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Author: Luc Martens
Publisher: Springer Science & Business Media
ISBN: 1461556236
Category : Technology & Engineering
Languages : en
Pages : 169
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Book Description
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Author: Luc Martens
Publisher: Springer Science & Business Media
ISBN: 1461556236
Category : Technology & Engineering
Languages : en
Pages : 169
Get Book
Book Description
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Author: Stephen G. Konsowski
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
Author: Ken Kuang
Publisher: Springer Science & Business Media
ISBN: 1441909842
Category : Technology & Engineering
Languages : en
Pages : 285
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Book Description
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Author: Hengyun Zhang
Publisher: Woodhead Publishing
ISBN: 0081025335
Category : Technology & Engineering
Languages : en
Pages : 436
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Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
Author: Jose Moreira
Publisher: Artech House
ISBN: 1608079864
Category : Technology & Engineering
Languages : en
Pages : 706
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Book Description
This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital testing with automated test equipment technology (ATE). Featuring clear examples, this one-stop reference covers all critical aspects of automated testing, including an introduction to high-speed digital basics, a discussion of industry standards, ATE and bench instrumentation for digital applications, and test and measurement techniques for characterization and production environment. Engineers learn how to apply automated test equipment for testing high-speed digital I/O interfaces and gain a better understanding of PCI-Express 4, 100Gb Ethernet, and MIPI while exploring the correlation between phase noise and jitter. This updated resource provides expanded material on 28/32 Gbps NRZ testing and wireless testing that are becoming increasingly more pertinent for future applications. This book explores the current trend of merging high-speed digital testing within the fields of photonic and wireless testing.
Author: Ken Kuang
Publisher: Springer
ISBN: 3319516973
Category : Technology & Engineering
Languages : en
Pages : 172
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Book Description
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Author: Vadim Issakov
Publisher: Springer Science & Business Media
ISBN: 3642135986
Category : Technology & Engineering
Languages : en
Pages : 208
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Book Description
There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the past decades. Particularly interesting are the driver assistance systems, since these can considerably reduce the number of accidents by supporting drivers’ perception of their surroundings. Many driver assistance features rely on radar-based sensors. Nowadays the commercially available automotive front-end sensors are comprised of discrete components, thus making the radar modules highly-priced and suitable for integration only in premium class vehicles. Realization of low-cost radar fro- end circuits would enable their implementation in inexpensive economy cars, c- siderably contributing to traffic safety. Cost reduction requires high-level integration of the microwave front-end c- cuitry, specifically analog and digital circuit blocks co-located on a single chip. - cent developments of silicon-based technologies, e.g. CMOS and SiGe:C bipolar, make them suitable for realization of microwave sensors. Additionally, these te- nologies offer the necessary integration capability. However, the required output power and temperature stability, necessary for automotive radar sensor products, have not yet been achieved in standard digital CMOS technologies. On the other hand, SiGe bipolar technology offers excellent high-frequency characteristics and necessary output power for automotive applications, but has lower potential for - alization of digital blocks than CMOS.
Author: National Research Council
Publisher: National Academies Press
ISBN: 030904233X
Category : Technology & Engineering
Languages : en
Pages : 154
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Book Description
Author: Francesc Moll
Publisher: Springer Science & Business Media
ISBN: 0306487195
Category : Technology & Engineering
Languages : en
Pages : 214
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Book Description
This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.
Author: Ralph Morrison
Publisher: John Wiley & Sons
ISBN: 1119183731
Category : Science
Languages : en
Pages : 224
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Book Description
Applies basic field behavior in circuit design and demonstrates how it relates to grounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design. The text covers power distribution in facilities, mixing of analog and digital circuitry, circuit board layout at high clock rates, and meeting radiation and susceptibility standards. The author examines the grounding and shielding requirements and techniques in circuit design and applies basic physics to circuit behavior. The sixth edition of this book has been updated with new material added throughout the chapters where appropriate. The presentation of the book has also been rearranged in order to reflect the current trends in the field. Grounding and Shielding: Circuits and Interference, Sixth Edition: Includes new material on vias and field control, capacitors as transmission lines, first energy sources, and high speed designs using boards with only two layers Demonstrates how circuit geometry controls performance from dc to gigahertz Examines the use of multi-shielded transformers in clean-power installations Provides effective techniques for handling noise problems in analog and digital circuits Discusses how to use conductor geometry to improve performance, limit radiation, and reduce susceptibility to all types of hardware and systems Grounding and Shielding: Circuits and Interference, Sixth Edition is an updated guide for circuit design engineers and technicians. It will also serve as a reference for engineers in the semiconductor device industry.
