IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF Download
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Author:
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Category : Electronic apparatus and appliances
Languages : en
Pages : 194
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![IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF](https://books.google.com/books/content/images/frontcover/4wlWAAAAMAAJ?fife=w80-h100)
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 194
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 370
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Author: Walt Trybula
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 536
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Book Description
Author: Sonia Chernova
Publisher: Morgan & Claypool Publishers
ISBN: 1681731797
Category : Computers
Languages : en
Pages : 165
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Book Description
Learning from Demonstration (LfD) explores techniques for learning a task policy from examples provided by a human teacher. The field of LfD has grown into an extensive body of literature over the past 30 years, with a wide variety of approaches for encoding human demonstrations and modeling skills and tasks. Additionally, we have recently seen a focus on gathering data from non-expert human teachers (i.e., domain experts but not robotics experts). In this book, we provide an introduction to the field with a focus on the unique technical challenges associated with designing robots that learn from naive human teachers. We begin, in the introduction, with a unification of the various terminology seen in the literature as well as an outline of the design choices one has in designing an LfD system. Chapter 2 gives a brief survey of the psychology literature that provides insights from human social learning that are relevant to designing robotic social learners. Chapter 3 walks through an LfD interaction, surveying the design choices one makes and state of the art approaches in prior work. First, is the choice of input, how the human teacher interacts with the robot to provide demonstrations. Next, is the choice of modeling technique. Currently, there is a dichotomy in the field between approaches that model low-level motor skills and those that model high-level tasks composed of primitive actions. We devote a chapter to each of these. Chapter 7 is devoted to interactive and active learning approaches that allow the robot to refine an existing task model. And finally, Chapter 8 provides best practices for evaluation of LfD systems, with a focus on how to approach experiments with human subjects in this domain.
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Jia-Wei Chang
Publisher: Springer Nature
ISBN: 9811601151
Category : Technology & Engineering
Languages : en
Pages : 2343
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Book Description
This book gathers the proceedings of the 10th International Conference on Frontier Computing, held in Singapore, on July 10–13, 2020, and provides comprehensive coverage of the latest advances and trends in information technology, science, and engineering. It addresses a number of broad themes, including communication networks, business intelligence and knowledge management, web intelligence, and related fields that inspire the development of information technology. The respective contributions cover a wide range of topics: database and data mining, networking and communications, web and Internet of things, embedded systems, soft computing, social network analysis, security and privacy, optical communication, and ubiquitous/pervasive computing. Many of the papers outline promising future research directions, and the book benefits students, researchers, and professionals alike. Further, it offers a useful reference guide for newcomers to the field.
Author: Juan De Vicente
Publisher: BoD – Books on Demand
ISBN: 9535101870
Category : Science
Languages : en
Pages : 354
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Book Description
This book contains a wealth of useful information on current rheology research. By covering a broad variety of rheology-related topics, this e-book is addressed to a wide spectrum of academic and applied researchers and scientists but it could also prove useful to industry specialists. The subject areas include, polymer gels, food rheology, drilling fluids and liquid crystals among others.
Author: YongAn Huang
Publisher: Springer
ISBN: 981133627X
Category : Technology & Engineering
Languages : en
Pages : 297
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Book Description
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Author: Dongkai Shangguan
Publisher: ASM International
ISBN: 161503093X
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
Author: Stefan Voß
Publisher: Springer Science & Business Media
ISBN: 3790823619
Category : Business & Economics
Languages : en
Pages : 482
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Book Description
Die Globalisierung und Virtualisierung von Geschäftsbeziehungen vergrößert die Bedeutung und die Komplexität logistischer Herausforderungen. Das Management logistischer Netzwerke wird zu einem wesentlichen Wettbewerbsfaktor für Unternehmen. Das Buch wie die gleichnamige Tagung (September 2009) haben zum Ziel, den internationalen Gedankenaustausch und die Diskussion zwischen Wissenschaft und Praxis gezielt zu fördern, damit Strategien, Methoden und Werkzeuge entwickelt werden können, die es ermöglichen, den wachsenden Anforderungen gerecht zu werden.
