Heat Transfer in Electronic Equipment, 1991 PDF Download
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Author: A. Ortega
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 160
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Book Description
Author: A. Ortega
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 160
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Book Description
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 870
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Book Description
Author: Ralph Remsburg
Publisher: Springer Science & Business Media
ISBN: 1441985093
Category : Technology & Engineering
Languages : en
Pages : 618
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Book Description
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Author: Ralph Remsburg
Publisher: CRC Press
ISBN: 1351835912
Category : Technology & Engineering
Languages : en
Pages : 440
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Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author: Yunus Ali Cengel
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author: Edward Hensel
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 220
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 456
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Book Description
Author: Dave S. Steinberg
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 518
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Book Description
Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Author:
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1346
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Book Description
Author: Varun Goel
Publisher: CRC Press
ISBN: 1003829589
Category : Technology & Engineering
Languages : en
Pages : 309
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Book Description
Augmentation of heat transfer is important in energy conservation and developing sustainable energy systems. This book provides the science necessary to understand the basics of heat transfer augmentation in single-phase engineering systems. It considers theory and practice including computational and experimental procedures, evaluation techniques for performance, and new trends. Several applications of augmentation methods like surface modification, introduction of vortex flow and impinging jets, opportunities of ultrasound and magnetic fields, pulsatile flows, heat exchangers, and nanofluids are provided. Details of basic phenomena and mechanisms are highlighted. Key features: Provides the fundamental science needed to understand and further develop heat transfer augmentation for future energy systems Give examples of how ultrasound and magnetic fields, vortex flow, impinging jets, surface modification and nanofluids can augment heat transfer Considers basic issues of computational and experimental methods for analysis, design, and evaluation of efficient and sustainable heat transfer It is an ideal reference text for graduate students and academic researchers working in the fields of mechanical, aerospace, industrial, manufacturing, and chemical engineering.
