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Author: Chulwoo Kim
Publisher: Springer Science & Business Media
ISBN: 3319023810
Category : Technology & Engineering
Languages : en
Pages : 94
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Book Description
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
Author: Chulwoo Kim
Publisher: Springer Science & Business Media
ISBN: 3319023810
Category : Technology & Engineering
Languages : en
Pages : 94
Get Book Here
Book Description
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
Author: Martin Schoeberl
Publisher: Springer
ISBN: 3030186563
Category : Computers
Languages : en
Pages : 337
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Book Description
This book constitutes the proceedings of the 32nd International Conference on Architecture of Computing Systems, ARCS 2019, held in Copenhagen, Denmark, in May 2019. The 24 full papers presented in this volume were carefully reviewed and selected from 40 submissions. ARCS has always been a conference attracting leading-edge research outcomes in Computer Architecture and Operating Systems, including a wide spectrum of topics ranging from embedded and real-time systems all the way to large-scale and parallel systems. The selected papers are organized in the following topical sections: Dependable systems; real-time systems; special applications; architecture; memory hierarchy; FPGA; energy awareness; NoC/SoC. The chapter 'MEMPower: Data-Aware GPU Memory Power Model' is open access under a CC BY 4.0 license at link.springer.com.
Author: Corey Gough
Publisher: Apress
ISBN: 1430266384
Category : Computers
Languages : en
Pages : 347
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Book Description
Energy Efficient Servers: Blueprints for Data Center Optimization introduces engineers and IT professionals to the power management technologies and techniques used in energy efficient servers. The book includes a deep examination of different features used in processors, memory, interconnects, I/O devices, and other platform components. It outlines the power and performance impact of these features and the role firmware and software play in initialization and control. Using examples from cloud, HPC, and enterprise environments, the book demonstrates how various power management technologies are utilized across a range of server utilization. It teaches the reader how to monitor, analyze, and optimize their environment to best suit their needs. It shares optimization techniques used by data center administrators and system optimization experts at the world’s most advanced data centers.
Author: Jose Moreira
Publisher: Artech House
ISBN: 1608079864
Category : Technology & Engineering
Languages : en
Pages : 709
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Book Description
This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital testing with automated test equipment technology (ATE). Featuring clear examples, this one-stop reference covers all critical aspects of automated testing, including an introduction to high-speed digital basics, a discussion of industry standards, ATE and bench instrumentation for digital applications, and test and measurement techniques for characterization and production environment. Engineers learn how to apply automated test equipment for testing high-speed digital I/O interfaces and gain a better understanding of PCI-Express 4, 100Gb Ethernet, and MIPI while exploring the correlation between phase noise and jitter. This updated resource provides expanded material on 28/32 Gbps NRZ testing and wireless testing that are becoming increasingly more pertinent for future applications. This book explores the current trend of merging high-speed digital testing within the fields of photonic and wireless testing.
Author: David A. Patterson
Publisher: Morgan Kaufmann
ISBN: 0128122765
Category : Computers
Languages : en
Pages : 700
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Book Description
The new RISC-V Edition of Computer Organization and Design features the RISC-V open source instruction set architecture, the first open source architecture designed to be used in modern computing environments such as cloud computing, mobile devices, and other embedded systems. With the post-PC era now upon us, Computer Organization and Design moves forward to explore this generational change with examples, exercises, and material highlighting the emergence of mobile computing and the Cloud. Updated content featuring tablet computers, Cloud infrastructure, and the x86 (cloud computing) and ARM (mobile computing devices) architectures is included. An online companion Web site provides advanced content for further study, appendices, glossary, references, and recommended reading. - Features RISC-V, the first such architecture designed to be used in modern computing environments, such as cloud computing, mobile devices, and other embedded systems - Includes relevant examples, exercises, and material highlighting the emergence of mobile computing and the cloud
Author: José M. Laginha M. Palma
Publisher: Springer Science & Business Media
ISBN: 3642193277
Category : Computers
Languages : en
Pages : 483
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Book Description
This book constitutes the thoroughly refereed post-conference proceedings of the 9th International Conference on High Performance Computing for Computational Science, VECPAR 2010, held in Berkeley, CA, USA, in June 2010. The 34 revised full papers presented together with five invited contributions were carefully selected during two rounds of reviewing and revision. The papers are organized in topical sections on linear algebra and solvers on emerging architectures, large-scale simulations, parallel and distributed computing, numerical algorithms.
Author: R. Bryant
Publisher: Springer Science & Business Media
ISBN: 3642954324
Category : Technology & Engineering
Languages : en
Pages : 435
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Book Description
The papers in this book were presented at the Third Caltech Conference on Very Large Scale Integration, held March 21-23, 1983 in Pasadena, California. The conference was organized by the Computer Science Depart ment, California Institute of Technology, and was partly supported by the Caltech Silicon Structures Project. This conference focused on the role of systematic methodologies, theoretical models, and algorithms in all phases of the design, verification, and testing of very large scale integrated circuits. The need for such disciplines has arisen as a result of the rapid progress of integrated circuit technology over the past 10 years. This progress has been driven largely by the fabrica tion technology, providing the capability to manufacture very complex elec tronic systems reliably and at low cost. At this point the capability to manufac ture very large scale integrated circuits has exceeded our capability to develop new product designs quickly, reliably, and at a reasonable cost. As a result new designs are undertaken only if the production volume will be large enough to amortize high design costs, products first appear on the market well past their announced delivery date, and reference manuals must be amended to document design flaws. Recent research in universities and in private industry has created an emerg ing science of very large scale integration.
