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Author: Mohammed Ismail
Publisher: Springer Science & Business Media
ISBN: 1461315352
Category : Computers
Languages : en
Pages : 191
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Book Description
Very large scale integration (VLSI) technologies are now maturing with a current emphasis toward submicron structures and sophisticated applications combining digital as well as analog circuits on a single chip. Abundant examples are found on today's advanced systems for telecom munications, robotics, automotive electronics, image processing, intelli gent sensors, etc .. Exciting new applications are being unveiled in the field of neural computing where the massive use of analog/digital VLSI technologies will have a significant impact. To match such a fast technological trend towards single chip ana logi digital VLSI systems, researchers worldwide have long realized the vital need of producing advanced computer aided tools for designing both digital and analog circuits and systems for silicon integration. Ar chitecture and circuit compilation, device sizing and the layout genera tion are but a few familiar tasks on the world of digital integrated circuit design which can be efficiently accomplished by matured computer aided tools. In contrast, the art of tools for designing and producing analog or even analogi digital integrated circuits is quite primitive and still lack ing the industrial penetration and acceptance already achieved by digital counterparts. In fact, analog design is commonly perceived to be one of the most knowledge-intensive design tasks and analog circuits are still designed, largely by hand, by expert intimately familiar with nuances of the target application and integrated circuit fabrication process. The techniques needed to build good analog circuits seem to exist solely as expertise invested in individual designers.
Author: Mohammed Ismail
Publisher: Springer Science & Business Media
ISBN: 1461315352
Category : Computers
Languages : en
Pages : 191
Get Book Here
Book Description
Very large scale integration (VLSI) technologies are now maturing with a current emphasis toward submicron structures and sophisticated applications combining digital as well as analog circuits on a single chip. Abundant examples are found on today's advanced systems for telecom munications, robotics, automotive electronics, image processing, intelli gent sensors, etc .. Exciting new applications are being unveiled in the field of neural computing where the massive use of analog/digital VLSI technologies will have a significant impact. To match such a fast technological trend towards single chip ana logi digital VLSI systems, researchers worldwide have long realized the vital need of producing advanced computer aided tools for designing both digital and analog circuits and systems for silicon integration. Ar chitecture and circuit compilation, device sizing and the layout genera tion are but a few familiar tasks on the world of digital integrated circuit design which can be efficiently accomplished by matured computer aided tools. In contrast, the art of tools for designing and producing analog or even analogi digital integrated circuits is quite primitive and still lack ing the industrial penetration and acceptance already achieved by digital counterparts. In fact, analog design is commonly perceived to be one of the most knowledge-intensive design tasks and analog circuits are still designed, largely by hand, by expert intimately familiar with nuances of the target application and integrated circuit fabrication process. The techniques needed to build good analog circuits seem to exist solely as expertise invested in individual designers.
Author: Sina Balkir
Publisher: CRC Press
ISBN: 1135515433
Category : Computers
Languages : en
Pages : 199
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Book Description
The explosive growth and development of the integrated circuit market over the last few years have been mostly limited to the digital VLSI domain. The difficulty of automating the design process in the analog domain, the fact that a general analog design methodology remained undefined, and the poor performance of earlier tools have left the analog
Author: Sina Balkir
Publisher: CRC Press
ISBN: 0203492757
Category : Computers
Languages : en
Pages : 199
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Book Description
The explosive growth and development of the integrated circuit market over the last few years have been mostly limited to the digital VLSI domain. The difficulty of automating the design process in the analog domain, the fact that a general analog design methodology remained undefined, and the poor performance of earlier tools have left the analog
Author: Ricardo M. F. Martins
Publisher: Springer Science & Business Media
ISBN: 3642331467
Category : Technology & Engineering
Languages : en
Pages : 104
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Book Description
This book presents an innovative methodology for the automatic generation of analog integrated circuits (ICs) layout, based on template descriptions and on evolutionary computational techniques. A design automation tool, LAYGEN II was implemented to validate the proposed approach giving special emphasis to reusability of expert design knowledge and to efficiency on retargeting operations.
Author: Yoshiyasu Takefuji
Publisher: Springer Science & Business Media
ISBN: 1461535824
Category : Technology & Engineering
Languages : en
Pages : 132
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Book Description
This book brings together in one place important contributions and state-of-the-art research in the rapidly advancing area of analog VLSI neural networks. The book serves as an excellent reference, providing insights into some of the most important issues in analog VLSI neural networks research efforts.
