Metrology and Diagnostic Techniques for Nanoelectronics PDF Download
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Author: Zhiyong Ma
Publisher: CRC Press
ISBN: 135173394X
Category : Science
Languages : en
Pages : 889
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Book Description
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: Zhiyong Ma
Publisher: CRC Press
ISBN: 135173394X
Category : Science
Languages : en
Pages : 889
Get Book Here
Book Description
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080228
Category : Technology & Engineering
Languages : en
Pages : 634
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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author: National Academy of Engineering
Publisher: National Academies Press
ISBN: 0309128218
Category : Medical
Languages : en
Pages : 194
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Book Description
Every year at the U.S. Frontiers of Engineering Symposium, 100 of this country's best and brightest engineers, ages 30 to 45, have an opportunity to learn from their peers about pioneering work being done in many areas of engineering. The symposium gives early career engineers working in academia, industry, and government in many different engineering disciplines an opportunity to make contacts with and learn from individuals they would not meet in the usual round of professional meetings. This networking may lead to collaborative work and facilitate the transfer of new techniques and approaches. It is hoped that the exchange of information on current developments in many fields of engineering will lead to insights that may be applicable in specific disciplines and thereby build U.S. innovative capacity. Different topics are covered each year, and, with a few exceptions, different individuals participate. The four general topics covered at the 2008 meeting were: drug delivery systems, emerging nanoelectronic devices, cognitive engineering, and countering the proliferation of weapons of mass destruction. The intent of this book is to convey the excitement of this unique meeting and to highlight cutting-edge developments in engineering research and technical work.
Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
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Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: Gustaaf van Tendeloo
Publisher: John Wiley & Sons
ISBN: 3527641874
Category : Technology & Engineering
Languages : en
Pages : 1484
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Book Description
This completely revised successor to the Handbook of Microscopy supplies in-depth coverage of all imaging technologies from the optical to the electron and scanning techniques. Adopting a twofold approach, the book firstly presents the various technologies as such, before going on to cover the materials class by class, analyzing how the different imaging methods can be successfully applied. It covers the latest developments in techniques, such as in-situ TEM, 3D imaging in TEM and SEM, as well as a broad range of material types, including metals, alloys, ceramics, polymers, semiconductors, minerals, quasicrystals, amorphous solids, among others. The volumes are divided between methods and applications, making this both a reliable reference and handbook for chemists, physicists, biologists, materials scientists and engineers, as well as graduate students and their lecturers.
Author: ASM International
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666
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Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author: Terence K. S. Wong
Publisher: Bentham Science Publishers
ISBN: 1608053598
Category : Technology & Engineering
Languages : en
Pages : 141
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Book Description
This book surveys the major and newly developed techniques for semiconductor strain metrology. Semiconductor strain metrology has emerged in recent years as a topic of great interest to researchers involved in thin film and nanoscale device characterizati
Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 3527670122
Category : Technology & Engineering
Languages : en
Pages : 484
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Book Description
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Author: Laurent Duraffourg
Publisher: John Wiley & Sons
ISBN: 1119177995
Category : Technology & Engineering
Languages : en
Pages : 212
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Book Description
This book will present the theoretical and technological elements of nanosystems. Among the different topics discussed, the authors include the electromechanical properties of NEMS, the scaling effects that give these their interesting properties for different applications and the current manufacturing processes. The authors aim to provide useful tools for future readers and will provide an accurate picture of current and future research in the field.
Author: Michael Quinten
Publisher: John Wiley & Sons
ISBN: 3527664351
Category : Science
Languages : en
Pages : 212
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Book Description
A one-stop, concise guide on determining and measuring thin film thickness by optical methods. This practical book covers the laws of electromagnetic radiation and interaction of light with matter, as well as the theory and practice of thickness measurement, and modern applications. In so doing, it shows the capabilities and opportunities of optical thickness determination and discusses the strengths and weaknesses of measurement devices along with their evaluation methods. Following an introduction to the topic, Chapter 2 presents the basics of the propagation of light and other electromagnetic radiation in space and matter. The main topic of this book, the determination of the thickness of a layer in a layer stack by measuring the spectral reflectance or transmittance, is treated in the following three chapters. The color of thin layers is discussed in chapter 6. Finally, in chapter 7, the author discusses several industrial applications of the layer thickness measurement, including high-reflection and anti-reflection coatings, photolithographic structuring of semiconductors, silicon on insulator, transparent conductive films, oxides and polymers, thin film photovoltaics, and heavily doped silicon. Aimed at industrial and academic researchers, engineers, developers and manufacturers involved in all areas of optical layer and thin optical film measurement and metrology, process control, real-time monitoring, and applications.
