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Author: Ian A. Grout
Publisher: Springer Science & Business Media
ISBN: 9781846280238
Category : Technology & Engineering
Languages : en
Pages : 396
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Book Description
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Author: Ian A. Grout
Publisher: Springer Science & Business Media
ISBN: 9781846280238
Category : Technology & Engineering
Languages : en
Pages : 396
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Book Description
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Author:
Publisher:
ISBN:
Category : Space vehicles
Languages : en
Pages : 502
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Book Description
Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 898
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Book Description
Author: Veena S. Chakravarthi
Publisher: Springer Nature
ISBN: 3031183630
Category : Technology & Engineering
Languages : en
Pages : 355
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Book Description
Now in a thoroughly revised second edition, this practical practitioner guide provides a comprehensive overview of the SoC design process. It explains end-to-end system on chip (SoC) design processes and includes updated coverage of design methodology, the design environment, EDA tool flow, design decisions, choice of design intellectual property (IP) cores, sign-off procedures, and design infrastructure requirements. The second edition provides new information on SOC trends and updated design cases. Coverage also includes critical advanced guidance on the latest UPF-based low power design flow, challenges of deep submicron technologies, and 3D design fundamentals, which will prepare the readers for the challenges of working at the nanotechnology scale. A Practical Approach to VLSI System on Chip (SoC) Design: A Comprehensive Guide, Second Edition provides engineers who aspire to become VLSI designers with all the necessary information and details of EDA tools. It will be a valuable professional reference for those working on VLSI design and verification portfolios in complex SoC designs
Author: Klaus Echtle
Publisher: Springer Science & Business Media
ISBN: 9783540584261
Category : Computers
Languages : en
Pages : 642
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Book Description
This book presents the proceedings of the First European Dependable Computing Conference (EDCC-1), held in Berlin, Germany, in October 1994. EDCC is the merger of two former European events on dependable computing. The volume comprises 34 refereed full papers selected from 106 submissions. The contributions address all current aspects of dependable computing and reflect the state of the art in dependable systems research and advanced applications; among the topics covered are hardware and software reliability, safety-critical and secure systems, fault-tolerance and detection, verification and validation, formal methods, hardware and software testing, and parallel and distributed systems.
Author: Manoj Sachdev
Publisher: Springer Science & Business Media
ISBN: 0387465472
Category : Technology & Engineering
Languages : en
Pages : 343
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Book Description
The 2nd edition of defect oriented testing has been extensively updated. New chapters on Functional, Parametric Defect Models and Inductive fault Analysis and Yield Engineering have been added to provide a link between defect sources and yield. The chapter on RAM testing has been updated with focus on parametric and SRAM stability testing. Similarly, newer material has been incorporated in digital fault modeling and analog testing chapters. The strength of Defect Oriented Testing for nano-Metric CMOS VLSIs lies in its industrial relevance.
Author: S. Jayanthy
Publisher: Springer
ISBN: 981132493X
Category : Technology & Engineering
Languages : en
Pages : 161
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Book Description
This book describes a variety of test generation algorithms for testing crosstalk delay faults in VLSI circuits. It introduces readers to the various crosstalk effects and describes both deterministic and simulation-based methods for testing crosstalk delay faults. The book begins with a focus on currently available crosstalk delay models, test generation algorithms for delay faults and crosstalk delay faults, before moving on to deterministic algorithms and simulation-based algorithms used to test crosstalk delay faults. Given its depth of coverage, the book will be of interest to design engineers and researchers in the field of VLSI Testing.
Author: G. Russell
Publisher: Springer Science & Business Media
ISBN: 9780747600015
Category : Computers
Languages : en
Pages : 406
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Book Description
Author: Giovanni DeMicheli
Publisher: Springer Science & Business Media
ISBN: 9789024735624
Category : Technology & Engineering
Languages : en
Pages : 668
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Book Description
Proceedings of the NATO Advanced Study Institute, L'Aquila, Italy, July 7-18, 1986
