Author: José Pineda de Gyvez
Publisher: Springer Science & Business Media
ISBN: 1461531586
Category : Technology & Engineering
Languages : en
Pages : 181
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Book Description
The history of this book begins way back in 1982. At that time a research proposal was filed with the Dutch Foundation for Fundamental Research on Matter concerning research to model defects in the layer structure of integrated circuits. It was projected that the results may be useful for yield estimates, fault statistics and for the design of fault tolerant structures. The reviewers were not in favor of this proposal and it disappeared in the drawers. Shortly afterwards some microelectronics industries realized that their survival may depend on a better integration between technology-and design-laboratories. For years the "silicon foundry" concept had suggested a fairly rigorous separation between the two areas. The expectation was that many small design companies would share the investment into the extremely costful Silicon fabrication plants while designing large lots of application-specific integrated circuits (ASIC's). Those fabrication plants would be concentrated with only a few market leaders.
Author: José Pineda de Gyvez
Publisher: John Wiley & Sons
ISBN: 0780334477
Category : Technology & Engineering
Languages : en
Pages : 338
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Book Description
"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
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Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Author: Jose Pineda de Gyvez
Publisher: Springer
ISBN: 9780792393061
Category : Technology & Engineering
Languages : en
Pages : 167
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Book Description
The history of this book begins way back in 1982. At that time a research proposal was filed with the Dutch Foundation for Fundamental Research on Matter concerning research to model defects in the layer structure of integrated circuits. It was projected that the results may be useful for yield estimates, fault statistics and for the design of fault tolerant structures. The reviewers were not in favor of this proposal and it disappeared in the drawers. Shortly afterwards some microelectronics industries realized that their survival may depend on a better integration between technology-and design-laboratories. For years the "silicon foundry" concept had suggested a fairly rigorous separation between the two areas. The expectation was that many small design companies would share the investment into the extremely costful Silicon fabrication plants while designing large lots of application-specific integrated circuits (ASIC's). Those fabrication plants would be concentrated with only a few market leaders.
Author: Abraham Landzberg
Publisher: Springer Science & Business Media
ISBN: 1461520290
Category : Technology & Engineering
Languages : en
Pages : 663
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Book Description
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Author: Mark (Mohammad) Tehranipoor
Publisher: Springer
ISBN: 3319118242
Category : Technology & Engineering
Languages : en
Pages : 282
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Book Description
This timely and exhaustive study offers a much-needed examination of the scope and consequences of the electronic counterfeit trade. The authors describe a variety of shortcomings and vulnerabilities in the electronic component supply chain, which can result in counterfeit integrated circuits (ICs). Not only does this book provide an assessment of the current counterfeiting problems facing both the public and private sectors, it also offers practical, real-world solutions for combatting this substantial threat. · Helps beginners and practitioners in the field by providing a comprehensive background on the counterfeiting problem; · Presents innovative taxonomies for counterfeit types, test methods, and counterfeit defects, which allows for a detailed analysis of counterfeiting and its mitigation; · Provides step-by-step solutions for detecting different types of counterfeit ICs; · Offers pragmatic and practice-oriented, realistic solutions to counterfeit IC detection and avoidance, for industry and government.
Author: Rodrigo Possamai Bastos
Publisher: Springer Nature
ISBN: 303029353X
Category : Technology & Engineering
Languages : en
Pages : 187
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Book Description
This book provides readers with insight into an alternative approach for enhancing the reliability, security, and low power features of integrated circuit designs, related to transient faults, hardware Trojans, and power consumption. The authors explain how the addition of integrated sensors enables the detection of ionizing particles and how this information can be processed at a high layer. The discussion also includes a variety of applications, such as the detection of hardware Trojans and fault attacks, and how sensors can operate to provide different body bias levels and reduce power costs. Readers can benefit from these sensors-based approaches through designs with fast response time, non-intrusive integration on gate-level and reasonable design costs.
Author: Robert P. Donovan
Publisher: CRC Press
ISBN: 1482289997
Category : Technology & Engineering
Languages : en
Pages : 461
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Book Description
Recognizing the need for improved control measures in the manufacturing process of highly sensitized semiconductor technology, this practical reference provides in-depth and advanced treatment on the origins, procedures, and disposal of a variety of contaminants. It uses contemporary examples based on the latest hardware and processing apparatus to illustrate previously unavailable results and insights along with experimental and theoretical developments. Ensures the proper methods necessary to meet the standards established in the 1997 National Technology Roadmap for Semiconductors (NTRS)! Summarizing up-to-date control practices in the industry, Contamination-Free Manufacturing for Semiconductors and Other Precision Products: Details the physics and chemistry behind the mechanisms leading to contamination-induced failures Considers particles and molecular contaminants, including the entire spectrum of mass-based contaminants Outlines primary contamination problems and target control levels Reveals and offers solutions to inadequate areas of measurement capability and control technology Clarifies significant problems and decisions facing the industry by analyzing NTRS standards and contamination mechanisms Containing over 700 literature references, drawings, photographs, equations, and tables, Contamination-Free Manufacturing for Semiconductors and Other Precision Products is an essential reference for electrical and electronics, instrumentation, process, manufacturing, development, contamination control and quality engineers; physicists; and upper-level undergraduate and graduate students in these disciplines.
Author: Stuart K. Tewksbury
Publisher: Springer Science & Business Media
ISBN: 1461316251
Category : Technology & Engineering
Languages : en
Pages : 456
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Book Description
From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.
Author: Jose Pineda De Gyvez
Publisher:
ISBN: 9781461531593
Category :
Languages : en
Pages : 196
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Book Description