Author: Willy M.C. Sansen
Publisher: Springer Science & Business Media
ISBN: 1475723105
Category : Technology & Engineering
Languages : en
Pages : 319
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Book Description
This volume concentrates on three topics: mixed analog--digital circuit design, sensor interface circuits and communication circuits. The book comprises six papers on each topic of a tutorial nature aimed at improving the design of analog circuits. The book is divided into three parts. Part I: Mixed Analog--Digital Circuit Design considers the largest growth area in microelectronics. Both standard designs and ASICs have begun integrating analog cells and digital sections on the same chip. The papers cover topics such as groundbounce and supply-line spikes, design methodologies for high-level design and actual mixed analog--digital designs. Part II: Sensor Interface Circuits describes various types of signal conditioning circuits and interfaces for sensors. These include interface solutions for capacitive sensors, sigma--delta modulation used to combine a microprocessor compatible interface with on chip CMOS sensors, injectable sensors and responders, signal conditioning circuits and sensors combined with indirect converters. Part III: Communication Circuits concentrates on systems and implemented circuits for use in personal communication systems. These have applications in cordless telephones and mobile telephone systems for use in cellular networks. A major requirement for these systems is low power consumption, especially when operating in standby mode, so as to maximise the time between battery recharges.
Author: Nuno Lourenço
Publisher: Springer
ISBN: 3319420372
Category : Technology & Engineering
Languages : en
Pages : 199
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Book Description
This book introduces readers to a variety of tools for automatic analog integrated circuit (IC) sizing and optimization. The authors provide a historical perspective on the early methods proposed to tackle automatic analog circuit sizing, with emphasis on the methodologies to size and optimize the circuit, and on the methodologies to estimate the circuit’s performance. The discussion also includes robust circuit design and optimization and the most recent advances in layout-aware analog sizing approaches. The authors describe a methodology for an automatic flow for analog IC design, including details of the inputs and interfaces, multi-objective optimization techniques, and the enhancements made in the base implementation by using machine leaning techniques. The Gradient model is discussed in detail, along with the methods to include layout effects in the circuit sizing. The concepts and algorithms of all the modules are thoroughly described, enabling readers to reproduce the methodologies, improve the quality of their designs, or use them as starting point for a new tool. An extensive set of application examples is included to demonstrate the capabilities and features of the methodologies described.
Author: Marzuki, Arjuna
Publisher: IGI Global
ISBN: 1605668877
Category : Technology & Engineering
Languages : en
Pages : 379
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Book Description
Monolithic Microwave Integrated Circuit (MMIC) is an electronic device that is widely used in all high frequency wireless systems. In developing MMIC as a product, understanding analysis and design techniques, modeling, measurement methodology, and current trends are essential.Advances in Monolithic Microwave Integrated Circuits for Wireless Systems: Modeling and Design Technologies is a central source of knowledge on MMIC development, containing research on theory, design, and practical approaches to integrated circuit devices. This book is of interest to researchers in industry and academia working in the areas of circuit design, integrated circuits, and RF and microwave, as well as anyone with an interest in monolithic wireless device development.
Author: Randeep Singh Soin
Publisher: IET
ISBN: 9780863412592
Category : Technology & Engineering
Languages : en
Pages : 480
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Book Description
For many applications, circuits that combine analog and digital signals can provide superior solutions to those produced with digital signals alone. Eighteen contributions in four sections--processing technology, circuit techniques and building blocks, design and applications, and CAD and supporting tools--detail and support this new approach. Annotation copyrighted by Book News, Inc., Portland, OR
Author: J.-P. Colinge
Publisher: Springer Science & Business Media
ISBN: 1475721218
Category : Technology & Engineering
Languages : en
Pages : 236
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Book Description
5. 2. Distinction between thick- and thin-film devices . . . . . . . . . . . . . . . . . . . . 109 5. 3. I-V Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 5. 3. 1. Threshold voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2 5. 3 . 2. Body effecL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 8 5. 3. 3. Short-channel effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 5. 3. 4. Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 24 5. 4. Transconductance and mobility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 5. 4. 1 Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 5. 4. 2. Mobility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 5. 5. Subthreshold slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 5. 6. Impact ionization and high-field effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 9 5. 6. 1. Kink effecL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 39 5. 6. 2. Hot-electron degradation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 5. 7. Parasitic bipolar effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 5. 7. 1. Anomalous subthreshold slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 45 5. 7. 2. Reduced drain breakdown voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7 5. 8. Accumulation-mode p-channel MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 CHAPTER 6 - Other SOl Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 9 6. 1. Non-conventional devices adapted from bulk . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 6. 1. 1. COMFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 6. 1. 2. High-voltage lateral MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6 1 6. 1. 3. PIN photodiode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 6. 1. 4. JFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 6. 2. Novel SOl devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 6. 2. 1. Lubistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 6. 2. 2. Bipolar-MOS device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 6. 2. 3. Double-gate MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 69 6. 2. 4. Bipolar transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 6. 2. 5. Optical modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 74 CHAPTER 7 - The sm MOSFET Operating in a Harsh Environment. . . . . . . . 1 77 7. 1. Radiation environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7 7 7. 1. 1. SEU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 7. 1. 2. Total dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 7. 1. 3. Dose-rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 8 4 7. 2. High-temperature operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 85 7. 2. 1. Leakage currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