Author: Andrew .J
Publisher: Andrew .J
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 591
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Book Description
The semiconductor market refers to the industry involved in the design, development, manufacturing, and distribution of semiconductors, which are the building blocks of electronic devices. Semiconductors are materials with electrical conductivity between that of conductors (such as metals) and insulators (such as plastics). They are primarily made of silicon, although other materials like gallium arsenide, germanium, and indium phosphide are also used. The semiconductor market has experienced significant growth over the years due to the increasing demand for electronic devices and advancements in technology. The market is driven by various factors such as the growing demand of smartphones and mobile devices, the expansion of the automotive industry, the rise of Internet of Things (IoT) devices, and the development of emerging technologies like artificial intelligence (AI), virtual reality (VR), and autonomous vehicles, etc. To sum up, the semiconductor market is a dynamic and rapidly evolving industry that plays a critical role in shaping the modern technological landscape. Its growth is driven by advancements in various sectors, and it continues to be a key enabler of innovation and technological progress. The range of individual technological elements necessary for the semiconductor industry is extensive, leading to the publication of numerous technical books across various domains. (while it is understandable that advanced technologies specific to each company are not publicly disclosed due to concerns regarding potential leaks) These publications have undeniably played a significant role in aiding professionals and students for establishing a solid foundation of knowledge. In addition to the importance of individual technologies, it is necessary to examine what final products emerge as these technologies converge. While consumer electronics such as PCs and smartphones vary, there are common aspects among the semiconductor products that constitute them. Should one seek more comprehensive materials, it often entails a costly purchase of white paper. In this book, we aim to delve into a more in-depth discussion of the semiconductor market, with an emphasis on the product perspective. To accomplish this, we will extensively draw upon various academic and market resources. Additionally, in order to foster a comprehensive understanding of the market, it is necessary to have a certain level of familiarity with technical elements. Therefore, some technical explanations alongside the discussions is provided. In this book, we primarily focus on the FAB (Fabrication) domain. This book is divided into three major parts. Part 1 provides an overview of the semiconductor market, covering the definition, significance, supply chain structure, regional characteristics, challenges, and more within the semiconductor industry. Part 2, the major portion of this book, offers a comprehensive explanation of the most widely used types of semiconductor products. Particularly high market share products, notably Microcomponents, APs, and memory semiconductors, will have separate in-depth descriptions provided in the appendix. Finally, Part 3 will outline the general process by which these products are designed, focusing on a typical perspective, up to the stage just before Foundry.
Author: Ponnuswamy Sadayappan
Publisher:
ISBN: 9788303050748
Category : Artificial intelligence
Languages : en
Pages : 0
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Book Description
This book constitutes the refereed proceedings of the 35th International Conference on High Performance Computing, ISC High Performance 2020, held in Frankfurt/Main, Germany, in June 2020.* The 27 revised full papers presented were carefully reviewed and selected from 87 submissions. The papers cover a broad range of topics such as architectures, networks & infrastructure; artificial intelligence and machine learning; data, storage & visualization; emerging technologies; HPC algorithms; HPC applications; performance modeling & measurement; programming models & systems software. *The conference was held virtually due to the COVID-19 pandemic. Chapters "Scalable Hierarchical Aggregation and Reduction Protocol (SHARP) Streaming-Aggregation Hardware Design and Evaluation", "Solving Acoustic Boundary Integral Equations Using High Performance Tile Low-Rank LU Factorization", "Scaling Genomics Data Processing with Memory-Driven Computing to Accelerate Computational Biology", "Footprint-Aware Power Capping for Hybrid Memory Based Systems", and "Pattern-Aware Staging for Hybrid Memory Systems" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
Author: Betty Prince
Publisher: John Wiley & Sons
ISBN: 1119296404
Category : Technology & Engineering
Languages : en
Pages : 346
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Book Description
A detailed, practical review of state-of-the-art implementations of memory in IoT hardware As the Internet of Things (IoT) technology continues to evolve and become increasingly common across an array of specialized and consumer product applications, the demand on engineers to design new generations of flexible, low-cost, low power embedded memories into IoT hardware becomes ever greater. This book helps them meet that demand. Coauthored by a leading international expert and multiple patent holder, this book gets engineers up to speed on state-of-the-art implementations of memory in IoT hardware. Memories for the Intelligent Internet of Things covers an array of common and cutting-edge IoT embedded memory implementations. Ultra-low-power memories for IoT devices-including plastic and polymer circuitry for specialized applications, such as medical electronics-are described. The authors explore microcontrollers with embedded memory used for smart control of a multitude of Internet devices. They also consider neuromorphic memories made in Ferroelectric RAM (FeRAM), Resistance RAM (ReRAM), and Magnetic RAM (MRAM) technologies to implement artificial intelligence (AI) for the collection, processing, and presentation of large quantities of data generated by IoT hardware. Throughout the focus is on memory technologies which are complementary metal oxide semiconductor (CMOS) compatible, including embedded floating gate and charge trapping EEPROM/Flash along with FeRAMS, FeFETs, MRAMs and ReRAMs. Provides a timely, highly practical look at state-of-the-art IoT memory implementations for an array of product applications Synthesizes basic science with original analysis of memory technologies for Internet of Things (IoT) based on the authors' extensive experience in the field Focuses on practical and timely applications throughout Features numerous illustrations, tables, application requirements, and photographs Considers memory related security issues in IoT devices Memories for the Intelligent Internet of Things is a valuable working resource for electrical engineers and engineering managers working in the electronics system and semiconductor industries. It is also an indispensable reference/text for graduate and advanced undergraduate students interested in the latest developments in integrated circuit devices and systems.
