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Author: H. J. Hamjian
Publisher:
ISBN:
Category : Boron compounds
Languages : en
Pages : 30
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Book Description
The experiments conducted with boron carbide and each of four metals showed that nickel, cobalt, and iron formed a bonding zone between the metal and the ceramic and that chromium showed satisfactory physical wetting characteristics on the ceramic.
Author: H. J. Hamjian
Publisher:
ISBN:
Category : Boron compounds
Languages : en
Pages : 30
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Book Description
The experiments conducted with boron carbide and each of four metals showed that nickel, cobalt, and iron formed a bonding zone between the metal and the ceramic and that chromium showed satisfactory physical wetting characteristics on the ceramic.
Author: M. Rühle
Publisher: Elsevier
ISBN: 1483287467
Category : Technology & Engineering
Languages : en
Pages : 448
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Book Description
As engineering materials and structures often contain a metal or metallic alloy bonded to a ceramic, the resultant interface must be able to sustain mechanical forces without failure. They also play an important role in oxidation or reduction of materials. The workshop on 'Bonding, Structure and Mechanical Properties of Metal/Ceramic Interfaces' was held in January 1989 within the Acta/Scripta Metallurgica conference series. It drew together an international collection of 70 scientists who discussed a wide range of issues related to metal-ceramic interfaces. The sessions were divided into 7 categories: structure and bonding, chemistry at interfaces, formation of interfaces, structure of interfaces, thermodynamics/atomistics of interface fracture, mechanics of interface cracks, and fracture resistance of bimaterial interfaces. Within these headings attention was paid to grain boundaries, the influence of chemical processes on the behaviour of interfaces, diffusion bonding, characterization of fracture, and crack propagation by fatigue and by stress corrosion. The book presents a useful reference source for materials scientists, physicists, chemists, and mechanical engineers who are concerned with the roles and properties of interfaces.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 2180
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Book Description
Author: Robert Edward Monroe
Publisher:
ISBN:
Category : Adhesives
Languages : en
Pages : 86
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Book Description
This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).
Author:
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ISBN:
Category : Nuclear energy
Languages : en
Pages : 1216
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Book Description
Author: United States. National Advisory Committee for Aeronautics
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 498
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Book Description
Author: Arun S. Wagh
Publisher: Elsevier
ISBN: 008100396X
Category : Technology & Engineering
Languages : en
Pages : 424
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Book Description
Chemically Bonded Phosphate Ceramics brings together the latest developments in chemically bonded phosphate ceramics (CBPCs), including several novel ceramics, from US Federal Laboratories such as Argonne, Oak Ridge, and Brookhaven National Laboratories, as well as Russian and Ukrainian nuclear institutes. Coupled with further advances in their use as biomaterials, these materials have found uses in diverse fields in recent years. Applications range from advanced structural materials to corrosion and fire protection coatings, oil-well cements, stabilization and encapsulation of hazardous and radioactive waste, nuclear radiation shielding materials, and products designed for safe storage of nuclear materials. Such developments call for a single source to cover their science and applications. This book is a unique and comprehensive source to fulfil that need. In the second edition, the author covers the latest developments in nuclear waste containment and introduces new products and applications in areas such as biomedical implants, cements and coatings used in oil-well and other petrochemical applications, and flame-retardant anti-corrosion coatings. - Explores the key applications of CBPCs including nuclear waste storage, oil-well cements, anticorrosion coatings and biomedical implants - Demystifies the chemistry, processes and production methods of CBPCs - Draws on 40 years of developments and applications in the field, including the latest developments from USA, Europe, Ukraine, Russia, China and India
Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 396
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Book Description
Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461540860
Category : Technology & Engineering
Languages : en
Pages : 742
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Book Description
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author:
Publisher:
ISBN:
Category : Medicine
Languages : en
Pages : 1422
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Book Description
