Grain Growth and Texture Evolution in Copper Thin Films PDF Download
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Author: Petra Sonnweber-Ribic
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Author: Petra Sonnweber-Ribic
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Author: Roland Carel
Publisher:
ISBN:
Category :
Languages : en
Pages : 532
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Author: U. Koester
Publisher:
ISBN:
Category :
Languages : en
Pages : 13
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Author: Eden Melody Zielinski
Publisher:
ISBN:
Category :
Languages : en
Pages : 268
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Book Description
Author: Vadim Glebovsky
Publisher: BoD – Books on Demand
ISBN: 9535121960
Category : Science
Languages : en
Pages : 224
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Book Description
The book Recrystallization in Materials Processing shows selected results obtained during the last few years by researchers worked on recrystallization-related issues. These researchers offer their knowledge from a range of scientific disciplines, such as materials science, metallurgy and pharmacology. The authors emphasize that the progress in this particular field of scientific research is possible today due to coordinated efforts of many research groups that work in materials science, chemistry, physics, pharmacology, and other sciences. Thus, it is possible to perform a detailed analysis of the scientific problem. The analysis starts from the selection of appropriate techniques and methods of characterization. It is then combined with the development of new tools in diagnostics, and it finished with physical modeling of phenomena.
Author: Xiang Yu Zhong
Publisher: Trans Tech Publications Ltd
ISBN: 303813001X
Category : Technology & Engineering
Languages : en
Pages : 4560
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Book Description
This indispensable work is the fifth in a series of international conferences devoted to advanced materials and processing. The conferences, which are held every three years, are jointly sponsored by the Chinese Society for Metals (CSM), the Japan Institute of Metals (JIM), the Korean Institute of Metals and Materials (KIM), and the Minerals, Metals and Materials Society (TMS), and organized by them in rotation. The purpose of this international conference, PRICM, is to provide a forum for the exchange of technical and scientific information, which is always of great benefit to researchers, manufacuturers and end-users.
Author: Ross Hinson
Publisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages : 97
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Book Description
The chemical ordering of FePt requires an annealing temperature>500 °C. At these temperatures, grain growth attributed to thermal annealing lowers the areal density in computer hard drives. Multiple paths have been proposed to lower the ordering temperature in order to decrease the grain growth. Ternary additions show promise as a way to lower the ordering temperature and decrease the grain growth. Though multiple studies have been conducted on the incorporation of Cu into FePt, these studies have produced contradictory results on the ordering temperature. Currently, there is no literature on the in situ growth stresses during deposition of FePtCu as a function of ordering temperature. InsituFe_44.5 Pt_51 Cu_4.5 and Fe_50 Pt_50 (for comparison) thin films were produced in order to determine how stress and ordering are affected by the incorporation of Cu. The incorporation of Cu at the amounts studied did not change the stress behavior of FePt when compared to Fe_50 Pt_50 . The addition of Cu raised the ordering temperature and had little to no effect on the grain size as compared to the Fe_50 Pt_50 . This retardation of ordering has been explained by the placement of Cu at lattice sites which minimize the bond distance to Pt and maximize the bond distance to Fe.
Author: F.J. Humphreys
Publisher: Elsevier
ISBN: 008098388X
Category : Technology & Engineering
Languages : en
Pages : 520
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Book Description
The annealing of deformed materials is of both technological importance and scientific interest. The phenomena have been most widely studied in metals, although they occur in all crystalline materials such as the natural deformation of rocks and the processing of technical ceramics. Research is mainly driven by the requirements of industry, and where appropriate, the book discusses the extent to which we are able to formulate quantitative, physically-based models which can be applied to metal-forming processes.The subjects treated in this book are all active research areas, and form a major part of at least four regular international conference series. However, there have only been two monographs published in recent times on the subject of recrystallization, the latest nearly 20 years ago. Since that time, considerable advances have been made, both in our understanding of the subject and in the techniques available to the researcher.The book covers recovery, recrystallization and grain growth in depth including specific chapters on ordered materials, two-phase alloys, annealing textures and annealing during and after hot working. Also contained are treatments of the deformed state and the structure and mobility of grain boundaries, technologically important examples and a chapter on computer simulation and modelling. The book provides a scientific treatment of the subject for researchers or students in Materials Science, Metallurgy and related disciplines, who require a more detailed coverage than is found in textbooks on physical metallurgy, and a more coherent treatment than will be found in the many conference proceedings and review articles.
Author:
Publisher:
ISBN: 9789535163961
Category :
Languages : en
Pages :
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Author: Kazuo Kondo
Publisher: Springer Science & Business Media
ISBN: 1461491762
Category : Science
Languages : en
Pages : 280
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Book Description
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
