SiP System-in-Package Design and Simulation PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download SiP System-in-Package Design and Simulation PDF full book. Access full book title SiP System-in-Package Design and Simulation by Suny Li (Li Yang). Download full books in PDF and EPUB format.
Author: Suny Li (Li Yang)
Publisher: John Wiley & Sons
ISBN: 1119046017
Category : Technology & Engineering
Languages : en
Pages : 507
Get Book Here
Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Author: Suny Li (Li Yang)
Publisher: John Wiley & Sons
ISBN: 1119046017
Category : Technology & Engineering
Languages : en
Pages : 507
Get Book Here
Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Author: Douglas Brooks
Publisher: Prentice Hall Professional
ISBN: 9780131418844
Category : Computers
Languages : en
Pages : 418
Get Book Here
Book Description
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.
Author:
Publisher: Information Gatekeepers Inc
ISBN:
Category :
Languages : en
Pages : 344
Get Book Here
Book Description
Author: Suny Li
Publisher: Springer Nature
ISBN: 9811900833
Category : Technology & Engineering
Languages : en
Pages : 867
Get Book Here
Book Description
This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Author: Mei Song Tong
Publisher: Springer Nature
ISBN: 981998307X
Category :
Languages : en
Pages : 461
Get Book Here
Book Description
Author: Mohamed Elgamel
Publisher: Springer Science & Business Media
ISBN: 0387293663
Category : Technology & Engineering
Languages : en
Pages : 145
Get Book Here
Book Description
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 152
Get Book Here
Book Description
For more than 20 years, Network World has been the premier provider of information, intelligence and insight for network and IT executives responsible for the digital nervous systems of large organizations. Readers are responsible for designing, implementing and managing the voice, data and video systems their companies use to support everything from business critical applications to employee collaboration and electronic commerce.
Author:
Publisher: Information Gatekeepers Inc
ISBN: 9781568511115
Category :
Languages : en
Pages : 540
Get Book Here
Book Description
Author: Istvan Nagy
Publisher: CRC Press
ISBN: 1040011799
Category : Computers
Languages : en
Pages : 618
Get Book Here
Book Description
This book is about how to design the most complex types of digital circuit boards used inside servers, routers and other equipment, from high-level system architecture down to the low-level signal integrity concepts. It explains common structures and subsystems that can be expanded into new designs in different markets. The book is targeted at all levels of hardware engineers. There are shorter, lower-level introductions to every topic, while the book also takes the reader all they way to the most complex and most advanced topics of digital circuit design, layout design, analysis, and hardware architecture.
Author: Thanh T. Tran
Publisher: Springer Nature
ISBN: 3031049543
Category : Technology & Engineering
Languages : en
Pages : 225
Get Book Here
Book Description
The new edition of this textbook is based on Dr. Thanh T. Tran’s 10+ years’ experience teaching high-speed digital and analog design courses at Rice University and 30+ years’ experience working in high-speed system design, including signal and power integrity in digital signal processing (DSP), computer, and embedded system. The book provides hands-on, practical instruction on high-speed digital and analog design for students and working engineers. The author first presents good high-speed digital and analog design practices that minimize both component and system noise and ensure system design success. He then presents guidelines to be used throughout the design process to reduce noise and radiation and to avoid common pitfalls while improving quality and reliability. The book is filled with tips on design and system simulation that minimize late stage redesign costs and product shipment delays. Hands-on design examples focusing on audio, video, analog filters, DDR memory, and power supplies are featured throughout. In addition, the author provides a practical approach to design multi-gigahertz high-speed serial busses (USB-C, PCIe, HDMI, DP) and simulate printed circuit board insertion and return loss using s-parameter models.
