III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535 PDF Download
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Author: S. A. Ringel
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 338
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Book Description
This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.
Author: S. A. Ringel
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 338
Get Book Here
Book Description
This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 336
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Book Description
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 844
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Book Description
Author: Ed Bowker Staff
Publisher: R. R. Bowker
ISBN: 9780835246422
Category : Reference
Languages : en
Pages : 3274
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Book Description
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 470
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Book Description
Author: Rose Arny
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 1608
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Book Description
Author: John Wilson
Publisher: Prentice Hall
ISBN:
Category : Science
Languages : en
Pages : 584
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Book Description
The Third Edition of this best-selling textbook continues the successful approach adopted by previous editions - It is an introduction to optoelectronics for all students, undergraduate or postgraduate, and practicing engineers requiring a treatment that is not too advanced but gives a good introduction to the quantitative aspects of the subject. The book aims to put special emphasis on the fundamental principles which underlie the operation of devices and systems. Readers will then be able to appreciate the operation of devices not covered in the book and to understand future developments within the subject. All the material in this edition has been fully updated.
Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 3662108275
Category : Science
Languages : en
Pages : 510
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Book Description
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author: Paul R. Prucnal
Publisher: CRC Press
ISBN: 1498725244
Category : Science
Languages : en
Pages : 412
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Book Description
This book sets out to build bridges between the domains of photonic device physics and neural networks, providing a comprehensive overview of the emerging field of "neuromorphic photonics." It includes a thorough discussion of evolution of neuromorphic photonics from the advent of fiber-optic neurons to today’s state-of-the-art integrated laser neurons, which are a current focus of international research. Neuromorphic Photonics explores candidate interconnection architectures and devices for integrated neuromorphic networks, along with key functionality such as learning. It is written at a level accessible to graduate students, while also intending to serve as a comprehensive reference for experts in the field.
