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Author: Matthew Pelliccione
Publisher: Springer Science & Business Media
ISBN: 0387751092
Category : Technology & Engineering
Languages : en
Pages : 206
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Book Description
The focus of this book is on modeling and simulations used in research on the morphological evolution during film growth. The authors emphasize the detailed mathematical formulation of the problem. The book will enable readers themselves to set up a computational program to investigate specific topics of interest in thin film deposition. It will benefit those working in any discipline that requires an understanding of thin film growth processes.
Author: Matthew Pelliccione
Publisher: Springer Science & Business Media
ISBN: 0387751092
Category : Technology & Engineering
Languages : en
Pages : 206
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Book Description
The focus of this book is on modeling and simulations used in research on the morphological evolution during film growth. The authors emphasize the detailed mathematical formulation of the problem. The book will enable readers themselves to set up a computational program to investigate specific topics of interest in thin film deposition. It will benefit those working in any discipline that requires an understanding of thin film growth processes.
Author: Harry A. Atwater
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 784
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Krishna Seshan
Publisher: CRC Press
ISBN: 1482269686
Category : Science
Languages : en
Pages : 658
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Book Description
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec
Author: Peter M. Martin
Publisher: William Andrew
ISBN: 0815520328
Category : Technology & Engineering
Languages : en
Pages : 932
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Book Description
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
Author: C. V. Thompson
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Sushil Kumar
Publisher: Springer Nature
ISBN: 9811561168
Category : Technology & Engineering
Languages : en
Pages : 721
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Book Description
This volume comprises the expert contributions from the invited speakers at the 17th International Conference on Thin Films (ICTF 2017), held at CSIR-NPL, New Delhi, India. Thin film research has become increasingly important over the last few decades owing to the applications in latest technologies and devices. The book focuses on current advances in thin film deposition processes and characterization including thin film measurements. The chapters cover different types of thin films like metal, dielectric, organic and inorganic, and their diverse applications across transistors, resistors, capacitors, memory elements for computers, optical filters and mirrors, sensors, solar cells, LED's, transparent conducting coatings for liquid crystal display, printed circuit board, and automobile headlamp covers. This book can be a useful reference for students, researchers as well as industry professionals by providing an up-to-date knowledge on thin films and coatings.
Author: William S. Levine
Publisher: CRC Press
ISBN: 1420073613
Category : Technology & Engineering
Languages : en
Pages : 944
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Book Description
At publication, The Control Handbook immediately became the definitive resource that engineers working with modern control systems required. Among its many accolades, that first edition was cited by the AAP as the Best Engineering Handbook of 1996. Now, 15 years later, William Levine has once again compiled the most comprehensive and authoritative resource on control engineering. He has fully reorganized the text to reflect the technical advances achieved since the last edition and has expanded its contents to include the multidisciplinary perspective that is making control engineering a critical component in so many fields. Now expanded from one to three volumes, The Control Handbook, Second Edition organizes cutting-edge contributions from more than 200 leading experts. The second volume, Control System Applications, includes 35 entirely new applications organized by subject area. Covering the design and use of control systems, this volume includes applications for: Automobiles, including PEM fuel cells Aerospace Industrial control of machines and processes Biomedical uses, including robotic surgery and drug discovery and development Electronics and communication networks Other applications are included in a section that reflects the multidisciplinary nature of control system work. These include applications for the construction of financial portfolios, earthquake response control for civil structures, quantum estimation and control, and the modeling and control of air conditioning and refrigeration systems. As with the first edition, the new edition not only stands as a record of accomplishment in control engineering but provides researchers with the means to make further advances. Progressively organized, the other two volumes in the set include: Control System Fundamentals Control System Advanced Methods
Author: Alexander D. Pogrebnjak
Publisher: Springer
ISBN: 9811361339
Category : Technology & Engineering
Languages : en
Pages : 380
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Book Description
This book highlights the latest advances in chemical and physical methods for thin-film deposition and surface engineering, including ion- and plasma-assisted processes, focusing on explaining the synthesis/processing–structure–properties relationship for a variety of thin-film systems. It covers topics such as advances in thin-film synthesis; new thin-film materials: diamond-like films, granular alloys, high-entropy alloys, oxynitrides, and intermetallic compounds; ultra-hard, wear- and oxidation-resistant and multifunctional coatings; superconducting, magnetic, semiconducting, and dielectric films; electrochemical and electroless depositions; thin-film characterization and instrumentation; and industrial applications.
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 0815517785
Category : Technology & Engineering
Languages : en
Pages : 659
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Book Description
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Author: Brian Lewis
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 518
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Book Description
