Adhesives Technology for Electronic Applications PDF Download
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Author: James J. Licari
Publisher: William Andrew
ISBN: 1437778909
Category : Technology & Engineering
Languages : en
Pages : 415
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Book Description
Approx.512 pagesApprox.512 pages
Author: James J. Licari
Publisher: William Andrew
ISBN: 1437778909
Category : Technology & Engineering
Languages : en
Pages : 415
Get Book Here
Book Description
Approx.512 pagesApprox.512 pages
Author: K. M. Gupta
Publisher: John Wiley & Sons
ISBN: 111899857X
Category : Technology & Engineering
Languages : en
Pages : 672
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Book Description
This comprehensive and unique book is intended to cover the vast and fast-growing field of electrical and electronic materials and their engineering in accordance with modern developments. Basic and pre-requisite information has been included for easy transition to more complex topics. Latest developments in various fields of materials and their sciences/engineering, processing and applications have been included. Latest topics like PLZT, vacuum as insulator, fiber-optics, high temperature superconductors, smart materials, ferromagnetic semiconductors etc. are covered. Illustrations and examples encompass different engineering disciplines such as robotics, electrical, mechanical, electronics, instrumentation and control, computer, and their inter-disciplinary branches. A variety of materials ranging from iridium to garnets, microelectronics, micro alloys to memory devices, left-handed materials, advanced and futuristic materials are described in detail.
Author: L.S. Miller
Publisher: Springer Science & Business Media
ISBN: 1461538181
Category : Technology & Engineering
Languages : en
Pages : 549
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Book Description
Electronic materials are a dominant factor in many areas of modern technology. The need to understand'them is paramount; this book addresses that need. The main aim of this volume is to provide a broad unified view of electronic materials, including key aspects of their science and technology and also, in many cases, their commercial implications. It was considered important that much of the contents of such an overview should be intelligible by a broad audience of graduates and industrial scientists, and relevant to advanced undergraduate studies. It should also be up to date and even looking forward to the future. Although more extensive, and written specifically as a text, the resulting book has much in common with a short course of the same name given at Coventry Polytechnic. The interpretation of the term "electronic materials" used in this volume is a very broad one, in line with the initial aim. The principal restriction is that, with one or two minor exceptions relating to aspects of device processing, for example, the materials dealt with are all active materials. Materials such as simple insulators or simple conductors, playing only a passive role, are not singled out for consider ation. Active materials might be defined as those involved in the processing of signals in a way that depends crucially on some specific property of those materials, and the immediate question then concerns the types of signals that might be considered.
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Angus Rockett
Publisher: Springer Science & Business Media
ISBN: 0387686509
Category : Technology & Engineering
Languages : en
Pages : 629
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Book Description
This book describes semiconductors from a materials science perspective rather than from condensed matter physics or electrical engineering viewpoints. It includes discussion of current approaches to organic materials for electronic devices. It further describes the fundamental aspects of thin film nucleation and growth, and the most common physical and chemical vapor deposition techniques. Examples of the application of the concepts in each chapter to specific problems or situations are included, along with recommended readings and homework problems.
Author: Haleh Ardebili
Publisher: William Andrew
ISBN: 0128119799
Category : Technology & Engineering
Languages : en
Pages : 510
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Book Description
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Author: Wei Gao
Publisher: World Scientific
ISBN: 9814293695
Category : Technology & Engineering
Languages : en
Pages : 563
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Book Description
Presents an overview of various materials, such as conducting materials, semiconductors, magnetic materials, optical materials, dielectric materials, superconductors, thermoelectric materials and ionic materials. This title includes chapters on thin film electronic materials, organic electronic materials and nanostructured materials.
Author: Rainer Waser
Publisher: John Wiley & Sons
ISBN: 3527409270
Category : Technology & Engineering
Languages : en
Pages : 1041
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Book Description
Fachlich auf höchstem Niveau, visuell überzeugend und durchgängig farbig illustriert: Das ist die neue Auflage der praxisbewährten Einführung in spezialisierte elektronische Materialien und Bauelemente aus der Informationstechnologie. Über ein Drittel des Inhalts ist neu, alle anderen Beiträge wurden gründlich überarbeitet und aktualisiert.
Author: Hisao Ishii
Publisher: Springer
ISBN: 4431552065
Category : Science
Languages : en
Pages : 427
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Book Description
The book covers a variety of studies of organic semiconductors, from fundamental electronic states to device applications, including theoretical studies. Furthermore, innovative experimental techniques, e.g., ultrahigh sensitivity photoelectron spectroscopy, photoelectron yield spectroscopy, spin-resolved scanning tunneling microscopy (STM), and a material processing method with optical-vortex and polarization-vortex lasers, are introduced. As this book is intended to serve as a textbook for a graduate level course or as reference material for researchers in organic electronics and nanoscience from electronic states, fundamental science that is necessary to understand the research is described. It does not duplicate the books already written on organic electronics, but focuses mainly on electronic properties that arise from the nature of organic semiconductors (molecular solids). The new experimental methods introduced in this book are applicable to various materials (e.g., metals, inorganic and organic materials). Thus the book is also useful for experts working in physics, chemistry, and related engineering and industrial fields.
Author: William S. Wong
Publisher: Springer
ISBN: 9780387743622
Category : Technology & Engineering
Languages : en
Pages : 462
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Book Description
This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.
