Handbook of Advanced Plasma Processing Techniques PDF Download
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Author: R.J. Shul
Publisher: Springer Science & Business Media
ISBN: 3642569897
Category : Technology & Engineering
Languages : en
Pages : 664
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Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Author: R.J. Shul
Publisher: Springer Science & Business Media
ISBN: 3642569897
Category : Technology & Engineering
Languages : en
Pages : 664
Get Book Here
Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Author: D. M. Mattox
Publisher: Cambridge University Press
ISBN: 0080946585
Category : Technology & Engineering
Languages : en
Pages : 947
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Book Description
This book covers all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called ""war stories"", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.
Author: Stephen M. Rossnagel
Publisher: William Andrew
ISBN: 9780815512202
Category : Reference
Languages : en
Pages : 523
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Book Description
This is a comprehensive overview of the technology of plasma-based processing, written by an outstanding group of 29 contributors.
Author: Peter M. Martin
Publisher: William Andrew
ISBN: 0815520328
Category : Technology & Engineering
Languages : en
Pages : 932
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Book Description
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
Author: Yoshinobu Kawai
Publisher: John Wiley & Sons
ISBN: 3527325441
Category : Technology & Engineering
Languages : en
Pages : 467
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Book Description
Clearly structured in five major sections on applications, this monograph covers such hot technologies as nanotechnology, solar cell technology, biomedical and clinical applications, and sustainability. Since the topic, applications and readers are highly interdisciplinary, the book bridges materials science, industrial chemistry, physics, and engineering -- making it a must-have for researchers in industry and academia, as well as those working in application-oriented plasma technology.
Author: Rory A. Wolf
Publisher: John Wiley & Sons
ISBN: 1118547551
Category : Technology & Engineering
Languages : en
Pages : 268
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Book Description
This Book's focus and intent is to impart an understanding of the practical application of atmospheric plasma for the advancement of a wide range of current and emerging technologies. The primary key feature of this book is the introduction of over thirteen years of practical experimental evidence of successful surface modifications by atmospheric plasma methods. It offers a handbook-based approach for leveraging and optimizing atmospheric plasma technologies which are currently in commercial use. It also offers a complete treatment of both basic plasma physics and industrial plasma processing with the intention of becoming a primary reference for students and professionals. The reader will learn the mechanisms which control and operate atmospheric plasma technologies and how these technologies can be leveraged to develop in-line continuous processing of a wide variety of substrates. Readers will gain an understanding of specific surface modification effects by atmospheric plasmas, and how to best characterize those modifications to optimize surface cleaning and functionalization for adhesion promotion. The book also features a series of chapters written to address practical surface modification effects of atmospheric plasmas within specific application markets, and a commercially-focused assessment of those effects.
Author: Alan G. King
Publisher: William Andrew
ISBN: 0815516339
Category : Technology & Engineering
Languages : en
Pages : 535
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Book Description
Perfect for the new technician or engineer entering the ceramics industry as well as for the ""old hand"" who needs an update on some aspect of ceramics processing, this resource provides practical laboratory-oriented answers to such typical processing problems as particle segregation, agglomeration, contamination, pressure gradients, adherence to tooling, and temperature gradients during drying and firing.The author examines the difficulties of practical testing and processing in the ceramic laboratory, such as vast differences in scale and equipment, and shows how to evaluate results taking such variables into account. Once the laboratory work is satisfactorily completed, the rest of the book explores serious issues involved in transferring technology from the lab bench to the plant floor and then to the customer. The author gives advice on dealing with real-life problems such as allocating human and capital resources and overcoming customer wariness of being first to try new procedures and processes.Each section contains practical, hands-on suggestions on performing and sometimes avoiding certain tasks, bringing to the reader key information that is at best sparsely available in the industry. As the author states, ""Laboratory skills are gained by hands-on experience. The intent of this book is to accelerate the process.""
Author: Oleg A. Popov
Publisher: Elsevier
ISBN: 0815517890
Category : Science
Languages : en
Pages : 467
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Book Description
This book describes the design, physics, and performance of high density plasma sources which have been extensively explored in low pressure plasma processing, such as plasma etching and planarization, plasma enhanced chemical vapor deposition of thin films, sputtered deposition of metals and dielectrics, epitaxial growth of silicon and GaAs, and many other applications. This is a comprehensive survey and a detailed description of most advanced high density plasma sources used in plasma processing. The book is a balanced presentation in that it gives both a theoretical treatment and practical applications. It should be of considerable interest to scientists and engineers working on plasma source design, and process development.
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 0815517432
Category : Technology & Engineering
Languages : en
Pages : 507
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Book Description
Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.
Author: Raymond L. Boxman
Publisher: William Andrew
ISBN: 0815517793
Category : Technology & Engineering
Languages : en
Pages : 775
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Book Description
This is a comprehensive text describing the basic physics and technological applications of vacuum arcs. Part I describes basic physics of the vacuum arc, beginning with a brief tutorial review of plasma and electrical discharge physics, then describes the arc ignition process, cathode and anode spots which serve as the locus for plasma generation, and resultant interelectrode plasma. Part II describes the applications of the vacuum arc for depositing thin films and coatings, refining metals, switching high power, and as sources of intense electron, ion, plasma, and x-ray beams.
