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Author: Juan C. Nino
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 184
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, discusses advances, the current status, and future challenges in the broad area of materials integration for passive components and smart systems.
Author: Juan C. Nino
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 184
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, discusses advances, the current status, and future challenges in the broad area of materials integration for passive components and smart systems.
Author: Vasudeva P. Atluri
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 226
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Book Description
Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging.
Author: Christopher A. Bower
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 320
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Book Description
An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.
Author: E. Traversa
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 448
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Ions
Languages : en
Pages : 448
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Book Description
Author: Jürgen H. Christen
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 470
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. The topics covered in this volume, first published in 2007, include devices, defects, spintronics and magnetism, growth, optical properties and nanostructures, and doping and processing TFTs.
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
High-pressure materials research has been revolutionized in the past few years due to technological breakthroughs in the diamond anvil cell (DAC), shock wave compression, and first-principles molecular dynamic simulation (MD) methods. Pressure-induced chemistry and high-pressure synthesis of superhard materials were topics of the successful Symposium DD, High-Pressure Materials Research, held at the 1997 MRS Fall Meeting in Boston. Since then, a plethora of discoveries have been made, including new materials synthesized under high pressure, geophysical-geochemical material conversion and ionization prior to polymerization of molecular solids. Additionally, new experimental and computational techniques, such as in situ studies of materials properties and transformations using laser heating are increasingly providing a deeper insight and a few surprises for the behavior and properties of matter at elevated pressure conditions. This book provides a timely report on progress in the field. Topics include: synthesis and characterization; disordered systems; dense molecular materials; and properties under extreme conditions.
Author: Leonid Tsybeskov
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
This book focuses on advances in materials science and device applications of nanostructures composed of Si, Ge, diamond, SiGe and SiCGe. Continuous progress in the development of reproducibly grown quantum dots, wires and wells has produced a new class of functional materials and devices with characteristic dimensions less than 50nm. The broad spectrum of these devices ranges from commercially offered high-mobility transistors using strained Si to exploratory SiGe nanostructures for integrated optical interconnects and THz lasers. This book brings together researchers from chemistry, physics, biology, materials science and engineering to share and discuss both the challenges and progress towards a new generation of Si(SiGe, SiCGe)-based novel functional structures and devices. Topics include: light emission and photonic devices; Ge, SiGe and diamond nanostructures; strains, Si/Ge films and layers and Si nanocrystals.
Author: Darrel E. Dunn
Publisher:
ISBN:
Category : Radioactive waste disposal
Languages : en
Pages : 672
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Book Description
Author: Jörg Wiezorek
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 616
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Book Description
