification when surface properties must be significantly changed and bulk properties of material must be saved. Ion Beam Treatment of Polymers contains results of polymer investigations and techniques development in the field of polymer modification by high energy ion beams. This book is intended for specialists in polymer science who have interest to use an ion beam treatment for improvement of polymer properties, for specialists in physics who search a new application of ion beam and plasma equipment and also for students who look for future fields of high technology.Chapter 1-3 are devoted to overview of the basic processes at high energy ion penetration into solid target. The historical aspects and main physical aspects are covered. A basic equipment principles and main producers of equipment for ion beam treatment are considered.Chapter 4 contains chemical transformations in polymers during and after high energy ion penetration. The modern methods and results of experimental and theoretical investigation are described.Chapters 5-10 are devoted to properties of polymers after ion beam treatment, regimes of treatment, available applications, in particular: increase of adhesion of polymers and a mechanism of an adhesion increase, wetting angle of polymer by water and its stability, adhesion of cells on polymer surface, drug release regulation from polymer coating and others.Chapter 11 contains our last results on polymerisation processes in liquid oligomer composition under high vacuum, plasma and ion beam conditions as simulation of free space environment.* By scientists working in polymer chemistry, physics of ion beam implantation and in development and production of ion beam equipment * Covering industrial and scientific applications of ion beam implanted polymers* Also for students with an interest in future fields of high technology
The Science and Engineering of Microelectronic Fabrication
Author: Stephen A. Campbell
Publisher: Oxford University Press, USA
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 572
Book Description
The Science and Engineering of Microelectronic Fabrication provides an introduction to microelectronic processing. Geared towards a wide audience, it may be used as a textbook for both first year graduate and upper level undergraduate courses and as a handy reference for professionals. The text covers all the basic unit processes used to fabricate integrated circuits including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, nonoptical lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacturing of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The book also makes use of the process simulation package SUPREM to demonstrate impurity profiles of practical interest.
Publisher: Oxford University Press, USA
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 572
Book Description
The Science and Engineering of Microelectronic Fabrication provides an introduction to microelectronic processing. Geared towards a wide audience, it may be used as a textbook for both first year graduate and upper level undergraduate courses and as a handy reference for professionals. The text covers all the basic unit processes used to fabricate integrated circuits including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, nonoptical lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacturing of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The book also makes use of the process simulation package SUPREM to demonstrate impurity profiles of practical interest.
Introduction to Microfabrication
Author: Sami Franssila
Publisher: John Wiley & Sons
ISBN: 0470020563
Category : Technology & Engineering
Languages : en
Pages : 424
Book Description
Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.
Publisher: John Wiley & Sons
ISBN: 0470020563
Category : Technology & Engineering
Languages : en
Pages : 424
Book Description
Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.