Handbook of Thick Film Hybrid Microelectronics PDF Download
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Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Science
Languages : en
Pages : 698
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Book Description
Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Science
Languages : en
Pages : 698
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Book Description
Author: Tapan Gupta
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Science
Languages : en
Pages : 712
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Book Description
Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 1420036661
Category : Technology & Engineering
Languages : en
Pages : 2636
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Book Description
During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.
Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1420018965
Category : Technology & Engineering
Languages : en
Pages : 458
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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 660
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Book Description
Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 1420036858
Category : Technology & Engineering
Languages : en
Pages : 618
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Book Description
The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.
Author: Inder Bahl
Publisher: John Wiley & Sons
ISBN: 9780470462317
Category : Technology & Engineering
Languages : en
Pages : 696
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Book Description
A Comprehensive and Up-to-Date Treatment of RF and Microwave Transistor Amplifiers This book provides state-of-the-art coverage of RF and microwave transistor amplifiers, including low-noise, narrowband, broadband, linear, high-power, high-efficiency, and high-voltage. Topics covered include modeling, analysis, design, packaging, and thermal and fabrication considerations. Through a unique integration of theory and practice, readers will learn to solve amplifier-related design problems ranging from matching networks to biasing and stability. More than 240 problems are included to help readers test their basic amplifier and circuit design skills-and more than half of the problems feature fully worked-out solutions. With an emphasis on theory, design, and everyday applications, this book is geared toward students, teachers, scientists, and practicing engineers who are interested in broadening their knowledge of RF and microwave transistor amplifier circuit design.
Author: Relva C. Buchanan
Publisher: CRC Press
ISBN: 1482293048
Category : Technology & Engineering
Languages : en
Pages : 693
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Book Description
The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
