Electronic Packaging Materials Science IV: Volume 154 PDF Download
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Author: Ralph Jaccodine
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Ralph Jaccodine
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 480
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Book Description
Author: Ralph Jaccodine
Publisher: Cambridge University Press
ISBN: 9781107410398
Category : Technology & Engineering
Languages : en
Pages : 520
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Daryl Ann Doane
Publisher: Springer Science & Business Media
ISBN: 1461531004
Category : Computers
Languages : en
Pages : 895
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Book Description
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Author:
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 368
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Book Description
Author: Geraldine Cogin Shwartz
Publisher: CRC Press
ISBN: 9780849384660
Category : Technology & Engineering
Languages : en
Pages : 598
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Book Description
Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.
Author: M. Doerner
Publisher: Cambridge University Press
ISBN: 9781558990777
Category : Technology & Engineering
Languages : en
Pages : 400
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: K.L. Mittal
Publisher: CRC Press
ISBN: 9780824799250
Category : Technology & Engineering
Languages : en
Pages : 400
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Book Description
"Integrates the latest findings on metallized plastics and their far-reaching applications by more than 80 recognized experts from North America, Europe, the Middle East, and Asia. Addresses both basic and applied aspects of the subject."
Author: D. L. Anton
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 472
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Theodore Kamins
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 436
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
