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Author: Hong Meng
Publisher: John Wiley & Sons
ISBN: 3527353593
Category : Technology & Engineering
Languages : en
Pages : 389
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Book Description
Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Author: Hong Meng
Publisher: John Wiley & Sons
ISBN: 3527353593
Category : Technology & Engineering
Languages : en
Pages : 389
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Book Description
Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Author: Haleh Ardebili
Publisher: William Andrew
ISBN: 0128119799
Category : Technology & Engineering
Languages : en
Pages : 510
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Book Description
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Author: Colin Tong
Publisher: Springer Nature
ISBN: 3030798046
Category : Technology & Engineering
Languages : en
Pages : 641
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Book Description
This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.
Author: National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics
Publisher: National Academies Press
ISBN: 9780309305914
Category : Electronic industries
Languages : en
Pages : 0
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Book Description
Flexible electronics describes circuits that can bend and stretch, enabling significant versatility in applications and the prospect of low-cost manufacturing processes. They represent an important technological advance, in terms of their performance characteristics and potential range of applications, ranging from medical care, packaging, lighting and signage, consumer electronics and alternative energy (especially solar energy.) What these technologies have in common is a dependence on efficient manufacturing that currently requires improved technology, processes, tooling, and materials, as well as ongoing research. Seeking to capture the global market opportunity in flexible electronics, major U.S. competitors have initiated dedicated programs that are large in scope and supported with significant government funding to develop and acquire these new technologies, refine them, and ultimately manufacture them within their national borders. These national and regional investments are significantly larger than U.S. investment and more weighted toward later stage applied research and development. The Flexible Electronics Opportunity examines and compares selected innovation programs both foreign and domestic, and their potential to advance the production of flexible electronics technology in the United States. This report reviews the goals, concept, structure, operation, funding levels, and evaluation of foreign programs similar to major U.S. programs, e.g., innovation awards, S&T parks, and consortia. The report describes the transition of flexible electronics research into products and to makes recommendations to improve and to develop U.S. programs. Through an examination of the role of research consortia around the world to advance flexible electronics technology, the report makes recommendations for steps that the U.S. might consider to develop a robust industry in the United States. Significant U.S. expansion in the market for flexible electronics technologies is not likely to occur in the absence of mechanisms to address investment risks, the sharing of intellectual property, and the diverse technology requirements associated with developing and manufacturing flexible electronics technologies. The Flexible Electronics Opportunity makes recommendations for collaboration among industry, universities, and government to achieve the critical levels of investment and the acceleration of new technology development that are needed to catalyze a vibrant flexible electronics industry.
Author: Mario Caironi
Publisher: John Wiley & Sons
ISBN: 3527680004
Category : Technology & Engineering
Languages : en
Pages : 592
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Book Description
From materials to applications, this ready reference covers the entire value chain from fundamentals via processing right up to devices, presenting different approaches to large-area electronics, thus enabling readers to compare materials, properties and performance. Divided into two parts, the first focuses on the materials used for the electronic functionality, covering organic and inorganic semiconductors, including vacuum and solution-processed metal-oxide semiconductors, nanomembranes and nanocrystals, as well as conductors and insulators. The second part reviews the devices and applications of large-area electronics, including flexible and ultra-high-resolution displays, light-emitting transistors, organic and inorganic photovoltaics, large-area imagers and sensors, non-volatile memories and radio-frequency identification tags. With its academic and industrial viewpoints, this volume provides in-depth knowledge for experienced researchers while also serving as a first-stop resource for those entering the field.
Author: Jun Souk
Publisher: John Wiley & Sons
ISBN: 1119161355
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
An extensive introduction to the engineering and manufacture of current and next-generation flat panel displays This book provides a broad overview of the manufacturing of flat panel displays, with a particular emphasis on the display systems at the forefront of the current mobile device revolution. It is structured to cover a broad spectrum of topics within the unifying theme of display systems manufacturing. An important theme of this book is treating displays as systems, which expands the scope beyond the technologies and manufacturing of traditional display panels (LCD and OLED) to also include key components for mobile device applications, such as flexible OLED, thin LCD backlights, as well as the manufacturing of display module assemblies. Flat Panel Display Manufacturing fills an important gap in the current book literature describing the state of the art in display manufacturing for today's displays, and looks to create a reference the development of next generation displays. The editorial team brings a broad and deep perspective on flat panel display manufacturing, with a global view spanning decades of experience at leading institutions in Japan, Korea, Taiwan, and the USA, and including direct pioneering contributions to the development of displays. The book includes a total of 24 chapters contributed by experts at leading manufacturing institutions from the global FPD industry in Korea, Japan, Taiwan, Germany, Israel, and USA. Provides an overview of the evolution of display technologies and manufacturing Treats display products as systems with manifold applications, expanding the scope beyond traditional display panel manufacturing to key components for mobile devices and TV applications Provides a detailed overview of LCD manufacturing, including panel architectures, process flows, and module manufacturing Provides a detailed overview of OLED manufacturing for both mobile and TV applications, including a chapter dedicated to the young field of flexible OLED manufacturing Provides a detailed overview of the key unit processes and corresponding manufacturing equipment, including manufacturing test & repair of TFT array panels as well as display module inspection & repair Introduces key topics in display manufacturing science and engineering, including productivity & quality, factory architectures, and green manufacturing Flat Panel Display Manufacturing will appeal to professionals and engineers in R&D departments for display-related technology development, as well as to graduates and Ph.D. students specializing in LCD/OLED/other flat panel displays.
Author: Stergios Logothetidis
Publisher: Elsevier
ISBN: 1782420436
Category : Technology & Engineering
Languages : en
Pages : 483
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Book Description
Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. - Reviews the properties and production of various flexible organic materials. - Describes the integration technologies of flexible organic electronics and their manufacturing methods. - Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.
Author: Piero Cosseddu
Publisher: Woodhead Publishing
ISBN: 012818891X
Category : Technology & Engineering
Languages : en
Pages : 666
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Book Description
Organic Electronics is a novel field of electronics that has gained an incredible attention over the past few decades. New materials, device architectures and applications have been continuously introduced by the academic and also industrial communities, and novel topics have raised strong interest in such communities, as molecular doping, thermoelectrics, bioelectronics and many others.Organic Flexible Electronics is mainly divided into three sections. The first part is focused on the fundamentals of organic electronics, such as charge transport models in these systems and new approaches for the design and synthesis of novel molecules. The first section addresses the main challenges that are still open in this field, including the important role of interfaces for achieving high-performing devices or the novel approaches employed for improving reliability issues.The second part discusses the most innovative devices which have been developed in recent years, such as devices for energy harvesting, flexible batteries, high frequency circuits, and flexible devices for tattoo electronics and bioelectronics.Finally the book reviews the most important applications moving from more standard flexible back panels to wearable and textile electronics and more futuristic applications like ingestible systems. - Reviews the fundamental properties and methods for optimizing organic electronic materials including chemical doping and techniques to address stability issues - Discusses the most promising organic electronic devices for energy, electronics, and biomedical applications - Addresses key applications of organic electronic devices in imagers, wearable electronics, bioelectronics
Author: National Research Council
Publisher: National Academies Press
ISBN: 030904233X
Category : Technology & Engineering
Languages : en
Pages : 154
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Book Description
Author: William S. Wong
Publisher: Springer Science & Business Media
ISBN: 0387743634
Category : Technology & Engineering
Languages : en
Pages : 474
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Book Description
This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.
