NBS Special Publication PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download NBS Special Publication PDF full book. Access full book title NBS Special Publication by . Download full books in PDF and EPUB format.
Author:
Publisher:
ISBN:
Category : Weights and measures
Languages : en
Pages : 1064
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Weights and measures
Languages : en
Pages : 1064
Get Book Here
Book Description
Author: United States. Bureau of Adult, Vocational, and Technical Education
Publisher:
ISBN:
Category : Machine-tools
Languages : en
Pages : 108
Get Book Here
Book Description
Author: Leonard B. Gardner
Publisher: ASTM International
ISBN: 9780803104228
Category : Technology & Engineering
Languages : en
Pages : 258
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 204
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Public administration
Languages : en
Pages : 200
Get Book Here
Book Description
Author: William J. Slattery
Publisher:
ISBN:
Category : Standards, Engineering
Languages : en
Pages : 1016
Get Book Here
Book Description
Author: United States. Congress. House. Committee on Government Operations. Government Activities Subcommittee
Publisher:
ISBN:
Category : Executive departments
Languages : en
Pages : 286
Get Book Here
Book Description
Author: Phil Marcoux
Publisher: Springer Science & Business Media
ISBN: 1461535328
Category : Technology & Engineering
Languages : en
Pages : 351
Get Book Here
Book Description
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Author: United States. National Bureau of Standards
Publisher:
ISBN:
Category : Standards, Engineering
Languages : en
Pages : 1038
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : United States
Languages : en
Pages : 782
Get Book Here
Book Description
