High Performance Printed Circuit Boards PDF Download
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Author: Charles A. Harper
Publisher: McGraw Hill Professional
ISBN: 9780070267138
Category : Technology & Engineering
Languages : en
Pages : 578
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Book Description
Printed circuit boards (PCBs) and ceramic substrates are the baseline on which almost all modern microelectronics are mounted. The increase in complexity of high performance microelectronics has put great stress on PCB technologies - this volume provides data and design information for the new generation fast, dense boards and substrates. It covers microvias, built-up multilayers, and high density boards; advanced ceramic substrates; and environmentally-safe materials.
Author: Charles A. Harper
Publisher: McGraw Hill Professional
ISBN: 9780070267138
Category : Technology & Engineering
Languages : en
Pages : 578
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Book Description
Printed circuit boards (PCBs) and ceramic substrates are the baseline on which almost all modern microelectronics are mounted. The increase in complexity of high performance microelectronics has put great stress on PCB technologies - this volume provides data and design information for the new generation fast, dense boards and substrates. It covers microvias, built-up multilayers, and high density boards; advanced ceramic substrates; and environmentally-safe materials.
Author: Martin W. Jawitz
Publisher: McGraw Hill Professional
ISBN: 9780070324886
Category : Technology & Engineering
Languages : en
Pages : 792
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Book Description
Select PCB materials for top performing boards. From weaving glass fiber mats to testing finished boards, this materials database offers close-up look at how to process and fabricate PCBs. It gives you hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials.
Author: Xing-Chang Wei
Publisher: CRC Press
ISBN: 1315305852
Category : Computers
Languages : en
Pages : 251
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Book Description
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Author: Howard W. Johnson
Publisher:
ISBN: 9780133957242
Category : Technology & Engineering
Languages : en
Pages : 447
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Book Description
Focused on the field of knowledge lying between digital and analog circuit theory, this new text will help engineers working with digital systems shorten their product development cycles and help fix their latest design problems. The scope of the material covered includes signal reflection, crosstalk, and noise problems which occur in high speed digital machines (above 10 megahertz). This volume will be of practical use to digital logic designers, staff and senior communications scientists, and all those interested in digital design.
Author: Walter C. Bosshart
Publisher:
ISBN: 9780070964037
Category : Printed circuits
Languages : en
Pages : 449
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Book Description
Author: Mark I. Montrose
Publisher: John Wiley & Sons
ISBN: 0471660906
Category : Science
Languages : en
Pages : 344
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Book Description
This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid explanations, this book enablesengineers to grasp both the fundamentals of EMC theory and signalintegrity and the mitigation process needed to prevent an EMCevent. Author Montrose also shows the relationship between time andfrequency domains to help you meet mandatory compliancerequirements placed on printed circuit boards. Using real-world examples the book features: Clear discussions, without complex mathematical analysis, offlux minimization concepts Extensive analysis of capacitor usage for variousapplications Detailed examination of components characteristics with variousgrounding methodologies, including implementation techniques An in-depth study of transmission line theory A careful look at signal integrity, crosstalk, andtermination
Author:
Publisher:
ISBN:
Category : Competition, International
Languages : en
Pages : 120
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Book Description
Author: Jun-Dong Cho
Publisher: World Scientific
ISBN: 9789810223076
Category : Technology & Engineering
Languages : en
Pages : 272
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Book Description
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Author: Hanna Dodiuk
Publisher: William Andrew
ISBN: 1455731099
Category : Technology & Engineering
Languages : en
Pages : 795
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Book Description
Thermosetting plastics are a distinct category of plastics whose high performance, durability and reliability at high temperatures makes them suitable for specialty applications ranging from automotive and aerospace through to electronic packaging and consumer products (your melamine kitchen worktop is a thermoset resin!). Recent developments in thermoset plastics technology and processes has broadened their use exponentially over recent years, and these developments continue: in November 2011, French scientists created a new lightweight thermoset that is as strong and stable as previous materials yet can be easily reworked and reshaped when heated which makes it unique amongst thermosets and allows for repair and recycling. The Handbook of Thermoset Plastics, now in its Third edition, provides a comprehensive survey of the chemical processes, manufacturing techniques and design properties of each polymer, along with their applications. Written by a team of highly experienced practitioners, the practical implications of using thermoset plastics are presented – both their strengths and weaknesses. The data and descriptions presented here enable engineers, scientists and technicians to form judgments and take action on the basis of informed analysis. The aim of the book is to help the reader to make the right decision and take the correct action – avoiding the pitfalls the authors' experience has uncovered. The new edition has been updated throughout to reflect current practice in manufacturing and processing, featuring: - Case Studies to demonstrate how particular properties make different polymers suitable for different applications, as well as covering end-use and safety considerations - A new chapter on using nanoparticles to enhance thermal and mechanical properties - A new chapter describing new materials based on renewable resources (such as soy-based thermoset plastics) - A new chapter covering recent developments and potential future technologies such as new catalysts for Controlled Radical Polymerization - Goodman and Dodiuk-Kenig provide a comprehensive reference guide to the chemistry, manufacturing and applications of thermosets - Updated to include recent developments in manufacturing – from biopolymers to nanocomposites - Case Studies illustrate applications of key thermoset plastics
Author: Nihal Kularatna
Publisher: IET
ISBN: 0852969996
Category : Science
Languages : en
Pages : 677
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Book Description
A substantial update of his earlier IEE book, Modern Electronic Test and Measuring Instruments, the author provides a state-of-the art review of modern families of digital instruments. For each family he covers internal design, use and applications, highlighting their advantages and limitations from a practical application viewpoint.The book also treats new digital instrument families such as DSOs, Arbitrary Function Generators, FFT analysers and many other common systems used by the test engineers, designers and research scientists.
