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Author: Arthur Bernard Williams
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Author: Arthur Bernard Williams
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 352762306X
Category : Technology & Engineering
Languages : en
Pages : 798
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Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Author: Thomas R. Powers
Publisher: TAB/Electronics
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 540
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Book Description
Author: Ulrich Tietze
Publisher: Springer
ISBN: 3540786554
Category : Technology & Engineering
Languages : en
Pages : 1544
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Book Description
Electronic Circuits covers all important aspects and applications of modern analog and digital circuit design. The basics, such as analog and digital circuits, on operational amplifiers, combinatorial and sequential logic and memories, are treated in Part I, while Part II deals with applications. Each chapter offers solutions that enable the reader to understand ready-made circuits or to proceed quickly from an idea to a working circuit, and always illustrated by an example. Analog applications cover such topics as analog computing circuits. The digital sections deal with AD and DA conversion, digital computing circuits, microprocessors and digital filters. This editions contains the basic electronics for mobile communications. The accompanying CD-ROM contains PSPICE software, an analog-circuit-simulation package, plus simulation examples and model libraries related to the book topics.
Author: Yangyuan Wang
Publisher: Springer Nature
ISBN: 9819928362
Category : Technology & Engineering
Languages : en
Pages : 2006
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Book Description
Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
Author: Michael Tooley
Publisher: Elsevier
ISBN: 1483105369
Category : Technology & Engineering
Languages : en
Pages : 296
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Book Description
The Maplin Electronic Circuits Handbook provides pertinent data, formula, explanation, practical guidance, theory and practical guidance in the design, testing, and construction of electronic circuits. This book discusses the developments in electronics technology techniques. Organized into 11 chapters, this book begins with an overview of the common types of passive component. This text then provides the reader with sufficient information to make a correct selection of passive components for use in the circuits. Other chapters consider the various types of the most commonly used semiconductor devices. This book discusses as well the correct operation of the power supply, which is crucial to most electronic circuits. The final chapter deals with the final Maplin project, Gavin Cheeseman's DigiDice, which makes use of digital rather than analog methods and neatly shows how electronics can be put to use in a novel yet familiar application. This book is a valuable resource for electronic engineers, students and electronics enthusiasts.
Author: Thomas R. Powers
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 119
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Book Description
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: John Markus
Publisher: McGraw-Hill Companies
ISBN: 9780070404458
Category : Technology & Engineering
Languages : en
Pages : 1082
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Book Description
Contains more than thirty-six hundred recently published circuit diagrams together with information on component values, performance, and applications.
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1420007955
Category : Technology & Engineering
Languages : en
Pages : 608
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Book Description
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
