Practical Reliability Of Electronic Equipment And Products PDF Download
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Author: Eugene R. Hnatek
Publisher: CRC Press
ISBN: 9780203909089
Category : Technology & Engineering
Languages : en
Pages : 472
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Book Description
Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Titu I. Bajenescu
Publisher: Springer Science & Business Media
ISBN: 3642585051
Category : Technology & Engineering
Languages : en
Pages : 547
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Book Description
This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Author: Bhargava, Cherry
Publisher: IGI Global
ISBN: 1799814661
Category : Computers
Languages : en
Pages : 330
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Book Description
In the industry of manufacturing and design, one major constraint has been enhancing operating performance using less time. As technology continues to advance, manufacturers are looking for better methods in predicting the condition and residual lifetime of electronic devices in order to save repair costs and their reputation. Intelligent systems are a solution for predicting the reliability of these components; however, there is a lack of research on the advancements of this smart technology within the manufacturing industry. AI Techniques for Reliability Prediction for Electronic Components provides emerging research exploring the theoretical and practical aspects of prediction methods using artificial intelligence and machine learning in the manufacturing field. Featuring coverage on a broad range of topics such as data collection, fault tolerance, and health prognostics, this book is ideally designed for reliability engineers, electronic engineers, researchers, scientists, students, and faculty members seeking current research on the advancement of reliability analysis using AI.
Author: Dhanasekharan Natarajan
Publisher: Springer
ISBN: 3319091115
Category : Technology & Engineering
Languages : en
Pages : 156
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Book Description
This book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable electronic equipment. Adequate information is provided for designing computerized reliability database system to support the application of the techniques by designers. Pedantic terms and the associated mathematics of reliability engineering discipline are excluded for the benefit of comprehensiveness and practical applications. This book offers excellent support for electrical and electronics engineering students and professionals, bridging academic curriculum with industrial expectations.
Author: Jonathan Swingler
Publisher: Woodhead Publishing
ISBN: 9780081029633
Category : Technology & Engineering
Languages : en
Pages : 350
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Book Description
The book charts how reliability engineering has moved from the use of sometimes arbitrary standards to an empirical scientific approach of understanding operating conditions, failure mechanisms, the need for testing for a more realistic characterisation and, new for the second edition, includes the monitoring of performance/robustness in the field. Reliability Characterisation of Electrical and Electronic Systems brings together a number of experts and key players in the discipline to concisely present the fundamentals and background to reliability theory, elaborate on the current thinking and developments behind reliability characterisation, and give a detailed account of emerging issues across a wide range of applications. The second edition has a new section titled Reliability Condition Monitoring and Prognostics for Specific Application which provides a guide to critical issues in key industrial sectors such as automotive and aerospace. There are also new chapters on areas of growing importance such as reliability methods in high-temperature electronics and reliability and testing of electric aircraft power systems. Reviews emerging areas of importance such as reliability methods in high-temperature electronics and reliability testing of electric vehicles Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing
Author: A. Christou
Publisher: Springer Science & Business Media
ISBN: 9400924828
Category : Technology & Engineering
Languages : en
Pages : 571
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Book Description
This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0125249950
Category : Materials
Languages : en
Pages : 861
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Book Description
This introductory text is intended to provide undergraduate engineering students with the background needed to understand the science of structure-property relationships, as well as address the engineering concerns of materials selection in design. A computer diskette is included.
Author: Giulio Di Giacomo
Publisher: McGraw-Hill Professional Publishing
ISBN: 9780070170247
Category : Microelectronic packaging
Languages : en
Pages : 0
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Book Description
This text looks at predicting and extending the functional life of semiconductor components. Using empirical modelling, the author covers major types of failure mechanisms that can greatly reduce the active life of semiconductor components, including interconnection fatigue and electromigration.
Author: Henry Shu-hung Chung
Publisher: IET
ISBN: 1849199019
Category : Technology & Engineering
Languages : en
Pages : 502
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Book Description
The main aims of power electronic converter systems (PECS) are to control, convert, and condition electrical power flow from one form to another through the use of solid state electronics. This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity.
Author: F. Patrick McCluskey
Publisher: CRC Press
ISBN: 1351440810
Category : Technology & Engineering
Languages : en
Pages : 341
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Book Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
