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Author: Chung-Kuan Cheng
Publisher: Wiley-Interscience
ISBN:
Category : Computers
Languages : en
Pages : 288
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Book Description
State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Author: Chung-Kuan Cheng
Publisher: Wiley-Interscience
ISBN:
Category : Computers
Languages : en
Pages : 288
Get Book Here
Book Description
State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Author: Jari Nurmi
Publisher: Springer Science & Business Media
ISBN: 1402078366
Category : Technology & Engineering
Languages : en
Pages : 450
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Book Description
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
Author: Mustafa Celik
Publisher: Springer Science & Business Media
ISBN: 0306479710
Category : Technology & Engineering
Languages : en
Pages : 316
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Book Description
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.
Author: Krishnendu Chakrabarty
Publisher: Springer Science & Business Media
ISBN: 9781402072055
Category : Computers
Languages : en
Pages : 218
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Book Description
Various aspects of system-on-a-chip (SOC) integrated circuit testing are addressed in 13 papers on test planning, access, and scheduling; test data compression; and interconnect, crosstalk, and signal integrity. Topics include concurrent test of core-based SOC design and testing for interconnect crosstalk defects using on-chip embedded processor cores. The editor is affiliated with Duke University. The book is reprinted from a Special Issue of the Journal of Electronic Testing, vol. 18, nos. 4 & 5. There is no subject index. Annotation (c)2003 Book News, Inc., Portland, OR (booknews.com).
Author: Zhanhai Qin
Publisher: Springer Science & Business Media
ISBN: 0387239057
Category : Technology & Engineering
Languages : en
Pages : 295
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Book Description
Symbolic analysis is an intriguing topic in VLSI designs. The analysis methods are crucial for the applications to the parasitic reduction and analog circuit evaluation. However, analyzing circuits symbolically remains a challenging research issue. Therefore, in this book, we survey the recent results as the progress of on-going works rather than as the solution of the field. For parasitic reduction, we approximate a huge amount of electrical parameters into a simplified RLC network. This reduction allows us to handle very large integrated circuits with given memory capacity and CPU time. A symbolic analysis approach reduces the circuit according to the network topology. Thus, the designer can maintain the meaning of the original network and perform the analysis hierarchically. For analog circuit designs, symbolic analysis provides the relation between the tunable parameters and the characteristics of the circuit. The analysis allows us to optimize the circuit behavior. The book is divided into three parts. Part I touches on the basics of circuit analysis in time domain and in s domain. For an s domain expression, the Taylor's expansion with s approaching infinity is equivalent to the time domain solution after the inverse Laplace transform. On the other hand, the Taylor's expansion when s approaches zero derives the moments of the output responses in time domain. Part II focuses on the techniques for parasitic reduction. In Chapter 2, we present the approximation methods to match the first few moments with reduced circuit orders. In Chapter 3, we apply the Y-Delta transformation to reduce the dynamic linear network. The method finds the exact values of the low order coefficients of the numerator and denominator of the transfer function and thus matches part of the moments. In Chapter 4, we handle two major issues of the Y-Delta transformation: common factors in fractional expressions and round-off errors. Chapter 5 explains the stability of the reduced expression, in particular the Ruth-Hurwitz Criterion. We make an effort to describe the proof of the Criterion because the details are omitted in most of the contemporary textbooks. In Chapter 6, we present techniques to synthesize circuits to approximate the reduced expressions after the transformation. In Part III, we discuss symbolic generation of the determinants and cofactors for the application to analog designs. In Chapter 7, we depict the classical topological analysis approach. In Chapter 8, we describe a determinant decision diagram approach that exploits the sparsity of the matrix to accelerate the computation. In Chapter 9, we take only significant terms when we search through determinant decision diagram to approximate the solution. In Chapter 10, we extend the determinant decision diagram to a hierarchical model. The construction of the modules through the hierarchy is similar to the Y-Delta transformation in the sense that a byproduct of common factors appears in the numerator and denominator. Therefore, we describe the method to prune the common factors.
