Author:
Publisher:
ISBN:
Category : Fluid dynamics
Languages : en
Pages : 696
Book Description
Heat Transfer & Fluid Flow Digest
Author:
Publisher:
ISBN:
Category : Fluid dynamics
Languages : en
Pages : 696
Book Description
Publisher:
ISBN:
Category : Fluid dynamics
Languages : en
Pages : 696
Book Description
Heat and Fluid Flow
Author:
Publisher:
ISBN:
Category : Fluid dynamics
Languages : en
Pages : 246
Book Description
Publisher:
ISBN:
Category : Fluid dynamics
Languages : en
Pages : 246
Book Description
Cryogenic Helium Refrigeration for Middle and Large Powers
Author: Guy Gistau Baguer
Publisher: Springer Nature
ISBN: 3030516776
Category : Science
Languages : en
Pages : 725
Book Description
This book offers a practical introduction to helium refrigeration engineering, taking a logical and structured approach to the design, building, commissioning, operation and maintenance of refrigeration systems. It begins with a short refresher of cryogenic principles, and a review of the theory of heat exchangers, allowing the reader to understand the importance of the heat exchanger role in the various thermodynamic cycle structures. The cycles are considered from the simplest (Joule Thomson) to the most complicated ones for the very large refrigeration plants and, finally, those operating at temperatures lower than 4.5 K. The focus then turns to the operation, ability and limitations of the main components, including room temperature cycle screw compressors, heat exchangers, cryogenic expansion turbines, cryogenic centrifugal compressors and circulators. The book also describes the basic principles of process control and studies the operating situations of helium plants, with emphasis on high level efficiency. A major issue is helium purity, and the book explains why helium is polluted, how to purify it and then how to check its purity, to ensure that all components are filled with pure helium prior to starting. Although the intention of the book is not to design thermodynamic cycles, it is of interest to a designer or operator of a cryogenic system to perform some simplified calculations to get an idea of how components or systems are behaving. Throughout the book, such calculations are generally performed using Microsoft® Excel and the Gaspak® or Hepak® software.
Publisher: Springer Nature
ISBN: 3030516776
Category : Science
Languages : en
Pages : 725
Book Description
This book offers a practical introduction to helium refrigeration engineering, taking a logical and structured approach to the design, building, commissioning, operation and maintenance of refrigeration systems. It begins with a short refresher of cryogenic principles, and a review of the theory of heat exchangers, allowing the reader to understand the importance of the heat exchanger role in the various thermodynamic cycle structures. The cycles are considered from the simplest (Joule Thomson) to the most complicated ones for the very large refrigeration plants and, finally, those operating at temperatures lower than 4.5 K. The focus then turns to the operation, ability and limitations of the main components, including room temperature cycle screw compressors, heat exchangers, cryogenic expansion turbines, cryogenic centrifugal compressors and circulators. The book also describes the basic principles of process control and studies the operating situations of helium plants, with emphasis on high level efficiency. A major issue is helium purity, and the book explains why helium is polluted, how to purify it and then how to check its purity, to ensure that all components are filled with pure helium prior to starting. Although the intention of the book is not to design thermodynamic cycles, it is of interest to a designer or operator of a cryogenic system to perform some simplified calculations to get an idea of how components or systems are behaving. Throughout the book, such calculations are generally performed using Microsoft® Excel and the Gaspak® or Hepak® software.
The Engineering Digest
Author: Harwood Frost
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 746
Book Description
Each number includes section: The technical press index.
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 746
Book Description
Each number includes section: The technical press index.
Research and Technology Program Digest Flash Index
Author:
Publisher:
ISBN:
Category : Astronautics
Languages : en
Pages : 794
Book Description
Publisher:
ISBN:
Category : Astronautics
Languages : en
Pages : 794
Book Description
Heat Transfer Equipment Design
Author: R. K. Shah
Publisher: CRC Press
ISBN: 9780891167297
Category : Science
Languages : en
Pages : 1104
Book Description
Publisher: CRC Press
ISBN: 9780891167297
Category : Science
Languages : en
Pages : 1104
Book Description
Transport Phenomena In Thermal Control
Author: Guang-Jyh Hwang
Publisher: CRC Press
ISBN: 9780891168881
Category : Science
Languages : en
Pages : 822
Book Description
A collection of research papers into transport phenomena in thermal control, closely related to several important aspects of cooling technology. Articles provide overviews of current advances and details of individual technologies including electronic and turbine cooling and Marangoni convection.
Publisher: CRC Press
ISBN: 9780891168881
Category : Science
Languages : en
Pages : 822
Book Description
A collection of research papers into transport phenomena in thermal control, closely related to several important aspects of cooling technology. Articles provide overviews of current advances and details of individual technologies including electronic and turbine cooling and Marangoni convection.
The Engineering Digest
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 758
Book Description
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 758
Book Description
Fluid Flow, Heat Transfer and Boiling in Micro-Channels
Author: L. P. Yarin
Publisher: Springer Science & Business Media
ISBN: 3540787550
Category : Science
Languages : en
Pages : 487
Book Description
The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
Publisher: Springer Science & Business Media
ISBN: 3540787550
Category : Science
Languages : en
Pages : 487
Book Description
The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
New Serial Titles
Author:
Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 1720
Book Description
A union list of serials commencing publication after Dec. 31, 1949.
Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 1720
Book Description
A union list of serials commencing publication after Dec. 31, 1949.