Author: Francesc Moll
Publisher: Springer Science & Business Media
ISBN: 0306487195
Category : Technology & Engineering
Languages : en
Pages : 214
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Book Description
This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.
Author: Rohit Dhiman
Publisher: Springer
ISBN: 813222132X
Category : Technology & Engineering
Languages : en
Pages : 122
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Book Description
The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.
Author: Yue Ma
Publisher: CRC Press
ISBN: 0429680066
Category : Computers
Languages : en
Pages : 279
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Book Description
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Author: Jari Nurmi
Publisher: Springer Science & Business Media
ISBN: 1402078366
Category : Technology & Engineering
Languages : en
Pages : 450
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Book Description
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
Author: H. B. Bakoglu
Publisher: Addison Wesley Publishing Company
ISBN:
Category : Computers
Languages : en
Pages : 552
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Book Description
Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 1420036661
Category : Technology & Engineering
Languages : en
Pages : 2636
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Book Description
During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.
Author: S. Jayanthy
Publisher: Springer
ISBN: 981132493X
Category : Technology & Engineering
Languages : en
Pages : 161
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Book Description
This book describes a variety of test generation algorithms for testing crosstalk delay faults in VLSI circuits. It introduces readers to the various crosstalk effects and describes both deterministic and simulation-based methods for testing crosstalk delay faults. The book begins with a focus on currently available crosstalk delay models, test generation algorithms for delay faults and crosstalk delay faults, before moving on to deterministic algorithms and simulation-based algorithms used to test crosstalk delay faults. Given its depth of coverage, the book will be of interest to design engineers and researchers in the field of VLSI Testing.
Author: Sandip Bhattacharya
Publisher: CRC Press
ISBN: 1003817092
Category : Technology & Engineering
Languages : en
Pages : 251
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Book Description
Aggressive scaling of device and interconnect dimensions has resulted in many low dimensional issues in the nanometer regime. This book deals with various new generation interconnect materials and interconnect modeling and highlights the significance of novel nano interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focusses on materials and nanomaterials utilization in next generation interconnects based on Carbon nanotubes (CNT) and Graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes Hybrid CNT and GNR based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, nano/microelectronics.
Author: Natarajan Meghanathan
Publisher: Springer Science & Business Media
ISBN: 3642315992
Category : Computers
Languages : en
Pages : 712
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Book Description
The international conference on Advances in Computing and Information technology (ACITY 2012) provides an excellent international forum for both academics and professionals for sharing knowledge and results in theory, methodology and applications of Computer Science and Information Technology. The Second International Conference on Advances in Computing and Information technology (ACITY 2012), held in Chennai, India, during July 13-15, 2012, covered a number of topics in all major fields of Computer Science and Information Technology including: networking and communications, network security and applications, web and internet computing, ubiquitous computing, algorithms, bioinformatics, digital image processing and pattern recognition, artificial intelligence, soft computing and applications. Upon a strength review process, a number of high-quality, presenting not only innovative ideas but also a founded evaluation and a strong argumentation of the same, were selected and collected in the present proceedings, that is composed of three different volumes.
Author: Chris Toumazou
Publisher: Springer Science & Business Media
ISBN: 0306476738
Category : Technology & Engineering
Languages : en
Pages : 1065
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Book Description
As the frequency of communication systems increases and the dimensions of transistors are reduced, more and more stringent performance requirements are placed on analog circuits. This is a trend that is bound to continue for the foreseeable future and while it does, understanding performance trade-offs will constitute a vital part of the analog design process. It is the insight and intuition obtained from a fundamental understanding of performance conflicts and trade-offs, that ultimately provides the designer with the basic tools necessary for effective and creative analog design. Trade-offs in Analog Circuit Design, which is devoted to the understanding of trade-offs in analog design, is quite unique in that it draws together fundamental material from, and identifies interrelationships within, a number of key analog circuits. The book covers ten subject areas: Design methodology, Technology, General Performance, Filters, Switched Circuits, Oscillators, Data Converters, Transceivers, Neural Processing, and Analog CAD. Within these subject areas it deals with a wide diversity of trade-offs ranging from frequency-dynamic range and power, gain-bandwidth, speed-dynamic range and phase noise, to tradeoffs in design for manufacture and IC layout. The book has by far transcended its original scope and has become both a designer's companion as well as a graduate textbook. An important feature of this book is that it promotes an intuitive approach to understanding analog circuits by explaining fundamental relationships and, in many cases, providing practical illustrative examples to demonstrate the inherent basic interrelationships and trade-offs. Trade-offs in Analog Circuit Design draws together 34 contributions from some of the world's most eminent analog circuits-and-systems designers to provide, for the first time, a comprehensive text devoted to a very important and timely approach to analog circuit design.
