Electronic Failure Analysis Handbook PDF Download
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Author: Perry L. Martin
Publisher: McGraw Hill Professional
ISBN: 9780070410442
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Author: Perry L. Martin
Publisher: McGraw Hill Professional
ISBN: 9780070410442
Category : Technology & Engineering
Languages : en
Pages : 770
Get Book Here
Book Description
Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Author: Abdel Salam Hamdy Makhlouf
Publisher: Butterworth-Heinemann
ISBN: 0128113960
Category : Technology & Engineering
Languages : en
Pages : 388
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Book Description
Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts
Author: Khlefa Alarbe Esaklul
Publisher: ASM International
ISBN: 9780871704955
Category : Technology & Engineering
Languages : en
Pages : 608
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Book Description
Presents more than 120 expert failure analysis case histories from industries including automotive, aerospace, utilities, oil and gas, petrochemical, biomedical, ground transportation, off-highway vehicles, and more. Volume 2 builds on the tremendous acceptance of Volume 1 by the failure analysis community. The two volumes can also be purchased as a set for a special discounted price. Learn how others have investigated and solved failures in various industries involving a wide range of failure modes, materials, and analysis techniques.
Author: V. Ramachandran
Publisher: ASM International
ISBN: 1615031057
Category : TECHNOLOGY & ENGINEERING
Languages : en
Pages : 207
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Book Description
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author: Mckeown
Publisher: CRC Press
ISBN: 9780824770334
Category : Technology & Engineering
Languages : en
Pages : 382
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Book Description
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Harold Henke
Publisher: Springer Science & Business Media
ISBN: 1447103173
Category : Computers
Languages : en
Pages : 237
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Book Description
Over the past few years the e-book has received much attention - the new generation of books can be downloaded from the Internet. Indeed, many publishing applications nowadays enable the production of electronic books. This book shows readers how to design electronic books using the book metaphor. The information presented is a culmination of the author's experience as an author and researcher. It contains valuable information gathered through user surveys, user focus groups, usability testing, and participation in industry groups and standards organisations. A definite must-have for anyone interested in the new generation of books.
Author:
Publisher:
ISBN: 9780071449632
Category : Acoustic imaging
Languages : en
Pages :
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Book Description
Author: Perry L. Martin
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776
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Book Description
Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
