Proceedings of the 1992 International Symposium on Microelectronics, October 19-21, 1992, Moscone Center, San Francisco, California PDF Download
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Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776
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Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776
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Book Description
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 992
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Book Description
Author: Andrzej Sowiński
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 672
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Author:
Publisher: International Society for Hybrid Microelectronics
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 738
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Book Description
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 588
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Author: International Symposium on Microelectronics
Publisher:
ISBN: 9780930815448
Category : Microelectronics
Languages : en
Pages : 584
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Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 346
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Author: Vijay Nath
Publisher: Springer
ISBN: 9811082340
Category : Technology & Engineering
Languages : en
Pages : 834
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Book Description
The volume presents high quality papers presented at the Second International Conference on Microelectronics, Computing & Communication Systems (MCCS 2017). The book discusses recent trends in technology and advancement in MEMS and nanoelectronics, wireless communications, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems, and sensor network applications. It includes original papers based on original theoretical, practical, experimental, simulations, development, application, measurement, and testing. The applications and solutions discussed in the book will serve as a good reference material for future works.
Author: World Telecommunication Forum
Publisher: Information Gatekeepers Inc
ISBN:
Category :
Languages : en
Pages : 44
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