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Author: Suryadevara V. Babu
Publisher:
ISBN:
Category :
Languages : en
Pages : 5126
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Book Description
Author: Suryadevara V. Babu
Publisher:
ISBN:
Category :
Languages : en
Pages : 5126
Get Book Here
Book Description
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author: Parshuram B. Zantye
Publisher:
ISBN:
Category : Chemical mechanical planarization
Languages : en
Pages :
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Book Description
ABSTRACT: Global planarization is one of the major demands of the semiconductor industry. Chemical mechanical polishing (CMP) is the planarization method of choice use to achieve the required stringent tolerances essential for successful fabrication of next generation Integrated Circuits (IC). The predominant reason for CMP defects is the shear and normal stresses during polishing to which the material is subjected. Understanding the process of CMP and factor that contribute to overall stress addition during polishing requires an approach that encompasses all the four major categories of variables, namely: a) machine parameters, b) material properties, c) polishing pad characteristics, and d) polishing slurry performance.
Author: G. Banerjee
Publisher: The Electrochemical Society
ISBN: 1566776295
Category : Science
Languages : en
Pages : 91
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Book Description
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 9¿, held during the 213th meeting of The Electrochemical Society, in Phoenix, Arizona from May 18-23, 2008.
Author: Joseph M. Steigerwald
Publisher: John Wiley & Sons
ISBN: 9780471138273
Category : Science
Languages : en
Pages : 354
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Book Description
The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Author: S. V. Babu
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 304
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: R. Rhoades
Publisher: The Electrochemical Society
ISBN: 1607687453
Category : Science
Languages : en
Pages : 93
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Book Description
Author: Yuzhuo Li
Publisher: John Wiley & Sons
ISBN: 9780470180891
Category : Technology & Engineering
Languages : en
Pages : 760
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Book Description
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Author: Andrei S. Dukhin
Publisher: Elsevier
ISBN: 0444536221
Category : Technology & Engineering
Languages : en
Pages : 518
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Book Description
Two key words define the scope of this book: 'ultrasound' and 'colloids'. Historically, there has been little real communication between practitioners in these two fields. Although there is a large body of literature devoted to ultrasound phenomenon in colloids, there is little recognition that such phenomena may be of real importance for both the development and applications of colloid science. On the other side, colloid scientists have not embraced acoustics as an important tool for characterizing colloids. The lack of any serious dialogue between these scientific fields is the biggest motivation behind this book. Covers in detail this multidisciplinary field combining acoustics, electroacoustics, colloid science, analytical chemistry and rheology Provides a bibliography with more than 1,000 references Presents theories and their experimental verification, as well as analysis of the methods and hardware pertaining to applications such as pharmaceuticals, ceramics, and polymers
