High Performance Design Automation for Multi-chip Modules and Packages PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download High Performance Design Automation for Multi-chip Modules and Packages PDF full book. Access full book title High Performance Design Automation for Multi-chip Modules and Packages by Jun-Dong Cho. Download full books in PDF and EPUB format.
Author: Jun-Dong Cho
Publisher: World Scientific
ISBN: 9789810223076
Category : Technology & Engineering
Languages : en
Pages : 272
Get Book Here
Book Description
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Author: Jun-Dong Cho
Publisher: World Scientific
ISBN: 9789810223076
Category : Technology & Engineering
Languages : en
Pages : 272
Get Book Here
Book Description
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Author: Ernest S. Kuh
Publisher: World Scientific
ISBN: 9789810209254
Category : Technology & Engineering
Languages : en
Pages : 172
Get Book Here
Book Description
Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
Author: Michael Niedermayer
Publisher: Artech House
ISBN: 1608070859
Category : Technology & Engineering
Languages : en
Pages : 243
Get Book Here
Book Description
Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Written by leading experts, the book offers detailed coverage of the key topics that you need to understand for your work in the field, such as methods for cost estimation, holistic design optimization, a methodology for a cost-driven design, and applied cost optimization. This practical book focuses on fundamental cost influences rather than absolute numbers, helping you appreciate relative values which reflect the competitive advantage of the various design implementations. Moreover, you find specific recommendations on which cost-reduction methods will be most advantageous in varying situations. This forward-looking volume provides keen insight into the underlying factors which drive the current economics and determine future trends of smart microsystems.
Author: Yervant Zorian
Publisher: Springer Science & Business Media
ISBN: 1461561078
Category : Technology & Engineering
Languages : en
Pages : 161
Get Book Here
Book Description
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Author:
Publisher: Newnes
ISBN: 0080965334
Category : Technology & Engineering
Languages : en
Pages : 5485
Get Book Here
Book Description
Comprehensive Materials Processing, Thirteen Volume Set provides students and professionals with a one-stop resource consolidating and enhancing the literature of the materials processing and manufacturing universe. It provides authoritative analysis of all processes, technologies, and techniques for converting industrial materials from a raw state into finished parts or products. Assisting scientists and engineers in the selection, design, and use of materials, whether in the lab or in industry, it matches the adaptive complexity of emergent materials and processing technologies. Extensive traditional article-level academic discussion of core theories and applications is supplemented by applied case studies and advanced multimedia features. Coverage encompasses the general categories of solidification, powder, deposition, and deformation processing, and includes discussion on plant and tool design, analysis and characterization of processing techniques, high-temperatures studies, and the influence of process scale on component characteristics and behavior. Authored and reviewed by world-class academic and industrial specialists in each subject field Practical tools such as integrated case studies, user-defined process schemata, and multimedia modeling and functionality Maximizes research efficiency by collating the most important and established information in one place with integrated applets linking to relevant outside sources
Author: D. J. Dumin
Publisher: World Scientific
ISBN: 9789810248420
Category : Technology & Engineering
Languages : en
Pages : 292
Get Book Here
Book Description
Presents in summary the state of our knowledge of oxide reliability.
Author: Mysore Sriram
Publisher: Springer Science & Business Media
ISBN: 1461526825
Category : Technology & Engineering
Languages : en
Pages : 205
Get Book Here
Book Description
Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Author: Sien Chi
Publisher: World Scientific
ISBN: 9789810232979
Category : Technology & Engineering
Languages : en
Pages : 224
Get Book Here
Book Description
The electronics industry in Taiwan has shifted its emphasis from consumer- to information-based products. It is enjoying the bulk of the world market in computer motherboards, keyboards, scanners and PC monitors.Optoelectronics is a growing sub-group within information-based electronics. In addition to the established areas, other technologies such as optical storage, optical signal processing, optical switching and transmission are emerging. Research efforts at universities and research institutions are strongly supported by the official bodies of the government. The articles collected in this volume are contributed by the most active researchers in the area of optics and photonics in Taiwan. The subject areas covered such as Optical Materials, Devices and Systems are by no means representative of the breadth nor depth of optical research in Taiwan. Instead, they offer a snapshot of the ongoing work that will lead to success in the commercial world in future.
Author: Clemens C. W. Ruppel
Publisher: World Scientific
ISBN: 9810245386
Category : Technology & Engineering
Languages : en
Pages : 374
Get Book Here
Book Description
Surface acoustic wave (SAW) devices are recognized for their versatility and efficiency in controlling and processing electrical signals. This has resulted in a multitude of device concepts for a wide range of signal processing functions, such as delay lines, filters, resonators, pulse compressors, convolvers, and many more. As SAW technology has found its way into mass market products such as TV receivers, pagers, keyless entry systems and cellular phones, the production volume has risen to millions of devices produced every day. At the other end of the scale, there are specialized high performance signal processing SAW devices for satellite communication and military applications, such as radar and electronic warfare. This volume, together with Volume 2, presents an overview of recent advances in SAW technology, systems and applications by some of the foremost researchers in this exciting field.
Author: Vladimir Lumelsky
Publisher: World Scientific
ISBN: 981449271X
Category : Science
Languages : en
Pages : 146
Get Book Here
Book Description
This book covers the principles, methodology, and prototypes of sensing skin-like devices and related intelligence and software. Sensitive Skins are large-area and flexible arrays of sensors integrated onto the entire surface of machines. Sensitive Skin will endow these machines with the senses of proximity, touch, pressure, temperature, and chemical/biological agents, thus making possible the use of unsupervised machines in unstructured and unpredictable surroundings. Sensitive Skin will make machines “cautious” and thus friendly to their environment. It will revolutionize service industries, make important contributions to human prosthetics, and augment human sensing when fashioned into clothing. Being transducers producing massive data flow, Sensitive Skin devices will constitute yet another advance in the information revolution.
