In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing PDF Download
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Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 266
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 266
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Book Description
Author: D. Harame
Publisher: The Electrochemical Society
ISBN: 1607685434
Category :
Languages : en
Pages : 1042
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 266
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 218
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Book Description
Author: Sergio Ajuria
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Science
Languages : en
Pages : 352
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Book Description
These conference proceedings consist of 47 papers addressing a variety of issues concerning in-line methods and monitors for process and yield improvement.
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 246
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Book Description
Author: Reinhold Klockenkämper
Publisher: John Wiley & Sons
ISBN: 1118985877
Category : Science
Languages : en
Pages : 552
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Book Description
Explores the uses of TXRF in micro- and trace analysis, and insurface- and near-surface-layer analysis • Pinpoints new applications of TRXF in different fieldsof biology, biomonitoring, material and life sciences, medicine,toxicology, forensics, art history, and archaeometry • Updated and detailed sections on sample preparationtaking into account nano- and picoliter techniques • Offers helpful tips on performing analyses, includingsample preparations, and spectra recording and interpretation • Includes some 700 references for further study
Author:
Publisher: ASM International
ISBN: 0871707691
Category : Technology & Engineering
Languages : en
Pages : 160
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Book Description
Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Author:
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 554
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Book Description
Author: Abraham Landzberg
Publisher: Springer Science & Business Media
ISBN: 1461520290
Category : Technology & Engineering
Languages : en
Pages : 663
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Book Description
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