Author: Sudeep Pasricha
Publisher: Morgan Kaufmann
ISBN: 0080558283
Category : Technology & Engineering
Languages : en
Pages : 541
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Book Description
Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. On-Chip Communication Architecures is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. - A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends - Detailed analysis of all popular standards for on-chip communication architectures - Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts - Future trends that with have a significant impact on research and design of communication architectures over the next several years
Author: Albert Ruehli
Publisher: John Wiley & Sons
ISBN: 1119078393
Category : Technology & Engineering
Languages : en
Pages : 465
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Book Description
Bridges the gap between electromagnetics and circuits by addressing electrometric modeling (EM) using the Partial Element Equivalent Circuit (PEEC) method This book provides intuitive solutions to electromagnetic problems by using the Partial Element Equivalent Circuit (PEEC) method. This book begins with an introduction to circuit analysis techniques, laws, and frequency and time domain analyses. The authors also treat Maxwell's equations, capacitance computations, and inductance computations through the lens of the PEEC method. Next, readers learn to build PEEC models in various forms: equivalent circuit models, non-orthogonal PEEC models, skin-effect models, PEEC models for dielectrics, incident and radiate field models, and scattering PEEC models. The book concludes by considering issues like stability and passivity, and includes five appendices some with formulas for partial elements. Leads readers to the solution of a multitude of practical problems in the areas of signal and power integrity and electromagnetic interference Contains fundamentals, applications, and examples of the PEEC method Includes detailed mathematical derivations Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques is a reference for students, researchers, and developers who work on the physical layer modeling of IC interconnects and Packaging, PCBs, and high speed links.
Author: Cher-Ming Tan
Publisher: CRC Press
ISBN: 1000470687
Category : Science
Languages : en
Pages : 121
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Book Description
Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it is approaching its limits with respect to electrical performance and reliability. Graphene is a non-metal material, but it can help to improve electromigration (EM) performance of Cu because of its excellent properties. Combining graphene with Cu for very large-scale integration (VLSI) interconnects can be a viable solution. The incorporation of graphene into Cu allows the present Cu fabrication back-end process to remain unaltered, except for the small step of “inserting” graphene into Cu. Therefore, it has a great potential to revolutionize the VLSI integrated circuit (VLSI-IC) industry and appeal for further advancement of the semiconductor industry. This book is a compilation of comprehensive studies done on the properties of graphene and its synthesis methods suitable for applications of VLSI interconnects. It introduces the development of a new method to synthesize graphene, wherein it not only discusses the method to grow graphene over Cu but also allows the reader to know how to optimize graphene growth, using statistical design of experiments (DoE), on Cu interconnects in order to obtain good-quality and reliable interconnects. It provides a basic understanding of graphene–Cu interaction mechanism and evaluates the electrical and EM performance of graphenated Cu interconnects.
Author: Charles J. Alpert
Publisher: CRC Press
ISBN: 0849372429
Category : Computers
Languages : en
Pages : 1044
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Book Description
The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in technology. Handbook of Algorithms for Physical Design Automation provides a detailed overview of VLSI physical design automation, emphasizing state-of-the-art techniques, trends and improvements that have emerged during the previous decade. After a brief introduction to the modern physical design problem, basic algorithmic techniques, and partitioning, the book discusses significant advances in floorplanning representations and describes recent formulations of the floorplanning problem. The text also addresses issues of placement, net layout and optimization, routing multiple signal nets, manufacturability, physical synthesis, special nets, and designing for specialized technologies. It includes a personal perspective from Ralph Otten as he looks back on the major technical milestones in the history of physical design automation. Although several books on this topic are currently available, most are either too broad or out of date. Alternatively, proceedings and journal articles are valuable resources for researchers in this area, but the material is widely dispersed in the literature. This handbook pulls together a broad variety of perspectives on the most challenging problems in the field, and focuses on emerging problems and research results.
Author: Raminderpal Singh
Publisher: John Wiley & Sons
ISBN: 0471150428
Category : Technology & Engineering
Languages : en
Pages : 484
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Book Description
"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
